JP7532747B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP7532747B2
JP7532747B2 JP2022117306A JP2022117306A JP7532747B2 JP 7532747 B2 JP7532747 B2 JP 7532747B2 JP 2022117306 A JP2022117306 A JP 2022117306A JP 2022117306 A JP2022117306 A JP 2022117306A JP 7532747 B2 JP7532747 B2 JP 7532747B2
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light
emitting element
bonding member
wiring
external connection
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Japanese (ja)
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JP2022141882A5 (https=
JP2022141882A (ja
Inventor
弘明 ▲蔭▼山
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Nichia Corp
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Nichia Corp
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Priority claimed from JP2020201968A external-priority patent/JP7114854B2/ja
Application filed by Nichia Corp filed Critical Nichia Corp
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Publication of JP2022141882A5 publication Critical patent/JP2022141882A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2022117306A 2020-04-28 2022-07-22 発光装置 Active JP7532747B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020079040 2020-04-28
JP2020079040 2020-04-28
JP2020201968A JP7114854B2 (ja) 2020-04-28 2020-12-04 発光装置

Related Parent Applications (1)

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JP2020201968A Division JP7114854B2 (ja) 2020-04-28 2020-12-04 発光装置

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JP2022141882A JP2022141882A (ja) 2022-09-29
JP2022141882A5 JP2022141882A5 (https=) 2023-11-16
JP7532747B2 true JP7532747B2 (ja) 2024-08-14

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JP2022117306A Active JP7532747B2 (ja) 2020-04-28 2022-07-22 発光装置

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US (2) US11699779B2 (https=)
EP (2) EP3905326B1 (https=)
JP (1) JP7532747B2 (https=)
CN (1) CN113571503B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7442058B2 (ja) 2021-12-24 2024-03-04 日亜化学工業株式会社 発光素子および発光装置
CN115881879B (zh) * 2022-12-23 2025-09-19 厦门三安光电有限公司 一种发光二极管

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JP2016062940A (ja) 2014-09-16 2016-04-25 株式会社東芝 発光ユニット及び半導体発光装置
JP2018081832A (ja) 2016-11-17 2018-05-24 株式会社小糸製作所 光源ユニットおよび車両用灯具
JP2018085495A (ja) 2016-11-25 2018-05-31 京セラ株式会社 発光素子用基板、発光素子モジュールおよび発光装置
JP2019041080A (ja) 2017-08-29 2019-03-14 日亜化学工業株式会社 発光装置
WO2019074149A1 (ko) 2017-10-13 2019-04-18 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
US20190326495A1 (en) 2018-08-29 2019-10-24 Kaistar Lighting(Xiamen) Co., Ltd. Light-emitting diode package structure and manufacturing method thereof

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JP2012119376A (ja) * 2010-11-29 2012-06-21 Toshiba Corp Ｌｅｄパッケージ
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
KR101830144B1 (ko) * 2011-10-26 2018-02-20 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 라이트 유닛
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KR20190074233A (ko) * 2017-12-19 2019-06-27 서울반도체 주식회사 발광 소자 및 이를 포함하는 발광 모듈
KR102553265B1 (ko) 2018-07-09 2023-07-07 삼성전자 주식회사 발광 소자 및 이를 포함하는 광원 모듈
KR102581666B1 (ko) * 2018-08-24 2023-09-22 삼성디스플레이 주식회사 발광 소자, 이를 포함하는 표시 장치 및 표시 장치의 제조 방법
US11727857B2 (en) * 2019-03-29 2023-08-15 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US12142716B2 (en) * 2019-03-29 2024-11-12 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
CN112840468A (zh) * 2019-12-10 2021-05-25 厦门三安光电有限公司 一种发光装置
CN110993777B (zh) * 2019-12-16 2021-02-02 京东方科技集团股份有限公司 一种显示驱动板及其制备方法和显示装置
CN113614625B (zh) * 2020-03-05 2022-09-13 京东方科技集团股份有限公司 发光基板及其驱动方法、发光模组、显示装置

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124528A (ja) 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2003110148A (ja) 2001-09-28 2003-04-11 Nichia Chem Ind Ltd 半導体発光装置
JP2007199657A (ja) 2005-12-28 2007-08-09 Kyocera Corp 光配線モジュール
JP2009088190A (ja) 2007-09-28 2009-04-23 Panasonic Corp 実装基板およびｌｅｄモジュール
JP2010205868A (ja) 2009-03-03 2010-09-16 Sharp Corp Ｌｅｄ基板、ｌｅｄ光源装置
JP2011029634A (ja) 2009-07-03 2011-02-10 Sharp Corp 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
JP2020057821A (ja) 2013-03-15 2020-04-09 ルミレッズ ホールディング ベーフェー 発光構造及びマウント
JP2016510180A (ja) 2013-03-15 2016-04-04 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光構造及びマウント
JP2015177030A (ja) 2014-03-14 2015-10-05 スタンレー電気株式会社 発光装置
JP2016062940A (ja) 2014-09-16 2016-04-25 株式会社東芝 発光ユニット及び半導体発光装置
JP2018081832A (ja) 2016-11-17 2018-05-24 株式会社小糸製作所 光源ユニットおよび車両用灯具
JP2018085495A (ja) 2016-11-25 2018-05-31 京セラ株式会社 発光素子用基板、発光素子モジュールおよび発光装置
JP2019041080A (ja) 2017-08-29 2019-03-14 日亜化学工業株式会社 発光装置
WO2019074149A1 (ko) 2017-10-13 2019-04-18 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
US20190326495A1 (en) 2018-08-29 2019-10-24 Kaistar Lighting(Xiamen) Co., Ltd. Light-emitting diode package structure and manufacturing method thereof

Also Published As

Publication number Publication date
EP3905326B1 (en) 2023-01-04
US11699779B2 (en) 2023-07-11
CN113571503A (zh) 2021-10-29
CN113571503B (zh) 2026-03-10
EP3905326A1 (en) 2021-11-03
US20210336109A1 (en) 2021-10-28
EP4160679A1 (en) 2023-04-05
US12002917B2 (en) 2024-06-04
US20230299253A1 (en) 2023-09-21
EP4160679B1 (en) 2024-01-31
JP2022141882A (ja) 2022-09-29

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