CN112956283A - 具有可变形导体的结构 - Google Patents

具有可变形导体的结构 Download PDF

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Publication number
CN112956283A
CN112956283A CN201980069957.2A CN201980069957A CN112956283A CN 112956283 A CN112956283 A CN 112956283A CN 201980069957 A CN201980069957 A CN 201980069957A CN 112956283 A CN112956283 A CN 112956283A
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CN
China
Prior art keywords
layer
insulating material
pattern
circuit assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980069957.2A
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English (en)
Chinese (zh)
Inventor
马克·罗奈
特雷弗·斯皮格尔·安东尼奥·里维拉
迈克尔·阿德文彻·霍普金斯
爱德华·戈沙克
查尔斯·金泽尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid Wire Co
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Liquid Wire Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquid Wire Co filed Critical Liquid Wire Co
Publication of CN112956283A publication Critical patent/CN112956283A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN201980069957.2A 2018-08-22 2019-08-22 具有可变形导体的结构 Pending CN112956283A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862721538P 2018-08-22 2018-08-22
US62/721,538 2018-08-22
PCT/US2019/047731 WO2020041605A1 (en) 2018-08-22 2019-08-22 Structures with deformable conductors

Publications (1)

Publication Number Publication Date
CN112956283A true CN112956283A (zh) 2021-06-11

Family

ID=69586343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980069957.2A Pending CN112956283A (zh) 2018-08-22 2019-08-22 具有可变形导体的结构

Country Status (5)

Country Link
US (4) US11088063B2 (https=)
EP (1) EP3841850A4 (https=)
JP (3) JP7269347B2 (https=)
CN (1) CN112956283A (https=)
WO (1) WO2020041605A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11594480B2 (en) 2018-08-22 2023-02-28 Liquid Wire Inc. Structures with deformable conductors

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11880498B2 (en) 2019-03-27 2024-01-23 Liquid Wire Inc. Deformable human interface device
EP4090711A4 (en) 2020-01-15 2024-03-20 Liquid Wire Inc. DEPOSITION WITH SOLID STARTING MATERIAL
KR20220163964A (ko) * 2020-03-04 2022-12-12 리퀴드 와이어 인크. 변형가능 인덕터들
FR3108780B1 (fr) * 2020-03-30 2022-03-18 Commissariat Energie Atomique Procédé de réalisation d’une zone d’individualisation d’un circuit intégré
JP7815149B2 (ja) 2020-06-12 2026-02-17 リキッド ワイヤ インコーポレイテッド 多軸差動歪みセンサ
US11937372B2 (en) 2020-06-24 2024-03-19 Yale University Biphasic material and stretchable circuit board
US12096563B2 (en) * 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures
WO2023034886A1 (en) * 2021-08-31 2023-03-09 Liquid Wire Inc. Flexible and stretchable structures
JP2024500352A (ja) * 2020-12-11 2024-01-09 リキッド ワイヤ インコーポレイテッド 集積導体を有する構造体
US20240147631A1 (en) 2021-02-26 2024-05-02 Liquid Wire, LLC Devices, systems, and methods for making and using highly sustainable circuits
WO2022246402A1 (en) 2021-05-18 2022-11-24 Liquid Wire Inc. Flexible high-power electronics bus
EP4120806A1 (en) 2021-07-15 2023-01-18 Imec VZW An interconnect, an electronic assembly and a method for manufacturing an electronic assembly
WO2023010106A1 (en) 2021-07-30 2023-02-02 Liquid Wire Inc. Flexible and stretchable structures
WO2023023482A1 (en) * 2021-08-16 2023-02-23 Liquid Wire Inc. Stretchable and flexible metal film structures
US20240428981A1 (en) 2021-10-22 2024-12-26 Liquid Wire Inc. Flexible three-dimensional electronic component
WO2023076844A1 (en) 2021-10-27 2023-05-04 Liquid Wire Inc. Two-dimensional motion capture strain sensors
WO2023147358A1 (en) 2022-01-25 2023-08-03 Liquid Wire Inc. Electronic component appliques
US12431418B2 (en) * 2022-05-20 2025-09-30 Micron Technology, Inc. Three dimensional semiconductor trace length matching and associated systems and methods

