CN112772001A - 接合基板、金属电路基板及电路基板 - Google Patents

接合基板、金属电路基板及电路基板 Download PDF

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Publication number
CN112772001A
CN112772001A CN201980062400.6A CN201980062400A CN112772001A CN 112772001 A CN112772001 A CN 112772001A CN 201980062400 A CN201980062400 A CN 201980062400A CN 112772001 A CN112772001 A CN 112772001A
Authority
CN
China
Prior art keywords
metal plate
cut
bonding substrate
circuit board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980062400.6A
Other languages
English (en)
Chinese (zh)
Inventor
津川优太
西村浩二
青野良太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN112772001A publication Critical patent/CN112772001A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201980062400.6A 2018-09-27 2019-09-27 接合基板、金属电路基板及电路基板 Pending CN112772001A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-181383 2018-09-27
JP2018181383 2018-09-27
PCT/JP2019/038172 WO2020067427A1 (fr) 2018-09-27 2019-09-27 Substrat lié, circuit imprimé métallique et circuit imprimé

Publications (1)

Publication Number Publication Date
CN112772001A true CN112772001A (zh) 2021-05-07

Family

ID=69949378

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980062400.6A Pending CN112772001A (zh) 2018-09-27 2019-09-27 接合基板、金属电路基板及电路基板

Country Status (6)

Country Link
US (1) US11497125B2 (fr)
EP (1) EP3860317A4 (fr)
JP (1) JP7455751B2 (fr)
KR (1) KR102564099B1 (fr)
CN (1) CN112772001A (fr)
WO (1) WO2020067427A1 (fr)

Family Cites Families (34)

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JPH104156A (ja) * 1996-06-14 1998-01-06 Mitsubishi Electric Corp 半導体装置用絶縁基板及び半導体装置
JP3449458B2 (ja) 1997-05-26 2003-09-22 電気化学工業株式会社 回路基板
US20040103808A1 (en) * 2002-08-19 2004-06-03 Darren Lochun Electrical circuits and methods of manufacture and use
JP2004172182A (ja) 2002-11-18 2004-06-17 Denki Kagaku Kogyo Kk 回路基板及びその製造方法
JP4191506B2 (ja) * 2003-02-21 2008-12-03 Ｔｄｋ株式会社 高密度インダクタおよびその製造方法
US7062840B2 (en) * 2003-02-24 2006-06-20 Delphi Technologies, Inc. Method for forming permanent magnet targets for position sensors
JP2004342635A (ja) * 2003-05-13 2004-12-02 Hitachi Metals Ltd セラミックス基板接合用金属板およびセラミックス回路基板
JP2005150329A (ja) * 2003-11-14 2005-06-09 Canon Inc 配線構造及びその作製方法
JP4556422B2 (ja) * 2003-12-02 2010-10-06 パナソニック株式会社 電子部品およびその製造方法
JP5054445B2 (ja) * 2007-06-26 2012-10-24 スミダコーポレーション株式会社 コイル部品
JP2009170930A (ja) 2009-03-12 2009-07-30 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
CN104011852B (zh) 2011-12-20 2016-12-21 株式会社东芝 陶瓷铜电路基板和使用了陶瓷铜电路基板的半导体装置
JP6125328B2 (ja) * 2013-05-27 2017-05-10 日東電工株式会社 軟磁性フィルム積層回路基板の製造方法
JP6297281B2 (ja) * 2013-05-27 2018-03-20 日東電工株式会社 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP6567259B2 (ja) * 2013-10-01 2019-08-28 日東電工株式会社 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置
US20150201500A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR System, device, and method of three-dimensional printing
US20150201499A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Device, system, and method of three-dimensional printing
WO2015133361A1 (fr) * 2014-03-04 2015-09-11 株式会社村田製作所 Partie bobine, module de bobine et procede de production de partie bobine
JP6156577B2 (ja) * 2014-04-09 2017-07-05 株式会社村田製作所 積層コイル部品、およびコイルモジュール
KR102004791B1 (ko) * 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
JP6311200B2 (ja) * 2014-06-26 2018-04-18 住友電工プリントサーキット株式会社 プリント配線板、電子部品及びプリント配線板の製造方法
US9570385B2 (en) * 2015-01-22 2017-02-14 Invensas Corporation Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
JP6652273B2 (ja) * 2015-03-13 2020-02-19 住友電工プリントサーキット株式会社 平面コイル素子及び平面コイル素子の製造方法
KR20160136127A (ko) * 2015-05-19 2016-11-29 삼성전기주식회사 코일 전자부품 및 그 제조방법
CN107408538B (zh) 2015-09-28 2019-12-20 株式会社东芝 电路基板及半导体装置
KR101900880B1 (ko) * 2015-11-24 2018-09-21 주식회사 모다이노칩 파워 인덕터
JP7102097B2 (ja) * 2016-03-01 2022-07-19 日東電工株式会社 磁性フィルムおよびコイルモジュール
KR20170112522A (ko) * 2016-03-31 2017-10-12 주식회사 모다이노칩 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자
US10321235B2 (en) * 2016-09-23 2019-06-11 Apple Inc. Transducer having a conductive suspension member
JP6380716B1 (ja) * 2016-11-28 2018-08-29 株式会社村田製作所 多層基板、多層基板の回路基板への実装構造、および多層基板の製造方法
JP6390825B1 (ja) * 2017-03-01 2018-09-19 株式会社村田製作所 実装用基板
KR102442382B1 (ko) * 2017-07-25 2022-09-14 삼성전기주식회사 인덕터
JP6740298B2 (ja) 2018-08-23 2020-08-12 東芝テック株式会社 チェックアウトシステム、会計機、及び制御プログラム

Also Published As

Publication number Publication date
US20220039264A1 (en) 2022-02-03
WO2020067427A1 (fr) 2020-04-02
EP3860317A1 (fr) 2021-08-04
KR102564099B1 (ko) 2023-08-04
US11497125B2 (en) 2022-11-08
JP7455751B2 (ja) 2024-03-26
JPWO2020067427A1 (ja) 2021-09-02
EP3860317A4 (fr) 2021-11-17
KR20210046057A (ko) 2021-04-27

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