CN113812217B - 布线电路基板 - Google Patents

布线电路基板

Info

Publication number
CN113812217B
CN113812217B CN202080034913.9A CN202080034913A CN113812217B CN 113812217 B CN113812217 B CN 113812217B CN 202080034913 A CN202080034913 A CN 202080034913A CN 113812217 B CN113812217 B CN 113812217B
Authority
CN
China
Prior art keywords
layer
terminal
ground wire
forming
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080034913.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN113812217A (zh
Inventor
滝本显也
柴田直树
高仓隼人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN113812217A publication Critical patent/CN113812217A/zh
Application granted granted Critical
Publication of CN113812217B publication Critical patent/CN113812217B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CN202080034913.9A 2019-05-16 2020-04-08 布线电路基板 Active CN113812217B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019092725A JP6944971B2 (ja) 2019-05-16 2019-05-16 配線回路基板
JP2019-092725 2019-05-16
PCT/JP2020/015871 WO2020230487A1 (ja) 2019-05-16 2020-04-08 配線回路基板

Publications (2)

Publication Number Publication Date
CN113812217A CN113812217A (zh) 2021-12-17
CN113812217B true CN113812217B (zh) 2026-04-17

Family

ID=73222089

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080034913.9A Active CN113812217B (zh) 2019-05-16 2020-04-08 布线电路基板

Country Status (6)

Country Link
US (1) US12317424B2 (https=)
JP (2) JP6944971B2 (https=)
KR (1) KR102814975B1 (https=)
CN (1) CN113812217B (https=)
TW (1) TWI860358B (https=)
WO (1) WO2020230487A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022113612A1 (ja) * 2020-11-25 2022-06-02 日東電工株式会社 配線回路基板
US11653455B2 (en) * 2021-02-26 2023-05-16 Nvidia Corporation Electroplating edge connector pins of printed circuit boards without using tie bars
TWI833405B (zh) * 2022-10-27 2024-02-21 先豐通訊股份有限公司 具有差厚線路層之電路板及其製造方法
JP2024072216A (ja) * 2022-11-15 2024-05-27 日東電工株式会社 配線回路基板
JP2024122426A (ja) 2023-02-28 2024-09-09 日東電工株式会社 配線回路基板
JP2025187710A (ja) 2024-06-14 2025-12-25 日東電工株式会社 配線回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562170A (zh) * 2008-04-14 2009-10-21 日东电工株式会社 带电路的悬挂基板及其制造方法
JP2013214763A (ja) * 2013-06-21 2013-10-17 Nitto Denko Corp 配線回路基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209918A (ja) 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
JP2002020898A (ja) 2000-07-07 2002-01-23 Nitto Denko Corp 長尺基板のめっき方法およびめっき装置
JP4019034B2 (ja) 2003-09-22 2007-12-05 日東電工株式会社 回路付サスペンション基板の製造方法
JP4339834B2 (ja) * 2005-08-23 2009-10-07 日東電工株式会社 回路付サスペンション基板の製造方法
JP5239299B2 (ja) 2007-11-06 2013-07-17 大日本印刷株式会社 サスペンション基板およびその製造方法
JP5190695B2 (ja) 2008-09-26 2013-04-24 住友電工プリントサーキット株式会社 フレキシブルプリント配線板シート、およびその製造方法
JP2010126768A (ja) 2008-11-27 2010-06-10 Nitto Denko Corp 配線回路基板の製造方法
JP2010171040A (ja) * 2009-01-20 2010-08-05 Nitto Denko Corp 配線回路基板およびその製造方法
JP5273271B1 (ja) 2012-03-12 2013-08-28 大日本印刷株式会社 支持枠付サスペンション用基板
JP2013206488A (ja) * 2012-03-27 2013-10-07 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法
JP6355984B2 (ja) * 2014-06-20 2018-07-11 日東電工株式会社 回路付サスペンション基板
CN205793638U (zh) 2016-05-27 2016-12-07 深圳市一博科技有限公司 一种改善高速信号质量的金手指焊盘结构
JP6986492B2 (ja) 2018-06-01 2021-12-22 日東電工株式会社 配線回路基板
US10636811B1 (en) * 2018-11-02 2020-04-28 Nanya Technology Corporation Semiconductor structure and method for manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562170A (zh) * 2008-04-14 2009-10-21 日东电工株式会社 带电路的悬挂基板及其制造方法
JP2013214763A (ja) * 2013-06-21 2013-10-17 Nitto Denko Corp 配線回路基板

Also Published As

Publication number Publication date
JP7514214B2 (ja) 2024-07-10
WO2020230487A1 (ja) 2020-11-19
JP2020188189A (ja) 2020-11-19
CN113812217A (zh) 2021-12-17
JP6944971B2 (ja) 2021-10-06
KR20220008267A (ko) 2022-01-20
US20220256712A1 (en) 2022-08-11
KR102814975B1 (ko) 2025-05-29
US12317424B2 (en) 2025-05-27
JP2021185627A (ja) 2021-12-09
TWI860358B (zh) 2024-11-01
TW202044940A (zh) 2020-12-01

Similar Documents

Publication Publication Date Title
CN113812217B (zh) 布线电路基板
CN109287072A (zh) 电路迹线的封装
JP2011014644A (ja) 配線基板およびその製造方法
CN114788425B (zh) 布线电路基板和其制造方法
CN103781292A (zh) 电路板及其制作方法
KR102805609B1 (ko) 배선 회로 기판
JP5351830B2 (ja) 配線回路基板およびその製造方法
US20230147342A1 (en) Wiring circuit board
JP2002050715A (ja) 半導体パッケージの製造方法
JP2000277889A (ja) 転写媒体、その転写媒体の製造方法およびその転写媒体を用いた配線パターンの製造方法
US20250386430A1 (en) Wiring circuit board
JP2005354030A (ja) 回路板の製法
JP4730072B2 (ja) 回路基板の製造方法
TWI701979B (zh) 線路板及其製作方法
JP4730071B2 (ja) 回路基板の製造方法
JP2006013160A (ja) 配線回路基板および半導体装置
JPH08222626A (ja) 電極パッドの形成方法
JP2000259803A (ja) Ｉｃカードの製造方法
JP2015012115A (ja) 配線基板の製造方法
KR20070105421A (ko) 더미 패턴 제거 방법
JPH06260590A (ja) 多層配線複合リードフレーム
JPS6252403B2 (https=)
JP2006108553A (ja) 配線基板及びその製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant