WO2021095638A1 - カバーテープおよび電子部品包装体 - Google Patents

カバーテープおよび電子部品包装体 Download PDF

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Publication number
WO2021095638A1
WO2021095638A1 PCT/JP2020/041378 JP2020041378W WO2021095638A1 WO 2021095638 A1 WO2021095638 A1 WO 2021095638A1 JP 2020041378 W JP2020041378 W JP 2020041378W WO 2021095638 A1 WO2021095638 A1 WO 2021095638A1
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WIPO (PCT)
Prior art keywords
cover tape
layer
styrene
mass
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/041378
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English (en)
French (fr)
Japanese (ja)
Inventor
祥司 上村
誠志 鈴木
徹 矢ヶ部
研太 佐々木
皓基 阿部
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Filing date
Publication date
Priority claimed from JP2020146683A external-priority patent/JP2021080024A/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to CN202080079157.1A priority Critical patent/CN114728741B/zh
Publication of WO2021095638A1 publication Critical patent/WO2021095638A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

  • the present invention relates to a cover tape and an electronic component packaging body.
  • a tape-shaped packaging material is used for packaging the electronic components so as to correspond to the mounting process on the substrate by the automatic mounting device, and the packaging material is placed on a long sheet at predetermined intervals. It is composed of a carrier tape having a plurality of concave storage pockets formed therein and a cover tape heat-sealed by the carrier tape.
  • the cover tape as a lid material is laminated on the upper surface of the carrier tape, and both ends of the cover tape are continuously heat-sealed in the length direction with a heated seal bar. It is used as an electronic component package.
  • Patent Document 1 describes a predetermined thickness from the viewpoint of obtaining a cover tape in which the peel strength is not easily affected by the peel speed and the peel strength at the time of high-speed mounting does not increase abnormally even in the conventional peel strength management method.
  • a cover tape containing a base material layer having a tensile elastic modulus, a polystyrene resin, a polyethylene resin, and a fatty acid amide, and having a heat seal layer having a predetermined thickness and a tensile elastic modulus is disclosed.
  • the sealant layer contains the following components (A) and (B), and contains the following components (A) and (B).
  • (A) Styrene-based resin (B) Poly (meth) acrylic acid derivative A cover tape having a styrene content of 15% by mass or more in the component (A) is provided.
  • Carrier tape containing electronic components and The cover tape sealed from the sealant layer on the carrier tape and Electronic component packaging is provided.
  • a cover tape having improved peel strength can be obtained.
  • the composition may contain each component alone or in combination of two or more kinds.
  • FIG. 1 schematically shows an example of a cover tape 10 (also simply referred to as “cover tape 10”) for packaging electronic components of the present embodiment.
  • cover tape 10 also simply referred to as “cover tape 10”
  • the base material layer 1, the intermediate layer 2, and the sealant layer 3 are laminated in this order. That is, the sealant layer 3 is the outermost surface and constitutes one surface of the cover tape 10, whereby it can be brought into close contact with the carrier tape 20 described later.
  • the base material layer 1, the intermediate layer 2, and the sealant layer 3 all have substantially the same width and length, and exist without breaks or divisions.
  • the cover tape 10 is used for sealing the carrier tape 20 having a pocket 21 for accommodating electronic components. That is, the sealant layer 3 in the cover tape 10 is heat-sealed so as to be in contact with the carrier tape 20.
  • the material constituting the base material layer 1 is not particularly limited. Typically, a material having sufficient mechanical strength to withstand when the cover tape 10 is manufactured, when the cover tape 10 is adhered to the carrier tape, when an external force is applied, or the like is preferable. Further, a material having heat resistance sufficient to withstand the heat when the cover tape 10 is adhered to the carrier tape is preferable.
  • the form of the material constituting the base material layer 1 is preferably in the form of a film in terms of ease of processing.
  • the material constituting the base material layer 1 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin and the like. Be done. Above all, a polyester resin is preferable from the viewpoint of improving the mechanical strength of the cover tape 10. Further, nylon 6 may be used as a material constituting the base material layer 1 from the viewpoint of improving the mechanical strength and / or flexibility of the cover tape 10. Further, the base material layer 1 may contain an additive such as a lubricant.
  • the base material layer 1 may be only one layer or may have two or more layers (for example, the base material layer 1 may be formed of a multilayer film in which the above-mentioned materials are laminated).
  • the film used for forming the base material layer 1 may be an unstretched film or a film stretched in the uniaxial direction or the biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, a film stretched in the uniaxial direction or the biaxial direction is preferable.
  • the thickness of the base material layer 1 is not particularly limited.
  • the thickness of the base material layer 1 is preferably 5 ⁇ m or more, and more preferably 10 ⁇ m or more.
  • the thickness of the base material layer 1 is preferably 50 ⁇ m or less, more preferably 40 ⁇ m or less, and further preferably 30 ⁇ m or less.
  • the rigidity of the cover tape 10 does not become too high.
  • the cover tape 10 can easily follow the deformation of the carrier tape even when a torsional stress is applied to the carrier tape after sealing. Therefore, it is possible to prevent the cover tape 10 from being unintentionally peeled off from the carrier tape.
  • the mechanical strength of the cover tape 10 can be sufficiently good. Therefore, for example, even when the cover tape 10 is peeled off from the carrier tape at high speed, it is possible to prevent the cover tape 10 from breaking.
  • the total light transmittance of the base material layer 1 is preferably 80% or more, more preferably 85% or more. By doing so, in the electronic component packaging body composed of the cover tape 10 and the carrier tape, it is possible to secure the necessary transparency to the extent that it can be inspected whether or not the electronic components are correctly housed. In other words, by setting the total light transmittance of the base material layer 1 to 80% or more, it becomes easy to visually confirm the electronic components housed inside the package composed of the cover tape 10 and the carrier tape from the outside. ..
  • the total light transmittance can be measured according to JIS-K-7361.
  • the intermediate layer 2 is located between the base material layer 1 and the sealant layer 3, and can improve the cushioning property, impact resistance, and the like of the cover tape 10.
  • Examples of the material forming the intermediate layer 2 include one or more selected from ethylene- (meth) acrylic acid ester copolymer, ethylene-vinyl acetate copolymer, polystyrene resin, and polyethylene. .. Above all, from the viewpoint of improving the cushioning property of the entire cover tape 10, it is preferable to contain an ethylene- (meth) acrylic acid ester copolymer, an ethylene-vinyl acetate copolymer, polyethylene, and a polystyrene-based resin. As the polyethylene, low density polyethylene (LDPE) or linear low density polyethylene (L-LDPE) is more preferable. Further, the intermediate layer 2 may contain various additives.
  • LDPE low density polyethylene
  • L-LDPE linear low density polyethylene
  • the thickness of the intermediate layer 2 is preferably 10 to 50 ⁇ m, more preferably 15 to 45 ⁇ m, and even more preferably 20 to 40 ⁇ m from the viewpoint of improving the cushioning property of the entire cover tape 10.
  • the sealant layer 3 contains (A) a styrene resin and (B) a (meth) acrylic acid ester polymer. As a result, good heat sealability can be obtained.
  • the styrene content in the (A) styrene-based resin is 15% by mass or more, preferably 20% by mass or more, and more preferably 30% by mass or more.
  • the upper limit of the styrene content in the (A) styrene resin is not particularly limited, but is preferably 90% by mass or less, more preferably 80% by mass, from the viewpoint of maintaining the adhesion of the sealant layer 3. It is as follows. In the cover tape 10 of the present embodiment, by setting the styrene content of the sealant layer 3 to the above lower limit value or more, the adhesion between the intermediate layer 2 and the sealant layer 3 can be improved, and the peel strength can be improved.
