CN112740107A - 带图案的基材的制造方法、电路基板的制造方法及触摸面板的制造方法 - Google Patents

带图案的基材的制造方法、电路基板的制造方法及触摸面板的制造方法 Download PDF

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Publication number
CN112740107A
CN112740107A CN201980059678.8A CN201980059678A CN112740107A CN 112740107 A CN112740107 A CN 112740107A CN 201980059678 A CN201980059678 A CN 201980059678A CN 112740107 A CN112740107 A CN 112740107A
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CN
China
Prior art keywords
resin composition
photosensitive resin
composition layer
group
pattern
Prior art date
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Pending
Application number
CN201980059678.8A
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English (en)
Chinese (zh)
Inventor
石坂壮二
汉那慎一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN112740107A publication Critical patent/CN112740107A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN201980059678.8A 2018-09-28 2019-08-15 带图案的基材的制造方法、电路基板的制造方法及触摸面板的制造方法 Pending CN112740107A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-185596 2018-09-28
JP2018185596 2018-09-28
PCT/JP2019/032051 WO2020066351A1 (ja) 2018-09-28 2019-08-15 パターン付き基材の製造方法、回路基板の製造方法及びタッチパネルの製造方法

Publications (1)

Publication Number Publication Date
CN112740107A true CN112740107A (zh) 2021-04-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980059678.8A Pending CN112740107A (zh) 2018-09-28 2019-08-15 带图案的基材的制造方法、电路基板的制造方法及触摸面板的制造方法

Country Status (4)

Country Link
JP (1) JPWO2020066351A1 (ja)
CN (1) CN112740107A (ja)
TW (1) TW202024150A (ja)
WO (1) WO2020066351A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7389071B2 (ja) * 2020-06-17 2023-11-29 富士フイルム株式会社 導電性パターンの形成方法、メタルメッシュセンサーの製造方法、及び、構造体の製造方法
KR20230015432A (ko) * 2020-06-26 2023-01-31 후지필름 가부시키가이샤 조성물, 전사 필름, 적층체의 제조 방법, 회로 배선의 제조 방법, 및, 전자 디바이스의 제조 방법
JPWO2022059417A1 (ja) * 2020-09-17 2022-03-24
WO2022264275A1 (ja) * 2021-06-15 2022-12-22 昭和電工マテリアルズ株式会社 感光性エレメント及び感光性エレメントの製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003177526A (ja) * 2001-12-10 2003-06-27 Hitachi Chem Co Ltd 感光性エレメント、感光性エレメントの製造法、これを用いたレジストパターンの製造法及びプリント配線板の製造法
JP2004341447A (ja) * 2003-05-19 2004-12-02 Hitachi Chem Co Ltd 感光性フィルム
US20050053868A1 (en) * 2003-09-08 2005-03-10 Nitto Denko Corporation Process for producing wiring circuit board
JP2006317500A (ja) * 2005-05-10 2006-11-24 Showa Denko Kk プリント配線板保護膜用感光性ドライフィルムロール及びその製造方法
JP2009083943A (ja) * 2007-09-27 2009-04-23 Fujifilm Corp 感光性積層体の製造装置及び製造方法
CN102405437A (zh) * 2009-12-09 2012-04-04 住友化学株式会社 光学显示装置的制造系统以及该光学显示装置的制造方法
WO2017213056A1 (ja) * 2016-06-10 2017-12-14 富士フイルム株式会社 パターン付き基材の製造方法、及び、回路基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260421A (ja) * 1993-03-08 1994-09-16 Canon Inc 機能性堆積膜の連続形成方法および連続形成装置
JP5109606B2 (ja) * 2007-11-15 2012-12-26 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法と保護フィルム
JP5609427B2 (ja) * 2010-08-25 2014-10-22 コニカミノルタ株式会社 偏光子保護フィルム、ロール状偏光板、及び液晶表示装置
JP2012052170A (ja) * 2010-08-31 2012-03-15 Fujifilm Corp 機能性フィルムの製造方法
JP6711364B2 (ja) * 2015-12-24 2020-06-17 コニカミノルタ株式会社 光学フィルム、光学フィルムロール体及び光学フィルムの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003177526A (ja) * 2001-12-10 2003-06-27 Hitachi Chem Co Ltd 感光性エレメント、感光性エレメントの製造法、これを用いたレジストパターンの製造法及びプリント配線板の製造法
JP2004341447A (ja) * 2003-05-19 2004-12-02 Hitachi Chem Co Ltd 感光性フィルム
US20050053868A1 (en) * 2003-09-08 2005-03-10 Nitto Denko Corporation Process for producing wiring circuit board
JP2006317500A (ja) * 2005-05-10 2006-11-24 Showa Denko Kk プリント配線板保護膜用感光性ドライフィルムロール及びその製造方法
JP2009083943A (ja) * 2007-09-27 2009-04-23 Fujifilm Corp 感光性積層体の製造装置及び製造方法
CN102405437A (zh) * 2009-12-09 2012-04-04 住友化学株式会社 光学显示装置的制造系统以及该光学显示装置的制造方法
WO2017213056A1 (ja) * 2016-06-10 2017-12-14 富士フイルム株式会社 パターン付き基材の製造方法、及び、回路基板の製造方法

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TW202024150A (zh) 2020-07-01
JPWO2020066351A1 (ja) 2021-05-20

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