JP7544680B2 - カバーテープおよび電子部品包装体 - Google Patents

カバーテープおよび電子部品包装体 Download PDF

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Publication number
JP7544680B2
JP7544680B2 JP2021167983A JP2021167983A JP7544680B2 JP 7544680 B2 JP7544680 B2 JP 7544680B2 JP 2021167983 A JP2021167983 A JP 2021167983A JP 2021167983 A JP2021167983 A JP 2021167983A JP 7544680 B2 JP7544680 B2 JP 7544680B2
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JP
Japan
Prior art keywords
cover tape
layer
styrene
meth
sealant layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021167983A
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English (en)
Japanese (ja)
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JP2022009083A (ja
JP2022009083A5 (enExample
Inventor
祥司 上村
誠志 鈴木
徹 矢ヶ部
研太 佐々木
皓基 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020146683A external-priority patent/JP2021080024A/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JP2022009083A publication Critical patent/JP2022009083A/ja
Publication of JP2022009083A5 publication Critical patent/JP2022009083A5/ja
Priority to JP2022196912A priority Critical patent/JP2023027234A/ja
Application granted granted Critical
Publication of JP7544680B2 publication Critical patent/JP7544680B2/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
JP2021167983A 2019-11-15 2021-10-13 カバーテープおよび電子部品包装体 Active JP7544680B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022196912A JP2023027234A (ja) 2019-11-15 2022-12-09 カバーテープおよび電子部品包装体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019207149 2019-11-15
JP2019207149 2019-11-15
JP2020146683A JP2021080024A (ja) 2019-11-15 2020-09-01 カバーテープおよび電子部品包装体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020146683A Division JP2021080024A (ja) 2019-11-15 2020-09-01 カバーテープおよび電子部品包装体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022196912A Division JP2023027234A (ja) 2019-11-15 2022-12-09 カバーテープおよび電子部品包装体

Publications (3)

Publication Number Publication Date
JP2022009083A JP2022009083A (ja) 2022-01-14
JP2022009083A5 JP2022009083A5 (enExample) 2022-05-12
JP7544680B2 true JP7544680B2 (ja) 2024-09-03

Family

ID=75911991

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021167983A Active JP7544680B2 (ja) 2019-11-15 2021-10-13 カバーテープおよび電子部品包装体
JP2022196912A Withdrawn JP2023027234A (ja) 2019-11-15 2022-12-09 カバーテープおよび電子部品包装体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022196912A Withdrawn JP2023027234A (ja) 2019-11-15 2022-12-09 カバーテープおよび電子部品包装体

Country Status (3)

Country Link
JP (2) JP7544680B2 (enExample)
CN (1) CN114728741B (enExample)
WO (1) WO2021095638A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054158A1 (ja) * 2021-09-28 2023-04-06 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP2023147816A (ja) * 2022-03-30 2023-10-13 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
TWI832291B (zh) 2022-06-15 2024-02-11 南亞塑膠工業股份有限公司 保護膠帶及晶圓的加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010173673A (ja) 2009-01-28 2010-08-12 Denki Kagaku Kogyo Kk カバーフィルム
JP2014115038A (ja) 2012-12-11 2014-06-26 Mitsubishi Electric Corp 冷蔵庫
JP2019156405A (ja) 2018-03-07 2019-09-19 住友ベークライト株式会社 カバーテープおよび電子部品包装体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004115038A (ja) * 2002-09-25 2004-04-15 Toppan Printing Co Ltd 蓋用積層成形材料及びそれを用いた蓋
JP2005082162A (ja) * 2003-09-05 2005-03-31 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
WO2015005330A1 (ja) * 2013-07-09 2015-01-15 住友ベークライト株式会社 電子部品包装用カバーテープ
JP2016182989A (ja) * 2015-03-27 2016-10-20 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体
MY174235A (en) * 2016-09-28 2020-04-01 Sumitomo Bakelite Co Resin composition, cover tape, and electronic component package
JP7261537B2 (ja) * 2016-12-02 2023-04-20 大日本印刷株式会社 透明導電性カバーテープ
WO2018101295A1 (ja) * 2016-12-02 2018-06-07 大日本印刷株式会社 透明導電性カバーテープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010173673A (ja) 2009-01-28 2010-08-12 Denki Kagaku Kogyo Kk カバーフィルム
JP2014115038A (ja) 2012-12-11 2014-06-26 Mitsubishi Electric Corp 冷蔵庫
JP2019156405A (ja) 2018-03-07 2019-09-19 住友ベークライト株式会社 カバーテープおよび電子部品包装体

Also Published As

Publication number Publication date
JP2022009083A (ja) 2022-01-14
CN114728741B (zh) 2025-04-08
JP2023027234A (ja) 2023-03-01
WO2021095638A1 (ja) 2021-05-20
CN114728741A (zh) 2022-07-08

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