CN113472310B - 水晶振动元件、以及具备该水晶振动元件的水晶振子 - Google Patents
水晶振动元件、以及具备该水晶振动元件的水晶振子 Download PDFInfo
- Publication number
- CN113472310B CN113472310B CN202110685427.XA CN202110685427A CN113472310B CN 113472310 B CN113472310 B CN 113472310B CN 202110685427 A CN202110685427 A CN 202110685427A CN 113472310 B CN113472310 B CN 113472310B
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- vibration
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- crystal oscillator
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02062—Details relating to the vibration mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0595—Holders or supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-200232 | 2015-10-08 | ||
| JP2015200232 | 2015-10-08 | ||
| JP2016059077 | 2016-03-23 | ||
| JP2016-059077 | 2016-03-23 | ||
| JP2016089765 | 2016-04-27 | ||
| JP2016-089765 | 2016-04-27 | ||
| PCT/JP2016/079920 WO2017061591A1 (ja) | 2015-10-08 | 2016-10-07 | 水晶振動素子、及びこの水晶振動素子を備える水晶振動子 |
| CN201680058556.3A CN108352821B (zh) | 2015-10-08 | 2016-10-07 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680058556.3A Division CN108352821B (zh) | 2015-10-08 | 2016-10-07 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113472310A CN113472310A (zh) | 2021-10-01 |
| CN113472310B true CN113472310B (zh) | 2025-03-11 |
Family
ID=58487901
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110685427.XA Active CN113472310B (zh) | 2015-10-08 | 2016-10-07 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
| CN201680058556.3A Active CN108352821B (zh) | 2015-10-08 | 2016-10-07 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680058556.3A Active CN108352821B (zh) | 2015-10-08 | 2016-10-07 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US11038485B2 (enExample) |
| JP (2) | JP6268629B2 (enExample) |
| CN (2) | CN113472310B (enExample) |
| TW (2) | TWI718368B (enExample) |
| WO (1) | WO2017061591A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016132767A1 (ja) * | 2015-02-18 | 2016-08-25 | 株式会社村田製作所 | 圧電振動デバイス及びその製造方法 |
| CN113472310B (zh) * | 2015-10-08 | 2025-03-11 | 株式会社村田制作所 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
| JP6853085B2 (ja) * | 2017-03-27 | 2021-03-31 | 京セラ株式会社 | 水晶素子および水晶デバイス |
| JP6797764B2 (ja) * | 2017-08-09 | 2020-12-09 | 日本電波工業株式会社 | 水晶振動子およびその製造方法 |
| WO2019167920A1 (ja) * | 2018-02-28 | 2019-09-06 | 株式会社村田製作所 | 振動基板、振動素子、及び振動子 |
| JP2019193066A (ja) * | 2018-04-24 | 2019-10-31 | 日本電波工業株式会社 | 水晶振動子 |
| US10840882B2 (en) * | 2018-04-24 | 2020-11-17 | Nihon Dempa Kogyo Co., Ltd. | Crystal unit and manufacturing method thereof |
| JP6760430B1 (ja) * | 2019-03-27 | 2020-09-23 | 株式会社大真空 | 水晶振動デバイス |
| US11145726B2 (en) * | 2019-10-16 | 2021-10-12 | Applied Materials, Inc. | Doped through-contact structures |
| JP7396858B2 (ja) * | 2019-11-01 | 2023-12-12 | 日本電波工業株式会社 | 圧電デバイス及びその製造方法 |
| JP7514196B2 (ja) * | 2021-02-12 | 2024-07-10 | 日本電波工業株式会社 | 圧電デバイス及びその製造方法 |
| TWI773193B (zh) * | 2021-03-15 | 2022-08-01 | 台灣嘉碩科技股份有限公司 | 晶體裝置及諧振元件 |
| US12388415B2 (en) * | 2021-05-28 | 2025-08-12 | Nihon Dempa Kogyo Co., Ltd. | Crystal unit, semimanufactured crystal unit, and method for manufacturing crystal unit |
| CN113556099B (zh) * | 2021-06-11 | 2022-10-14 | 成都泰美克晶体技术有限公司 | 压电石英晶体振荡片、谐振器和振荡器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542092A (en) * | 1977-06-07 | 1979-01-09 | Nippon Denpa Kogyo Kk | Thickness slide piezooelectric vibrator holding structure |
| JPS61147613A (ja) * | 1984-12-21 | 1986-07-05 | Nippon Dempa Kogyo Co Ltd | 厚みすべり型圧電振動子 |
