CN113571503B - 发光装置 - Google Patents

发光装置

Info

Publication number
CN113571503B
CN113571503B CN202110452165.2A CN202110452165A CN113571503B CN 113571503 B CN113571503 B CN 113571503B CN 202110452165 A CN202110452165 A CN 202110452165A CN 113571503 B CN113571503 B CN 113571503B
Authority
CN
China
Prior art keywords
emitting element
light
light emitting
bonding member
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110452165.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN113571503A (zh
Inventor
荫山弘明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020201968A external-priority patent/JP7114854B2/ja
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN113571503A publication Critical patent/CN113571503A/zh
Application granted granted Critical
Publication of CN113571503B publication Critical patent/CN113571503B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN202110452165.2A 2020-04-28 2021-04-26 发光装置 Active CN113571503B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020079040 2020-04-28
JP2020-079040 2020-04-28
JP2020-201968 2020-12-04
JP2020201968A JP7114854B2 (ja) 2020-04-28 2020-12-04 発光装置

Publications (2)

Publication Number Publication Date
CN113571503A CN113571503A (zh) 2021-10-29
CN113571503B true CN113571503B (zh) 2026-03-10

Family

ID=75625456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110452165.2A Active CN113571503B (zh) 2020-04-28 2021-04-26 发光装置

Country Status (4)

Country Link
US (2) US11699779B2 (https=)
EP (2) EP3905326B1 (https=)
JP (1) JP7532747B2 (https=)
CN (1) CN113571503B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7442058B2 (ja) 2021-12-24 2024-03-04 日亜化学工業株式会社 発光素子および発光装置
CN115881879B (zh) * 2022-12-23 2025-09-19 厦门三安光电有限公司 一种发光二极管

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DE102015118234A1 (de) * 2015-10-26 2017-04-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
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JP2018085495A (ja) * 2016-11-25 2018-05-31 京セラ株式会社 発光素子用基板、発光素子モジュールおよび発光装置
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JP6555247B2 (ja) * 2016-12-28 2019-08-07 日亜化学工業株式会社 発光装置及びその製造方法
JP7284366B2 (ja) * 2017-08-29 2023-05-31 日亜化学工業株式会社 発光装置
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KR20190074233A (ko) * 2017-12-19 2019-06-27 서울반도체 주식회사 발광 소자 및 이를 포함하는 발광 모듈
KR102553265B1 (ko) 2018-07-09 2023-07-07 삼성전자 주식회사 발광 소자 및 이를 포함하는 광원 모듈
KR102581666B1 (ko) * 2018-08-24 2023-09-22 삼성디스플레이 주식회사 발광 소자, 이를 포함하는 표시 장치 및 표시 장치의 제조 방법
CN109148402B (zh) * 2018-08-29 2020-09-15 开发晶照明（厦门）有限公司 发光二极管封装结构及其制造方法
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CN112840468A (zh) * 2019-12-10 2021-05-25 厦门三安光电有限公司 一种发光装置
CN110993777B (zh) * 2019-12-16 2021-02-02 京东方科技集团股份有限公司 一种显示驱动板及其制备方法和显示装置
CN113614625B (zh) * 2020-03-05 2022-09-13 京东方科技集团股份有限公司 发光基板及其驱动方法、发光模组、显示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130045686A (ko) * 2011-10-26 2013-05-06 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 라이트 유닛

Also Published As

Publication number Publication date
EP3905326B1 (en) 2023-01-04
US11699779B2 (en) 2023-07-11
CN113571503A (zh) 2021-10-29
EP3905326A1 (en) 2021-11-03
US20210336109A1 (en) 2021-10-28
EP4160679A1 (en) 2023-04-05
US12002917B2 (en) 2024-06-04
JP7532747B2 (ja) 2024-08-14
US20230299253A1 (en) 2023-09-21
EP4160679B1 (en) 2024-01-31
JP2022141882A (ja) 2022-09-29

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