  • the styrene content refers to the ratio (mass%) of the structural units derived from styrene contained in (A) the styrene resin.
  • the average value of the styrene content of each is the styrene content of the (A) styrene-based resin.
  • styrene-based resin examples include (A-1) polystyrene, styrene- (meth) acrylate copolymer, styrene-olefin copolymer, hydrogenated styrene block copolymer, and impact-resistant polystyrene (HIPS; High Impact).
  • Polystyrene), styrene-based polymers such as general-purpose polystyrene resin (GPPS; General Purple Polystylene), and (A-2) styrene-based polymers, ⁇ -methylstyrene-based polymers, styrene- ( ⁇ -methylstyrene) -based copolymers.
  • Styrene-aliphatic hydrocarbon-based copolymers Styrene-aliphatic hydrocarbon-based copolymers, styrene- ( ⁇ -methylstyrene) -aliphatic hydrocarbon-based copolymers, styrene-based oligomers such as styrene-aromatic hydrocarbon-based copolymers, and the like.
  • These may be used alone or in combination of two or more.
  • the above-mentioned styrene-olefin copolymer is a copolymer having a unit derived from olefin and a unit derived from styrene.
  • the olefin include monoolefins such as ⁇ -olefins such as ethylene, propylene and butene; and diolefins (conjugated diene) such as butadiene and isoprene.
  • the polymerization mode of the styrene-olefin copolymer is not limited, but the styrene-olefin copolymer is preferably a block copolymer from the viewpoint of improving the peel strength between the cover tape 10 and the carrier tape 20.
  • styrene-olefin copolymer examples include styrene / butadiene / styrene block copolymer (SBS), styrene / ethylene / butadiene / styrene block copolymer (SEBS), and styrene / isoprene / styrene block copolymer (SIS). ), Styrene / ethylene / propylene / styrene block copolymer (SEPS) and the like.
  • SBS styrene / butadiene / styrene block copolymer
  • SEBS styrene / ethylene / butadiene / styrene block copolymer
  • SIS styrene / isoprene / styrene block copolymer
  • SEPS Styrene / ethylene / propylene
  • the styrene content in the styrene-olefin copolymer is preferably 15% by mass or more from the viewpoint of making the peel strength between the cover tape 10 and the carrier tape 20 more preferable with respect to the entire styrene-olefin copolymer. Yes, more than 20% by mass, more preferably 25% by mass or more. From the same viewpoint, the styrene content in the styrene-olefin copolymer is preferably 90% by mass or less, more preferably 85% by mass or less, based on the total styrene-olefin copolymer.
  • the content of the styrene resin (A) is preferably 5% by mass or more with respect to 100% by mass of the resin composition for forming the sealant layer 3 from the viewpoint of improving the peel strength between the cover tape 10 and the carrier tape 20. Yes, more preferably 8% by mass or more.
  • the content of the styrene-based resin (A) is preferably 90% by mass or less, more preferably 80% by mass or less, based on 100% by mass of the resin composition for forming the sealant layer 3. More preferably, it is 70% by mass or less.
  • the melt flow rate (MFR) at 200 ° C. and 5 kg is preferably 0.05 g / 10 min or more and 200 g / 10 min or less. Is 0.1 g / 10 min or more and 100 g / 10 min or less.
  • MFR melt flow rate
  • the MFR of the styrene resin (A) is measured according to JIS-K-7210 under the conditions of 200 ° C. and 5 kg.
  • the number average molecular weight is, for example, 300 or more and 5000 or less, preferably 500 or more and 3000 or less.
  • the poly (meth) acrylic acid derivative of the component (B) is either (B-1) (meth) acrylic acid or (B-2) (meth) acrylic acid ester.
  • Examples of the (meth) acrylic acid of the component (B-1) include acrylic acid and methacrylic acid.
  • Examples of the (meth) acrylic acid ester of the component (B-2) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and (meth) acrylic. Examples thereof include those using one or more selected from isobutyl acid acid, hexyl (meth) acrylate, ethylhexyl (meth) acrylate and the like.
  • the poly (meth) acrylic acid ester polymer (B) may be a copolymer with another monomer as long as it does not correspond to the above-mentioned component (A).
  • A ethylene-methyl (meth) acrylate copolymer
  • ethylene-ethyl (meth) acrylate copolymer ethylene- (meth) acrylate copolymer
  • ethylene-vinyl acetate copolymer Alternatively, it may be a copolymer containing two or more kinds.
  • the (meth) acrylic acid ester polymer contains, for example, 5% by mass or more, preferably 10% by mass or more, and more preferably 15% by mass, of structural units derived from the (meth) acrylic acid ester. It includes the above.
  • the content of the poly (meth) acrylic acid ester polymer (B) is 1% by mass or more, preferably 10% by mass or more, and more preferably 20% by mass with respect to 100% by mass of the resin composition for forming the sealant layer 3. It is mass% or more.
  • the content of the (B) poly (meth) acrylic acid ester polymer may be 100% by mass, or 98% by mass or less, based on 100% by mass of the resin composition for forming the sealant layer 3. May be good. As a result, good adhesion resistance can be obtained.
  • the content [(A) / (B)] (weight ratio) of the component (A) with respect to the content of the component (B) is preferably 0.015 or more, and more preferably 0.02 or more. preferable.
  • [(A) / (B)] (weight ratio) is preferably 5 or less, and more preferably 4 or less.
  • the sealant layer 3 may further contain the following components.
  • the sealant layer 3 may contain an antistatic agent. Thereby, the antistatic ability can be improved.
  • the antistatic agent include those containing lithium ions.
  • a polymer-type antistatic agent in which lithium ions are present in the resin can be used. As a result, excellent antistatic performance is continuously and stably exhibited.
  • Lithium ions can be contained in the antistatic agent in the form of, for example, a lithium salt.
  • lithium salt examples include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and pentafluoroethanesulfonic acid. Examples include lithium.
  • Lithium ions contained in the antistatic agent can be confirmed by measuring the amount of metal elements.
  • the amount of lithium ions contained in the antistatic agent is preferably, for example, 50 ⁇ g / g or more (50 ppm or more).
  • the antistatic agent a known antistatic agent can be used in addition to the one containing lithium ions.
  • those containing lithium ions and those not containing lithium ions can be used in combination.
  • the antistatic agent containing no lithium ion include the following. -Polymer containing a polyether structure (for example, a polyamide copolymer such as a polyether ester amide, a block polymer of a polyolefin and a polyether, a polymer composed of polyethylene ether and glycol), a carboxylic acid base-containing polymer such as potassium ionomer, a fourth Grade ammonium base-containing copolymers, etc.
  • -Metal fillers such as tin oxide, zinc oxide, and titanium oxide.
  • -Conductive polymers such as polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyacetylene, and polyaniline.
  • the amount thereof (total amount when two or more kinds are contained) is, for example, 1% by mass or more, preferably 5% by mass or more, more preferably 5% by mass or more, based on the entire sealant layer 3. It is 8% by mass or more, more preferably 10% by mass or more. Thereby, an appropriate antistatic ability can be obtained.
  • the content of the antistatic agent is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 80% by mass or less, and particularly preferably 70% by mass or less, based on the entire sealant layer 3. .
  • Antistatic agents are often expensive. Therefore, by setting the content of the antistatic agent in this way, the cost of producing the cover tape 10 can be reduced.
  • the sealant layer 3 may contain a tackifier.
  • the tackifier include petroleum resin, rosin resin, terpene resin, styrene resin, and kumaron-inden resin. Of these, petroleum resin and styrene resin are preferable because of the difficulty of adhering electronic components, heat-sealing property to carrier tape, gas barrier property, and the like.
  • the petroleum resin-based tackifier include aliphatic petroleum resins, aromatic petroleum resins, and aliphatic aromatic copolymer petroleum resins. Commercially available products include hydrogenated petroleum resin manufactured by Arakawa Chemical Industry Co., Ltd. and the trade name "Arcon" series.
  • the sealant layer 3 contains a pressure-sensitive adhesive
  • the lower limit of the content of the pressure-sensitive adhesive with respect to the entire sealant layer 3 is preferably 0.5% by mass or more from the viewpoint of making the sealing strength with the carrier tape suitable. More, more preferably 1% by mass or more.
  • the upper limit of the content of the tackifier to the entire sealant layer is, for example, 5% by mass or less, specifically 4% by mass or less, from the viewpoint of difficulty in adhering electronic components and heat-sealing property to the carrier tape. Is.
  • the sealant layer 3 contains anti-blocking agents, slip agents, lubricants, plasticizers, antioxidants, UV absorbers, colorants, surfactants, and inorganic substances, as long as the characteristics are not impaired. It may contain any additive such as a filler. And / or, the surface of the sealant layer 3 may be subjected to these coating treatments.
  • anti-blocking agents examples include silica and aluminosilicates (zeolites, etc.). By containing the anti-blocking agent in the sealant layer 3, blocking of the sealant layer 3 is alleviated.
  • slip agents include palmitate amide, stearate amide, behenic acid amide, oleic acid amide, erucic acid amide, oleyl palmido amide, stearyl palmido amide, methylene bisstearyl amide, methylene bisoleyl amide, ethylene bisoleyl amide, Examples thereof include various amides such as ethylene biserkaic acid amides, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, and hydrogenated castor oil.
  • processability such as extrusion processing, roll-off property, film slip property and the like are improved.
  • the amount of other additive components in the sealant layer 3 may be appropriately adjusted according to the purpose of addition. Typically, it may be adjusted in the range of about 0.01 to 10% by mass with respect to the entire sealant layer 3.
  • the thickness of the sealant layer 3 is, for example, 0.01 to 30 ⁇ m, preferably 0.02 to 20 ⁇ m, more preferably 0.05 to 10 ⁇ m, and even more preferably 0.1 to 5 ⁇ m.
  • the thickness of the sealant layer 3 is 0.01 ⁇ m or more, sufficient sealing properties can be ensured.
  • the thickness of the sealant layer 3 is 30 ⁇ m or less, the rigidity of the cover tape 10 does not become too high. As a result, the cover tape 10 can easily follow the deformation of the carrier tape even when a torsional stress is applied to the carrier tape after sealing. Therefore, it is possible to prevent the cover tape 10 from being unintentionally peeled off from the carrier tape.
  • the thickness of the sealant layer 3 is preferably 0.001 to 0.05, more preferably 0.002 to 0.03, based on the thickness of the entire cover tape 10.
  • the cover tape 10 may include additional layers in addition to the above-mentioned layers.
  • a reinforcing layer for increasing the mechanical strength of the cover tape 10 may be provided, or an adhesive layer may be present between the base material layer 1 and the intermediate layer 2 and / or between the intermediate layer 2 and the sealant layer 3. May be good.
  • the cover tape 10 may further include a reinforcing layer 4 at an arbitrary position on the surface of the sealant layer 3 on the intermediate layer 2 side (see FIG. 3). By providing the reinforcing layer 4, the mechanical strength of the cover tape 10 can be further increased.
  • the material constituting the reinforcing layer 4 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin and the like. Be done. Above all, a polyester resin is preferable from the viewpoint of improving the mechanical strength of the cover tape 10. Further, from the viewpoint of improving the mechanical strength and / or flexibility of the cover tape 10, a polyamide resin, particularly nylon 6, may be used as a material constituting the reinforcing layer 4. Further, the reinforcing layer 4 may contain an additive such as a lubricant.
