CN114026686A - 半导体装置及车辆 - Google Patents

半导体装置及车辆 Download PDF

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Publication number
CN114026686A
CN114026686A CN202080047450.XA CN202080047450A CN114026686A CN 114026686 A CN114026686 A CN 114026686A CN 202080047450 A CN202080047450 A CN 202080047450A CN 114026686 A CN114026686 A CN 114026686A
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Prior art keywords
circuit pattern
main circuit
semiconductor chip
mounting portion
slit
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Pending
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CN202080047450.XA
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English (en)
Chinese (zh)
Inventor
玉井雄大
乡原広道
山田教文
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Publication of CN114026686A publication Critical patent/CN114026686A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • C—CHEMISTRY; METALLURGY
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • H10W40/00—Arrangements for thermal protection or thermal control
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    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
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    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
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    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
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    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/521—Structures or relative sizes of bond wires
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    • H10W72/531—Shapes of wire connectors
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    • H10W72/874—On different surfaces
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202080047450.XA 2020-01-10 2020-11-25 半导体装置及车辆 Pending CN114026686A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-003125 2020-01-10
JP2020003125 2020-01-10
PCT/JP2020/043753 WO2021140765A1 (ja) 2020-01-10 2020-11-25 半導体装置および車両

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CN114026686A true CN114026686A (zh) 2022-02-08

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US (1) US12087655B2 (https=)
JP (1) JP7120475B2 (https=)
CN (1) CN114026686A (https=)
WO (1) WO2021140765A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4439649A1 (en) * 2023-03-29 2024-10-02 Infineon Technologies AG Substrate arrangement
EP4657517A1 (de) * 2024-05-29 2025-12-03 Siemens Aktiengesellschaft Leistungshalbleiteranordnung mit einem leistungshalbleiterelement und einem substrat

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JPH0710939U (ja) * 1993-07-28 1995-02-14 サンケン電気株式会社 回路基板を有する半導体装置
CN102196713A (zh) * 2010-03-17 2011-09-21 日立汽车系统株式会社 机动车用电子控制装置
CN103620769A (zh) * 2012-03-14 2014-03-05 松下电器产业株式会社 半导体装置
US20160322274A1 (en) * 2014-07-18 2016-11-03 Fuji Electric Co., Ltd. Semiconductor device
JP2017103290A (ja) * 2015-11-30 2017-06-08 株式会社日立製作所 半導体装置およびその製造方法、パワーモジュール並びに車両
CN108476590A (zh) * 2016-03-04 2018-08-31 日立汽车系统株式会社 树脂封固型车载控制装置
CN109564908A (zh) * 2017-02-13 2019-04-02 富士电机株式会社 半导体装置以及半导体装置的制造方法

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JP5953790B2 (ja) 2011-10-12 2016-07-20 富士電機株式会社 半導体装置及び半導体装置の製造方法
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JP6724449B2 (ja) 2016-03-18 2020-07-15 富士電機株式会社 半導体装置および半導体装置の製造方法
JP6665664B2 (ja) 2016-04-27 2020-03-13 富士電機株式会社 半導体装置及びその製造方法
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JP6801605B2 (ja) * 2017-08-11 2020-12-16 株式会社デンソー 電力変換装置
JP7147859B2 (ja) * 2018-10-05 2022-10-05 富士電機株式会社 半導体装置、半導体モジュールおよび車両
TWI716075B (zh) * 2019-08-19 2021-01-11 尼克森微電子股份有限公司 功率模組
JP7001186B1 (ja) * 2021-03-18 2022-01-19 富士電機株式会社 半導体装置、半導体モジュール、車両、および、半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710939U (ja) * 1993-07-28 1995-02-14 サンケン電気株式会社 回路基板を有する半導体装置
CN102196713A (zh) * 2010-03-17 2011-09-21 日立汽车系统株式会社 机动车用电子控制装置
CN103620769A (zh) * 2012-03-14 2014-03-05 松下电器产业株式会社 半导体装置
US20160322274A1 (en) * 2014-07-18 2016-11-03 Fuji Electric Co., Ltd. Semiconductor device
JP2017103290A (ja) * 2015-11-30 2017-06-08 株式会社日立製作所 半導体装置およびその製造方法、パワーモジュール並びに車両
CN108476590A (zh) * 2016-03-04 2018-08-31 日立汽车系统株式会社 树脂封固型车载控制装置
CN109564908A (zh) * 2017-02-13 2019-04-02 富士电机株式会社 半导体装置以及半导体装置的制造方法

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US12087655B2 (en) 2024-09-10
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JP7120475B2 (ja) 2022-08-17
WO2021140765A1 (ja) 2021-07-15

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