CN112534970A - 布线电路基板及其制造方法和布线电路基板集合体片 - Google Patents

布线电路基板及其制造方法和布线电路基板集合体片 Download PDF

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Publication number
CN112534970A
CN112534970A CN201980052081.0A CN201980052081A CN112534970A CN 112534970 A CN112534970 A CN 112534970A CN 201980052081 A CN201980052081 A CN 201980052081A CN 112534970 A CN112534970 A CN 112534970A
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CN
China
Prior art keywords
circuit board
thin
wired circuit
printed circuit
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980052081.0A
Other languages
English (en)
Chinese (zh)
Inventor
笹冈良介
柴田直树
大薮恭也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN112534970A publication Critical patent/CN112534970A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN201980052081.0A 2018-08-10 2019-07-12 布线电路基板及其制造方法和布线电路基板集合体片 Pending CN112534970A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-152020 2018-08-10
JP2018152020A JP7396789B2 (ja) 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート
PCT/JP2019/027651 WO2020031613A1 (ja) 2018-08-10 2019-07-12 配線回路基板、その製造方法および配線回路基板集合体シート

Publications (1)

Publication Number Publication Date
CN112534970A true CN112534970A (zh) 2021-03-19

Family

ID=69413835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980052081.0A Pending CN112534970A (zh) 2018-08-10 2019-07-12 布线电路基板及其制造方法和布线电路基板集合体片

Country Status (5)

Country Link
US (2) US11452215B2 (enExample)
JP (2) JP7396789B2 (enExample)
CN (1) CN112534970A (enExample)
TW (1) TWI831816B (enExample)
WO (1) WO2020031613A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6979486B1 (ja) * 2020-06-25 2021-12-15 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258405A (ja) * 2002-02-27 2003-09-12 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2008053633A (ja) * 2006-08-28 2008-03-06 Mitsubishi Electric Corp プリント配線板及び分割方法
US20100270660A1 (en) * 2009-04-28 2010-10-28 Dai Nippon Printing Co., Ltd. Semiconductor device and method for manufacturing metallic shielding plate
US20140084452A1 (en) * 2011-07-29 2014-03-27 Sanyo Electric Co., Ltd. Element mounting board and semiconductor module
JP2014076528A (ja) * 2012-10-12 2014-05-01 Murata Mfg Co Ltd 電子部品の製造方法
JP2015029078A (ja) * 2013-06-27 2015-02-12 キヤノン・コンポーネンツ株式会社 フレキシブル配線板、発光装置、フレキシブル配線板の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370489A (ja) * 1986-09-11 1988-03-30 松下電工株式会社 金属ベ−スプリント配線板の加工方法
JPH0766510A (ja) 1993-08-30 1995-03-10 Ibiden Co Ltd プリント配線板
JP2000091733A (ja) 1998-09-09 2000-03-31 Rohm Co Ltd ハイブリッド集積回路装置の製造方法とその製造方法に使用する素材基板の構造
TW511422B (en) * 2000-10-02 2002-11-21 Sanyo Electric Co Method for manufacturing circuit device
JP4503220B2 (ja) * 2002-07-25 2010-07-14 東洋製罐株式会社 多層体の切断方法および多層成型品
JP2005340385A (ja) 2004-05-25 2005-12-08 Nitto Denko Corp 配線回路基板および配線回路基板の接続構造
JP2006123308A (ja) 2004-10-28 2006-05-18 Brother Ind Ltd 薄板状部品の積層構造及びその製造方法
JP4515276B2 (ja) * 2005-01-31 2010-07-28 日東電工株式会社 配線回路基板集合体
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
RU2469367C1 (ru) * 2008-08-27 2012-12-10 Шарп Кабусики Кайся Подложка активной матрицы, жидкокристаллическая панель, жидкокристаллический модуль отображения, жидкокристаллическое устройство отображения, телевизионный приемник и способ изготовления подложки активной матрицы
JP5319571B2 (ja) * 2010-02-12 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6032868B2 (ja) 2011-02-24 2016-11-30 日立化成株式会社 プリント配線板及びプリント配線板の製造方法
KR102067846B1 (ko) * 2011-06-06 2020-01-17 디에스엠 아이피 어셋츠 비.브이. 금속박 패턴 적층체, 금속박 적층체, 금속박 적층 기판, 태양 전지 모듈 및 금속박 패턴 적층체의 제조 방법
EP2859591A4 (en) 2012-06-08 2016-03-23 Tetrasun Inc SELECTIVE AND / OR FAST REMOVAL OF A COATING OF A LAYER AND SOLAR CELL APPLICATIONS THEREOF
CN107836037B (zh) * 2015-01-22 2020-07-17 瑞萨电子株式会社 半导体器件及其制造方法
JP6444273B2 (ja) * 2015-06-29 2018-12-26 シチズン時計株式会社 大判基板及びその製造方法
JP6534602B2 (ja) * 2015-11-17 2019-06-26 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
CN108432352B (zh) 2015-12-25 2019-11-26 太阳诱电株式会社 印刷布线板和摄像组件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258405A (ja) * 2002-02-27 2003-09-12 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2008053633A (ja) * 2006-08-28 2008-03-06 Mitsubishi Electric Corp プリント配線板及び分割方法
US20100270660A1 (en) * 2009-04-28 2010-10-28 Dai Nippon Printing Co., Ltd. Semiconductor device and method for manufacturing metallic shielding plate
US20140084452A1 (en) * 2011-07-29 2014-03-27 Sanyo Electric Co., Ltd. Element mounting board and semiconductor module
JP2014076528A (ja) * 2012-10-12 2014-05-01 Murata Mfg Co Ltd 電子部品の製造方法
JP2015029078A (ja) * 2013-06-27 2015-02-12 キヤノン・コンポーネンツ株式会社 フレキシブル配線板、発光装置、フレキシブル配線板の製造方法

Also Published As

Publication number Publication date
JP2023164612A (ja) 2023-11-10
JP2020027880A (ja) 2020-02-20
US20210185832A1 (en) 2021-06-17
TW202010372A (zh) 2020-03-01
US12167544B2 (en) 2024-12-10
US20220386463A1 (en) 2022-12-01
TWI831816B (zh) 2024-02-11
WO2020031613A1 (ja) 2020-02-13
US11452215B2 (en) 2022-09-20
JP7396789B2 (ja) 2023-12-12
JP7685566B2 (ja) 2025-05-29

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