CN112840004B - 树脂组合物 - Google Patents

树脂组合物 Download PDF

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Publication number
CN112840004B
CN112840004B CN201980066505.9A CN201980066505A CN112840004B CN 112840004 B CN112840004 B CN 112840004B CN 201980066505 A CN201980066505 A CN 201980066505A CN 112840004 B CN112840004 B CN 112840004B
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China
Prior art keywords
group
resin composition
component
general formula
compound
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CN201980066505.9A
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English (en)
Chinese (zh)
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CN112840004A (zh
Inventor
岩谷一希
新井史纪
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Namics Corp
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Namics Corp
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Publication of CN112840004A publication Critical patent/CN112840004A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
CN201980066505.9A 2018-10-17 2019-10-16 树脂组合物 Active CN112840004B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-196087 2018-10-17
JP2018196087 2018-10-17
PCT/JP2019/040618 WO2020080391A1 (ja) 2018-10-17 2019-10-16 樹脂組成物

Publications (2)

Publication Number Publication Date
CN112840004A CN112840004A (zh) 2021-05-25
CN112840004B true CN112840004B (zh) 2022-11-08

Family

ID=70283782

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980066505.9A Active CN112840004B (zh) 2018-10-17 2019-10-16 树脂组合物

Country Status (5)

Country Link
JP (1) JP7473206B2 (ko)
KR (1) KR20210077678A (ko)
CN (1) CN112840004B (ko)
TW (1) TWI801680B (ko)
WO (1) WO2020080391A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022196586A1 (ja) * 2021-03-16 2022-09-22 東洋紡株式会社 接着剤組成物、ならびにこれを含有する接着シート、積層体およびプリント配線板
KR20230158031A (ko) * 2021-03-16 2023-11-17 도요보 엠씨 가부시키가이샤 접착제 조성물과, 이것을 함유하는 접착 시트, 적층체 및 프린트 배선판
KR20230157428A (ko) * 2021-03-16 2023-11-16 도요보 엠씨 가부시키가이샤 접착제 조성물과, 이것을 함유하는 접착 시트, 적층체 및 프린트 배선판
WO2022196585A1 (ja) * 2021-03-16 2022-09-22 東洋紡株式会社 接着剤組成物、ならびにこれを含有する接着シート、積層体およびプリント配線板
TW202313911A (zh) * 2021-08-10 2023-04-01 日商納美仕有限公司 樹脂組成物及接著劑
WO2023238792A1 (ja) * 2022-06-06 2023-12-14 パナソニックＩｐマネジメント株式会社 光硬化性組成物、及びカメラモジュールの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000154251A (ja) * 1998-09-16 2000-06-06 Sekisui Chem Co Ltd 光硬化性樹脂組成物、液晶注入口封止剤及び液晶表示セル
JP2009256662A (ja) * 2008-03-26 2009-11-05 Nagase Chemtex Corp シルセスキオキサン誘導体及びその製造方法
CN103562273A (zh) * 2011-04-28 2014-02-05 三菱瓦斯化学株式会社 固化性组合物及光学用粘接剂
CN103562271A (zh) * 2011-04-28 2014-02-05 三菱瓦斯化学株式会社 固化性组合物及光学用粘接剂
JP2017122163A (ja) * 2016-01-06 2017-07-13 積水化学工業株式会社 硬化性樹脂組成物
CN107531906A (zh) * 2016-03-24 2018-01-02 三菱瓦斯化学株式会社 含有硫醇化合物的新型光学材料用组合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976575B1 (ja) 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
CN111315719B (zh) * 2017-10-26 2022-12-27 四国化成工业株式会社 硫醇化合物、其合成方法和该硫醇化合物的利用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000154251A (ja) * 1998-09-16 2000-06-06 Sekisui Chem Co Ltd 光硬化性樹脂組成物、液晶注入口封止剤及び液晶表示セル
JP2009256662A (ja) * 2008-03-26 2009-11-05 Nagase Chemtex Corp シルセスキオキサン誘導体及びその製造方法
CN103562273A (zh) * 2011-04-28 2014-02-05 三菱瓦斯化学株式会社 固化性组合物及光学用粘接剂
CN103562271A (zh) * 2011-04-28 2014-02-05 三菱瓦斯化学株式会社 固化性组合物及光学用粘接剂
JP2017122163A (ja) * 2016-01-06 2017-07-13 積水化学工業株式会社 硬化性樹脂組成物
CN107531906A (zh) * 2016-03-24 2018-01-02 三菱瓦斯化学株式会社 含有硫醇化合物的新型光学材料用组合物

Also Published As

Publication number Publication date
JPWO2020080391A1 (ja) 2021-10-14
CN112840004A (zh) 2021-05-25
JP7473206B2 (ja) 2024-04-23
WO2020080391A1 (ja) 2020-04-23
TW202028307A (zh) 2020-08-01
KR20210077678A (ko) 2021-06-25
TWI801680B (zh) 2023-05-11

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