  • the reinforcing layer 4 may be located at any position as long as it is on the surface of the sealant layer 3 on the intermediate layer 2 side. In the cover tape shown in FIG. 3, the reinforcing layer 4 is located between the base material layer 1 and the intermediate layer 2, but the present invention is not limited to this.
  • the reinforcing layer 4 may be on the surface of the base material layer 1 opposite to the surface on the intermediate layer 2 side.
  • the reinforcing layer 4 may be only one layer or may have two or more layers (for example, the reinforcing layer 4 may be formed of a multilayer film in which the above-mentioned materials are laminated).
  • the film used for forming the reinforcing layer 4 may be an unstretched film or a film stretched in the uniaxial direction or the biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, a film stretched in the uniaxial direction or the biaxial direction is preferable.
  • the thickness of the reinforcing layer 4 is not particularly limited.
  • the thickness of the reinforcing layer 4 is preferably 5 ⁇ m or more, and more preferably 10 ⁇ m or more.
  • the thickness of the reinforcing layer 4 is preferably 50 ⁇ m or less, more preferably 40 ⁇ m or less, and further preferably 30 ⁇ m or less.
  • the rigidity of the cover tape 10 does not become too high.
  • the cover tape 10 can easily follow the deformation of the carrier tape even when a torsional stress is applied to the carrier tape after sealing. Therefore, it is possible to prevent the cover tape 10 from being unintentionally peeled off from the carrier tape.
  • the thickness of the reinforcing layer 4 is 5 ⁇ m or more, the mechanical strength of the cover tape 10 can be sufficiently good. Therefore, for example, even when the cover tape 10 is peeled off from the carrier tape at high speed, it is possible to prevent the cover tape 10 from breaking.
  • the thickness of the reinforcing layer 4 may be the same as the thickness of the base material layer 1, but from the viewpoint of effectively increasing the strength, it is preferably thicker than the base material layer 1.
  • the total light transmittance of the reinforcing layer 4 is preferably 80% or more, and more preferably 85% or more. By doing so, in the electronic component packaging body composed of the cover tape 10 and the carrier tape, it is possible to secure the necessary transparency to the extent that it can be inspected whether or not the electronic components are correctly housed. In other words, by setting the total light transmittance of the reinforcing layer 4 to 80% or more, it becomes easy to visually confirm the electronic components housed inside the package including the cover tape 10 and the carrier tape from the outside.
  • the total light transmittance can be measured according to JIS-K-7361.
  • Adhesive layer As the material for forming the adhesive layer, for example, various known solvent-based or water-based anchor coating agents can be used. More specific examples of the anchor coating agent include isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based ones.
  • corona treatment or plasma treatment By performing corona treatment or plasma treatment on the base material layer 1, the adhesion between the base material layer 1 and other layers can be improved.
  • This corona treatment or plasma treatment may be performed by appropriately selecting known conditions.
  • cover tape 10 for packaging electronic components of the present embodiment may include a conductive layer (antistatic layer) in addition to the base material layer 1, the intermediate layer 2, and the sealant layer 3.
  • the thickness of the cover tape 10 is appropriately set, but is preferably 20 to 80 ⁇ m, more preferably 25 to 70 ⁇ m.
  • the width and length of the cover tape 10 can be appropriately set mainly according to the width and length of the carrier tape. Typically, the width of the cover tape 10 is about 1 to 100 mm, and the length is about 100 to 30,000 m.
  • the method for manufacturing the cover tape 10 of the present embodiment is not particularly limited. For example, it can be produced by applying a known extrusion method, laminating method, coating method or the like. As an example, the cover tape 10 of the present embodiment can be manufactured by an extrusion laminating method.
  • the cover tape 10 of the present embodiment can be manufactured by the following procedures (1) to (4).
  • (1) A film corresponding to the base material layer 1 is prepared.
  • (2) A laminating agent is applied to one side of the film prepared in (1), and a layer corresponding to the intermediate layer 2 is formed on the film by an extrusion laminating method.
  • a film having a two-layer structure of the base material layer 1 and the intermediate layer 2 is obtained.