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20007729U1 (de) * 2000-04-28 2000-08-03 Siemens AG, 80333 München Leiterplatte
US20070151756A1 (en) * 2004-03-19 2007-07-05 Yoshihisa Yamashita Flexible substrate having interlaminar junctions, and process for producing the same
CN101505575A (zh) * 2008-12-26 2009-08-12 深圳大学 基于pdms生物可兼容性的柔性电路
US20090273083A1 (en) * 2008-04-30 2009-11-05 Ioan Sauciuc Electrically conductive fluid interconnects for integrated circuit devices
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
US20150085457A1 (en) * 2013-09-20 2015-03-26 Lotes Co., Ltd Electrical connector and manufacturing method thereof

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729003A (en) * 1984-08-31 1988-03-01 Texas Instruments Incorporated Configuration of a metal insulator semiconductor with a processor based gate
JPH0666549B2 (ja) 1988-08-31 1994-08-24 信越ポリマー株式会社 スルーホール付きフレキシブル基板の製造方法
US5198189A (en) 1989-08-03 1993-03-30 International Business Machines Corporation Liquid metal matrix thermal paste
US5056706A (en) 1989-11-20 1991-10-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5792236A (en) 1993-02-25 1998-08-11 Virginia Tech Intellectual Properties, Inc. Non-toxic liquid metal composition for use as a mercury substitute
US5478978A (en) 1993-02-25 1995-12-26 The Center For Innovative Technology Electrical switches and sensors which use a non-toxic liquid metal composition
US5391846A (en) 1993-02-25 1995-02-21 The Center For Innovative Technology Alloy substitute for mercury in switch applications
JPH0715122A (ja) * 1993-06-23 1995-01-17 Matsushita Electric Ind Co Ltd 接合用フィルム構体および電子部品実装方法
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
JP3610999B2 (ja) * 1996-06-07 2005-01-19 松下電器産業株式会社 半導体素子の実装方法
US6812624B1 (en) 1999-07-20 2004-11-02 Sri International Electroactive polymers
US6781284B1 (en) 1997-02-07 2004-08-24 Sri International Electroactive polymer transducers and actuators
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US5961144A (en) 1997-11-12 1999-10-05 Trw Inc. Folded combination horn pad and driver position sensor assembly and method for providing the assembly
JP2000183092A (ja) * 1998-12-16 2000-06-30 Matsushita Electric Ind Co Ltd バンプ付電子部品の実装構造および実装方法
US6462414B1 (en) 1999-03-05 2002-10-08 Altera Corporation Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad
US6507095B1 (en) 1999-03-25 2003-01-14 Seiko Epson Corporation Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument
JP4337129B2 (ja) * 1999-03-30 2009-09-30 株式会社村田製作所 セラミック基板の製造方法
JP4401070B2 (ja) * 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
KR100998039B1 (ko) * 2003-10-01 2010-12-03 삼성테크윈 주식회사 기판 제조 방법 및 이를 이용하여 제조된 스마트 라벨
WO2005058083A2 (en) 2003-12-12 2005-06-30 Beck Gregory S Safety helmet with shock detector, helmet attachement device with shock detector & methods
DE112005000014T5 (de) * 2004-04-06 2006-05-18 Murata Manufacturing Co., Ltd., Nagaokakyo Innenleiterverbindungsstruktur und Mehrschichtsubstrat
JP5354765B2 (ja) * 2004-08-20 2013-11-27 カミヤチョウ アイピー ホールディングス 三次元積層構造を持つ半導体装置の製造方法
EP1720389B1 (en) * 2005-04-25 2019-07-03 Brother Kogyo Kabushiki Kaisha Method for forming pattern and a wired board
EP1897426A2 (en) * 2005-05-18 2008-03-12 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
JP5568206B2 (ja) 2006-09-15 2014-08-06 東海ゴム工業株式会社 変形センサ
US20100052163A1 (en) * 2007-04-27 2010-03-04 Nec Corporation Semiconductor device, method of manufacturing same and method of repairing same
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US7854173B2 (en) 2008-11-28 2010-12-21 The Hong Kong Polytechnic University Strain sensor
JP2011017626A (ja) 2009-07-09 2011-01-27 Sony Corp 力学量検知部材及び力学量検知装置
JP5486683B2 (ja) 2010-11-04 2014-05-07 東海ゴム工業株式会社 曲げセンサ
US8069735B1 (en) 2010-11-10 2011-12-06 Artann Laboratories Inc. Tactile sensor array for soft tissue elasticity imaging
US9655561B2 (en) * 2010-12-22 2017-05-23 Cardioinsight Technologies, Inc. Multi-layered sensor apparatus
US8896125B2 (en) * 2011-07-05 2014-11-25 Sony Corporation Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
WO2013075234A1 (en) 2011-11-22 2013-05-30 Westport Power Inc. Apparatus and method for fuelling a flexible-fuel internal combustion engine
TWI473218B (zh) * 2012-07-26 2015-02-11 欣興電子股份有限公司 穿孔中介板及其製法與封裝基板及其製法
WO2014058806A1 (en) 2012-10-08 2014-04-17 Stc.Unm Improved pliable pressure-sensing fabric
JP2014086664A (ja) * 2012-10-26 2014-05-12 Nec Corp 配線基板、電子機器、および配線基板の製造方法
IL225374A0 (en) 2013-03-21 2013-07-31 Noveto Systems Ltd Array@Matamari
KR101497230B1 (ko) 2013-08-20 2015-02-27 삼성전기주식회사 전자부품 내장기판 및 전자부품 내장기판 제조방법
WO2015029951A1 (ja) * 2013-08-26 2015-03-05 日立金属株式会社 実装基板用ウエハ、多層セラミックス基板、実装基板、チップモジュール、及び実装基板用ウエハの製造方法
JP6308493B2 (ja) * 2013-12-03 2018-04-11 国立大学法人 筑波大学 漆塗膜の加工方法
EP3092661A4 (en) 2014-01-06 2017-09-27 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
WO2015151433A1 (ja) * 2014-04-01 2015-10-08 パナソニックＩｐマネジメント株式会社 部品実装基板
US9753568B2 (en) 2014-05-15 2017-09-05 Bebop Sensors, Inc. Flexible sensors and applications
KR101689547B1 (ko) * 2015-01-22 2016-12-26 주식회사 유니드 전기 접속 구조의 제조 방법
JP6518451B2 (ja) * 2015-02-02 2019-05-22 株式会社フジクラ 伸縮性回路基板
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
KR102432009B1 (ko) 2015-09-03 2022-08-12 엘지이노텍 주식회사 압력 센서
WO2017061799A1 (ko) 2015-10-06 2017-04-13 엘지이노텍 주식회사 압력 감지 의자
US10617809B2 (en) 2015-12-29 2020-04-14 Fresenius Medical Care Holdings, Inc. Electrical sensor for fluids
US10406269B2 (en) 2015-12-29 2019-09-10 Fresenius Medical Care Holdings, Inc. Electrical sensor for fluids
US11156509B2 (en) 2016-02-29 2021-10-26 Liquid Wire Inc. Sensors with deformable conductors and selective deformation
US10672530B2 (en) 2016-02-29 2020-06-02 Liquid Wire Inc. Deformable conductors and related sensors, antennas and multiplexed systems
US10304604B2 (en) 2016-05-03 2019-05-28 The United States Of America As Represented By The Secretary Of The Army Deformable inductive devices having a magnetic core formed of an elastomer with magnetic particles therein along with a deformable electrode
US10039186B2 (en) 2016-09-16 2018-07-31 Intel Corporation Stretchable and flexible electrical substrate interconnections
US11184975B2 (en) 2017-02-06 2021-11-23 Carnegie Mellon University Method of creating a flexible circuit
US10275069B2 (en) 2017-09-22 2019-04-30 Apple Inc. Pressure resistant force sensing enclosure
CN112956283A (zh) 2018-08-22 2021-06-11 液态电线公司 具有可变形导体的结构