| CN108352821B (zh) * | 2015-10-08 | 2021-11-23 | 株式会社村田制作所 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
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| JPS5186977A (ja) * | 1975-01-29 | 1976-07-30 | Hitachi Ltd | Denkaikokatoranjisutatosonoseizohoho |
| JPS5636814B2 (enExample) | 1975-02-21 | 1981-08-26 | ||
| JPS5494173U (enExample) * | 1977-12-16 | 1979-07-03 | ||
| JPS5677129U (enExample) * | 1979-11-16 | 1981-06-23 | ||
| JPS5677129A (en) * | 1979-11-29 | 1981-06-25 | Yamashiro Seiki Seisakusho:Kk | Small portable injection molding machine |
| JPS60160633U (ja) * | 1984-03-31 | 1985-10-25 | 御代田精密株式会社 | Ａｔカツト小型矩形水晶振動子の電極構造 |
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| JP2001007677A (ja) | 1999-06-24 | 2001-01-12 | Toyo Commun Equip Co Ltd | 水晶振動子 |
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| JP2013192052A (ja) * | 2012-03-14 | 2013-09-26 | Nippon Dempa Kogyo Co Ltd | 水晶デバイス及びその製造方法。 |
| JP5943186B2 (ja) * | 2012-03-19 | 2016-06-29 | セイコーエプソン株式会社 | 振動片、振動子、電子デバイス、および電子機器 |
| JP5943187B2 (ja) | 2012-03-21 | 2016-06-29 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、および電子機器 |
| JP2013255051A (ja) * | 2012-06-06 | 2013-12-19 | Seiko Epson Corp | 振動素子、振動子、電子デバイス、電子機器及び振動素子の製造方法 |
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| US20160164490A1 (en) | 2013-03-27 | 2016-06-09 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric device and method for fabricating the same |
| JP6133697B2 (ja) | 2013-06-12 | 2017-05-24 | 日本電波工業株式会社 | 圧電振動片、圧電デバイス、及び圧電デバイスの製造方法 |
| JP6338367B2 (ja) | 2013-12-24 | 2018-06-06 | 日本電波工業株式会社 | 水晶振動子 |
| US9503045B2 (en) * | 2015-01-19 | 2016-11-22 | Seiko Epson Corporation | Resonator element, resonator, oscillator, electronic apparatus, and moving object |
-
2016
- 2016-10-07 CN CN202110685427.XA patent/CN113472310B/zh active Active
- 2016-10-07 JP JP2017519950A patent/JP6268629B2/ja active Active
- 2016-10-07 TW TW107114045A patent/TWI718368B/zh active
- 2016-10-07 CN CN201680058556.3A patent/CN108352821B/zh active Active
- 2016-10-07 WO PCT/JP2016/079920 patent/WO2017061591A1/ja not_active Ceased
- 2016-10-07 TW TW105132550A patent/TWI630737B/zh active
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2017
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2018
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542092A (en) * | 1977-06-07 | 1979-01-09 | Nippon Denpa Kogyo Kk | Thickness slide piezooelectric vibrator holding structure |
| JPS61147613A (ja) * | 1984-12-21 | 1986-07-05 | Nippon Dempa Kogyo Co Ltd | 厚みすべり型圧電振動子 |
| CN108352821B (zh) * | 2015-10-08 | 2021-11-23 | 株式会社村田制作所 | 水晶振动元件、以及具备该水晶振动元件的水晶振子 |
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| CN108352821A (zh) | 2018-07-31 |
| JP6819882B2 (ja) | 2021-01-27 |
| US11139796B2 (en) | 2021-10-05 |
| CN108352821B (zh) | 2021-11-23 |
| US20180241372A1 (en) | 2018-08-23 |
| JP2017220954A (ja) | 2017-12-14 |
| CN113472310A (zh) | 2021-10-01 |
| TW201830741A (zh) | 2018-08-16 |
| JPWO2017061591A1 (ja) | 2017-10-19 |
| US11277115B2 (en) | 2022-03-15 |
| WO2017061591A1 (ja) | 2017-04-13 |
| JP6268629B2 (ja) | 2018-01-31 |
| US11075615B2 (en) | 2021-07-27 |
| US11038485B2 (en) | 2021-06-15 |
| US20180226943A1 (en) | 2018-08-09 |
| TWI630737B (zh) | 2018-07-21 |
| US20180248536A1 (en) | 2018-08-30 |
| US20180226944A1 (en) | 2018-08-09 |
| TW201727955A (zh) | 2017-08-01 |
| TWI718368B (zh) | 2021-02-11 |
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