  • (3) A layer corresponding to the sealant layer 3 is formed on the surface of the two-layered film of (2) where the intermediate layer 2 is exposed by a gravure coating method.
  • (4) If necessary, the obtained three-layer film is cut to an appropriate length and width.
  • a molten resin material is formed on one side of the film corresponding to the base material layer 1.
  • the resin material include the resins listed in the above [Intermediate layer 2] column and various additives.
  • the resin material contains two or more kinds of materials, it is preferable that the resin materials are appropriately mixed (in a molten state) before film formation.
  • the extrusion temperature in the step (2) may be adjusted as appropriate. For example, it can be adjusted between 150 and 350 ° C.
  • the electronic component package 100 can be obtained from the cover tape 10 described above and the carrier tape 20 in which the electronic components are housed in the pockets 21 (recesses). This will be described with reference to FIG.
  • the cover tape 10 is used as a lid material for a strip-shaped carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of an electronic component. Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20.
  • the structure obtained by adhering the cover tape 10 and the carrier tape 20 will be referred to as an electronic component packaging body 100.
  • the electronic component package 100 can be manufactured, for example, by the following procedure. First, the electronic components are housed in the pocket 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 is brought into contact with the carrier tape 20 (that is, the heat seal is performed so that the “back surface” of the cover tape 10 in FIG. 2 is the sealant layer 3). By doing so, a structure (electronic component package 100) in which electronic components are hermetically housed can be obtained.
  • the specific method and conditions of the heat seal are not particularly limited as long as the cover tape 10 adheres sufficiently strongly to the carrier tape 20. Typically, a known taping machine can be used, and the temperature can be set in the range of 100 to 240 ° C., a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.
  • the material of the carrier tape 20 is not particularly limited as long as the cover tape 10 can be adhered by heat sealing, but is made of a resin such as a material containing polystyrene resin, a material containing polycarbonate resin, a material containing polyethylene terephthalate resin, or paper. Can be mentioned. Among them, it is preferably made of resin from the viewpoint of effectively improving the peel strength.
  • the electronic component package 100 is wound on a reel, for example, and then transported to a work area where electronic components are mounted on an electronic circuit board or the like.
  • the material of the reel can be metal, paper, plastic, or the like.
  • the cover tape 10 is peeled off from the carrier tape 20 and the contained electronic component is taken out.
  • the electronic components housed in the electronic component packaging body 100 are not particularly limited. Examples of all parts used in the manufacture of electrical and electronic equipment such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes can be mentioned.
  • A450A (C) Antistatic agent-Tin oxide (T-1 manufactured by Mitsubishi Materials Corporation) [Middle layer] ⁇ Sumitomo Chemical Co., Ltd., "Sumikasen L705" low density polyethylene (LDPE) -Mitsui-DuPont Polychemical Co., Ltd., "Elvalois AC1820” EMA (ethylene-methyl acrylate copolymer resin) [Reinforcing layer] -Biaxially stretched polyester film (Toyobo Co., Ltd., product name: E5202) -Biaxially stretched polyamide film (Toyobo Co., Ltd., trade name: N1202)
  • Example 11 A biaxially stretched polyester film having a film thickness of 12 ⁇ m (Toyobo Co., Ltd., trade name: T6140) was used as the base material layer, and a laminating agent (Mitsui Chemicals Co., Ltd., Takelac A-520) was applied thereto and shown in Table 1.
  • An intermediate layer (thickness 40 ⁇ m) was formed on the base material layer by laminating the resin as a raw material of the intermediate layer by an extrusion laminating method (extrusion temperature: 280 ° C.).
  • the sealant layer composed of (B) was formed into a film having a film thickness of 0.5 ⁇ m by a gravure coating method.
  • Example 12 A biaxially stretched polyester film having a film thickness of 12 ⁇ m (Toyobo Co., Ltd., trade name: T6140) was used as the base material layer, and a laminating agent (Mitsui Chemicals Co., Ltd., Takelac A-520) was applied thereto and shown in Table 1.