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20007729U1 (de) * 2000-04-28 2000-08-03 Siemens AG, 80333 München Leiterplatte
US20070151756A1 (en) * 2004-03-19 2007-07-05 Yoshihisa Yamashita Flexible substrate having interlaminar junctions, and process for producing the same
US20090273083A1 (en) * 2008-04-30 2009-11-05 Ioan Sauciuc Electrically conductive fluid interconnects for integrated circuit devices
CN101505575A (zh) * 2008-12-26 2009-08-12 深圳大学 基于pdms生物可兼容性的柔性电路
CN101505575B (zh) * 2008-12-26 2011-01-19 深圳大学 一种基于pdms生物可兼容性的柔性电路的制作方法
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
US20150085457A1 (en) * 2013-09-20 2015-03-26 Lotes Co., Ltd Electrical connector and manufacturing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
周旭: "《电子设备结构与工艺》", 31 July 2004, 北京航空航天大学出版社, pages: 200 - 201 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11594480B2 (en) 2018-08-22 2023-02-28 Liquid Wire Inc. Structures with deformable conductors
US11955420B2 (en) 2018-08-22 2024-04-09 Liquid Wire Inc. Structures with deformable conductors
US12125778B2 (en) 2018-08-22 2024-10-22 Liquid Wire Inc. Structures with deformable conductors

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