CN112714784B - 导热性有机硅组合物及其固化物 - Google Patents

导热性有机硅组合物及其固化物 Download PDF

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Publication number
CN112714784B
CN112714784B CN201980060877.0A CN201980060877A CN112714784B CN 112714784 B CN112714784 B CN 112714784B CN 201980060877 A CN201980060877 A CN 201980060877A CN 112714784 B CN112714784 B CN 112714784B
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component
thermally conductive
mass
conductive silicone
parts
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Chinese (zh)
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CN112714784A (zh
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森村俊晴
远藤晃洋
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Glass Compositions (AREA)
CN201980060877.0A 2018-10-23 2019-08-06 导热性有机硅组合物及其固化物 Active CN112714784B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018199530A JP6957435B2 (ja) 2018-10-23 2018-10-23 熱伝導性シリコーン組成物及びその硬化物
JP2018-199530 2018-10-23
PCT/JP2019/030982 WO2020084868A1 (ja) 2018-10-23 2019-08-06 熱伝導性シリコーン組成物及びその硬化物

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CN112714784A CN112714784A (zh) 2021-04-27
CN112714784B true CN112714784B (zh) 2022-12-27

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JP (1) JP6957435B2 (ko)
KR (1) KR20210080351A (ko)
CN (1) CN112714784B (ko)
TW (1) TWI813738B (ko)
WO (1) WO2020084868A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023162636A1 (ja) * 2022-02-28 2023-08-31 信越化学工業株式会社 熱伝導性シリコーン組成物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000053864A (ja) * 1998-08-10 2000-02-22 Fuji Kobunshi Kogyo Kk 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
CN1340570A (zh) * 2000-08-31 2002-03-20 陶氏康宁东丽硅氧烷株式会社 振动阻尼型硅氧烷组合物
CN1651517A (zh) * 2004-02-05 2005-08-10 信越化学工业株式会社 室温固化性有机聚硅氧烷组合物
JP2007161806A (ja) * 2005-12-12 2007-06-28 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
TW201006902A (en) * 2008-04-11 2010-02-16 Shinetsu Chemical Co Silicone adhesive for semiconductor element
CN107428614A (zh) * 2015-02-09 2017-12-01 瓦克化学股份公司 包含烷氧基甲硅烷基封端的含氨基甲酸酯基团的聚合物、硅酮树脂、表面活性剂和骨料的可固化的灌浆组合物
WO2018180997A1 (ja) * 2017-03-31 2018-10-04 バンドー化学株式会社 熱伝導性シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4732400Y1 (ko) 1968-04-23 1972-09-29
JP2536120B2 (ja) 1989-01-25 1996-09-18 日本電気株式会社 電子部品の冷却構造
JP2938340B2 (ja) 1994-03-29 1999-08-23 信越化学工業株式会社 熱伝導性複合シート
JP3075132B2 (ja) 1995-03-06 2000-08-07 信越化学工業株式会社 放熱シート
JP3498823B2 (ja) 1996-04-30 2004-02-23 電気化学工業株式会社 放熱スペーサーおよびその用途
EP1734079B1 (en) * 2004-04-01 2016-01-20 Kaneka Corporation Single-component curable composition
JP2013222836A (ja) * 2012-04-17 2013-10-28 Shin Etsu Chem Co Ltd 放熱性及びリワーク性に優れる電子装置及びその製造方法
JP5729882B2 (ja) * 2012-10-23 2015-06-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2014105283A (ja) * 2012-11-28 2014-06-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000053864A (ja) * 1998-08-10 2000-02-22 Fuji Kobunshi Kogyo Kk 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
CN1340570A (zh) * 2000-08-31 2002-03-20 陶氏康宁东丽硅氧烷株式会社 振动阻尼型硅氧烷组合物
CN1651517A (zh) * 2004-02-05 2005-08-10 信越化学工业株式会社 室温固化性有机聚硅氧烷组合物
JP2007161806A (ja) * 2005-12-12 2007-06-28 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
TW201006902A (en) * 2008-04-11 2010-02-16 Shinetsu Chemical Co Silicone adhesive for semiconductor element
CN107428614A (zh) * 2015-02-09 2017-12-01 瓦克化学股份公司 包含烷氧基甲硅烷基封端的含氨基甲酸酯基团的聚合物、硅酮树脂、表面活性剂和骨料的可固化的灌浆组合物
WO2018180997A1 (ja) * 2017-03-31 2018-10-04 バンドー化学株式会社 熱伝導性シート

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Publication number Publication date
JP6957435B2 (ja) 2021-11-02
KR20210080351A (ko) 2021-06-30
WO2020084868A1 (ja) 2020-04-30
JP2020066670A (ja) 2020-04-30
TW202016219A (zh) 2020-05-01
CN112714784A (zh) 2021-04-27
TWI813738B (zh) 2023-09-01

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