CN113448177A - 描画装置、数据处理装置、描画方法、以及描画数据生成方法 - Google Patents

描画装置、数据处理装置、描画方法、以及描画数据生成方法 Download PDF

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Publication number
CN113448177A
CN113448177A CN202110293334.2A CN202110293334A CN113448177A CN 113448177 A CN113448177 A CN 113448177A CN 202110293334 A CN202110293334 A CN 202110293334A CN 113448177 A CN113448177 A CN 113448177A
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China
Prior art keywords
substrate
data
mesh
initial
areas
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Pending
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CN202110293334.2A
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English (en)
Chinese (zh)
Inventor
鉈落信也
八坂智
增田胜太
中津智史
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication of CN113448177A publication Critical patent/CN113448177A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image Generation (AREA)
CN202110293334.2A 2020-03-24 2021-03-18 描画装置、数据处理装置、描画方法、以及描画数据生成方法 Pending CN113448177A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020052384A JP7463154B2 (ja) 2020-03-24 2020-03-24 描画装置、データ処理装置、描画方法、および描画データ生成方法
JP2020-052384 2020-03-24

Publications (1)

Publication Number Publication Date
CN113448177A true CN113448177A (zh) 2021-09-28

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CN202110293334.2A Pending CN113448177A (zh) 2020-03-24 2021-03-18 描画装置、数据处理装置、描画方法、以及描画数据生成方法

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Country Link
JP (1) JP7463154B2 (ko)
KR (1) KR102566081B1 (ko)
CN (1) CN113448177A (ko)
TW (1) TWI792211B (ko)

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CN110737179A (zh) * 2018-07-20 2020-01-31 株式会社斯库林集团 描画装置及描画方法

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US6654096B1 (en) * 1999-09-09 2003-11-25 Canon Kabushiki Kaisha Exposure apparatus, and device manufacturing method
JP2002231605A (ja) * 2001-01-31 2002-08-16 Sony Corp パターン描画装置およびパターン描画方法
CN101097406A (zh) * 2006-06-26 2008-01-02 株式会社Orc制作所 描图系统
JP2010204421A (ja) * 2009-03-04 2010-09-16 Dainippon Screen Mfg Co Ltd 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法
JP2011082289A (ja) * 2009-10-06 2011-04-21 Orc Manufacturing Co Ltd 描画装置および描画方法
JP2011095742A (ja) * 2009-10-30 2011-05-12 Ibiden Co Ltd 描画データ補正方法、描画方法、配線板の製造方法、及び描画システム
US20120083916A1 (en) * 2010-09-30 2012-04-05 Ryo Yamada Displacement calculation method, drawing data correction method, substrate manufacturing method, and drawing apparatus
CN102681355A (zh) * 2011-03-18 2012-09-19 大日本网屏制造株式会社 描画数据修正装置及描画装置
JP2012198313A (ja) * 2011-03-18 2012-10-18 Dainippon Screen Mfg Co Ltd 描画データの補正装置および描画装置
JP2012243939A (ja) * 2011-05-19 2012-12-10 Nuflare Technology Inc 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法
CN104021237A (zh) * 2013-03-01 2014-09-03 大日本网屏制造株式会社 数据转换方法、描画系统及记录介质
JP2014178536A (ja) * 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd 描画データ生成方法、描画方法、描画データ生成装置、および描画装置
JP2014209154A (ja) * 2013-03-22 2014-11-06 ビアメカニクス株式会社 描画方法、描画装置及び露光装置
JP2015064477A (ja) * 2013-09-25 2015-04-09 凸版印刷株式会社 パターン位置計測方法、パターン位置計測装置、及びフォトマスク
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TW201628060A (zh) * 2014-09-30 2016-08-01 思可林集團股份有限公司 圖案形成裝置及圖案形成方法
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CN107436537A (zh) * 2016-05-26 2017-12-05 维亚机械株式会社 图案描画装置及图案描画方法
US20190171121A1 (en) * 2016-05-31 2019-06-06 Nikon Corporation Mark detection apparatus, mark detection method, measurement apparatus, exposure apparatus, exposure method and device manufacturing method
CN110737179A (zh) * 2018-07-20 2020-01-31 株式会社斯库林集团 描画装置及描画方法

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TW202205346A (zh) 2022-02-01
JP7463154B2 (ja) 2024-04-08
TWI792211B (zh) 2023-02-11
KR102566081B1 (ko) 2023-08-10
KR20210119309A (ko) 2021-10-05
JP2021152572A (ja) 2021-09-30

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