TWI831816B - 配線電路基板、其製造方法及配線電路基板集合體片材 - Google Patents

配線電路基板、其製造方法及配線電路基板集合體片材 Download PDF

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Publication number
TWI831816B
TWI831816B TW108128034A TW108128034A TWI831816B TW I831816 B TWI831816 B TW I831816B TW 108128034 A TW108128034 A TW 108128034A TW 108128034 A TW108128034 A TW 108128034A TW I831816 B TWI831816 B TW I831816B
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit board
thin
sheet
mentioned
Prior art date
Application number
TW108128034A
Other languages
English (en)
Chinese (zh)
Other versions
TW202010372A (zh
Inventor
笹岡良介
柴田直樹
大薮恭也
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202010372A publication Critical patent/TW202010372A/zh
Application granted granted Critical
Publication of TWI831816B publication Critical patent/TWI831816B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
TW108128034A 2018-08-10 2019-08-07 配線電路基板、其製造方法及配線電路基板集合體片材 TWI831816B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018152020A JP7396789B2 (ja) 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート
JP2018-152020 2018-08-10

Publications (2)

Publication Number Publication Date
TW202010372A TW202010372A (zh) 2020-03-01
TWI831816B true TWI831816B (zh) 2024-02-11

Family

ID=69413835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108128034A TWI831816B (zh) 2018-08-10 2019-08-07 配線電路基板、其製造方法及配線電路基板集合體片材

Country Status (5)

Country Link
US (2) US11452215B2 (enExample)
JP (2) JP7396789B2 (enExample)
CN (1) CN112534970A (enExample)
TW (1) TWI831816B (enExample)
WO (1) WO2020031613A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6979486B1 (ja) * 2020-06-25 2021-12-15 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511422B (en) * 2000-10-02 2002-11-21 Sanyo Electric Co Method for manufacturing circuit device
JP2003258405A (ja) * 2002-02-27 2003-09-12 Seiko Epson Corp 配線基板の製造方法及び製造装置
WO2013018344A1 (ja) * 2011-07-29 2013-02-07 三洋電機株式会社 素子搭載用基板およびその製造方法、ならびに半導体モジュールおよびその製造方法
JP2014076528A (ja) * 2012-10-12 2014-05-01 Murata Mfg Co Ltd 電子部品の製造方法
JP2015029078A (ja) * 2013-06-27 2015-02-12 キヤノン・コンポーネンツ株式会社 フレキシブル配線板、発光装置、フレキシブル配線板の製造方法

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JPS6370489A (ja) * 1986-09-11 1988-03-30 松下電工株式会社 金属ベ−スプリント配線板の加工方法
JPH0766510A (ja) 1993-08-30 1995-03-10 Ibiden Co Ltd プリント配線板
JP2000091733A (ja) 1998-09-09 2000-03-31 Rohm Co Ltd ハイブリッド集積回路装置の製造方法とその製造方法に使用する素材基板の構造
JP4503220B2 (ja) * 2002-07-25 2010-07-14 東洋製罐株式会社 多層体の切断方法および多層成型品
JP2005340385A (ja) 2004-05-25 2005-12-08 Nitto Denko Corp 配線回路基板および配線回路基板の接続構造
JP2006123308A (ja) * 2004-10-28 2006-05-18 Brother Ind Ltd 薄板状部品の積層構造及びその製造方法
JP4515276B2 (ja) * 2005-01-31 2010-07-28 日東電工株式会社 配線回路基板集合体
JP2008053633A (ja) * 2006-08-28 2008-03-06 Mitsubishi Electric Corp プリント配線板及び分割方法
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
JP5431335B2 (ja) * 2008-08-27 2014-03-05 シャープ株式会社 アクティブマトリクス基板、液晶パネル、液晶表示ユニット、液晶表示装置、テレビジョン受像機、アクティブマトリクス基板の製造方法
US8247888B2 (en) * 2009-04-28 2012-08-21 Dai Nippon Printing Co., Ltd. Semiconductor device and method for manufacturing metallic shielding plate
JP5319571B2 (ja) * 2010-02-12 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6032868B2 (ja) * 2011-02-24 2016-11-30 日立化成株式会社 プリント配線板及びプリント配線板の製造方法
CN107256903B (zh) * 2011-06-06 2021-06-01 帝斯曼先进太阳能有限公司 金属箔图案层叠体、金属箔层叠体、金属箔层叠基板、太阳能电池模块及其制造方法
WO2013185054A1 (en) 2012-06-08 2013-12-12 Tetrasun, Inc. Selective and/or faster removal of a coating from an underlying layer, and solar cell applications thereof
KR20170105476A (ko) * 2015-01-22 2017-09-19 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법
JP6444273B2 (ja) * 2015-06-29 2018-12-26 シチズン時計株式会社 大判基板及びその製造方法
JP6534602B2 (ja) * 2015-11-17 2019-06-26 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6244499B2 (ja) 2015-12-25 2017-12-06 太陽誘電株式会社 プリント配線板、及びカメラモジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511422B (en) * 2000-10-02 2002-11-21 Sanyo Electric Co Method for manufacturing circuit device
JP2003258405A (ja) * 2002-02-27 2003-09-12 Seiko Epson Corp 配線基板の製造方法及び製造装置
WO2013018344A1 (ja) * 2011-07-29 2013-02-07 三洋電機株式会社 素子搭載用基板およびその製造方法、ならびに半導体モジュールおよびその製造方法
JP2014076528A (ja) * 2012-10-12 2014-05-01 Murata Mfg Co Ltd 電子部品の製造方法
JP2015029078A (ja) * 2013-06-27 2015-02-12 キヤノン・コンポーネンツ株式会社 フレキシブル配線板、発光装置、フレキシブル配線板の製造方法

Also Published As

Publication number Publication date
US12167544B2 (en) 2024-12-10
TW202010372A (zh) 2020-03-01
US20220386463A1 (en) 2022-12-01
JP2020027880A (ja) 2020-02-20
JP2023164612A (ja) 2023-11-10
CN112534970A (zh) 2021-03-19
US20210185832A1 (en) 2021-06-17
WO2020031613A1 (ja) 2020-02-13
US11452215B2 (en) 2022-09-20
JP7396789B2 (ja) 2023-12-12
JP7685566B2 (ja) 2025-05-29

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