  • a reinforcing layer (thickness 16 ⁇ m) was formed on the base material layer by laminating a film to be a reinforcing layer by a dry laminating method. Further, a laminating agent (Takelac A-520 manufactured by Mitsui Chemicals, Inc.) was added thereto.
  • An intermediate layer (thickness 25 ⁇ m) was formed on the reinforcing layer by coating and laminating the resin as a raw material of the intermediate layer shown in Table 1 by an extrusion laminating method (extrusion temperature: 280 ° C.).
  • an extrusion laminating method extrusion temperature: 280 ° C.
  • 60% by mass (C) antistatic agent and 40% by mass of the formulation ((A) / (B)) shown in Table 1 are used to form the components (A) and the components.
  • the sealant layer composed of (B) was formed into a film having a film thickness of 0.5 ⁇ m by a gravure coating method.
  • Example 13 A biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) having a film thickness of 12 ⁇ m was used as the base material layer, and a laminating agent (Mitsui Chemicals Co., Ltd., Takelac A-520) was applied thereto, and Table 1 shows.
  • a reinforcing layer (thickness 15 ⁇ m) was formed on the base material layer by laminating the films to be the reinforcing layers shown by the dry laminating method.
  • a laminating agent (Takelac A-520 manufactured by Mitsui Chemicals, Inc.) is applied on top of this, and the resin used as the raw material for the intermediate layer shown in Table 1 is laminated by an extrusion laminating method (extrusion temperature: 280 ° C.). An intermediate layer (thickness 25 ⁇ m) was formed on the reinforcing layer.
  • 60% by mass (C) antistatic agent and 40% by mass of the formulation ((A) / (B)) shown in Table 1 are used to form the components (A) and the components.
  • the sealant layer composed of (B) was formed into a film having a film thickness of 0.5 ⁇ m by a gravure coating method.
  • the peel strength was evaluated according to a peel test conforming to JIS C 0806-3.
  • the cover tape obtained by the above method has a width of 9.5 mm, and a carrier tape having a width of 12 mm (conductive polystyrene carrier tape, "CEL-E980A” manufactured by Sumitomo Bakelite Co., Ltd.) has a heat seal temperature of 180 ° C.
  • the sample was prepared by heat-sealing using a heat-sealing machine under the conditions of iron size 0.4 mm width ⁇ 32 mm length, 2 rows, 4 times striking, a load of 1 kg, and a sealing time of 100 ms.
  • the peel strength (gf) when the cover tape was peeled from the carrier tape was measured under the conditions of a peeling speed of 300 mm / min, a peeling angle of 170 °, and a peeling time of 10 seconds.
  • Base material layer 1 Base material layer 2 Intermediate layer 3 Sealant layer 4 Reinforcing layer 10 Cover tape 20 Carrier tape 21 Pocket 100 Electronic component packaging.

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
PCT/JP2020/041378 2019-11-15 2020-11-05 カバーテープおよび電子部品包装体 Ceased WO2021095638A1 (ja)

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WO2023054158A1 (ja) * 2021-09-28 2023-04-06 住友ベークライト株式会社 カバーテープおよび電子部品包装体
TWI905454B (zh) 2021-09-28 2025-11-21 日商住友電木股份有限公司 蓋帶及電子零件包裝體

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JP2023147816A (ja) * 2022-03-30 2023-10-13 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
TWI832291B (zh) * 2022-06-15 2024-02-11 南亞塑膠工業股份有限公司 保護膠帶及晶圓的加工方法

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JP2005082162A (ja) * 2003-09-05 2005-03-31 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP2016182989A (ja) * 2015-03-27 2016-10-20 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体
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TWI905454B (zh) 2021-09-28 2025-11-21 日商住友電木股份有限公司 蓋帶及電子零件包裝體

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