WO2020031613A1 - 配線回路基板、その製造方法および配線回路基板集合体シート - Google Patents

配線回路基板、その製造方法および配線回路基板集合体シート Download PDF

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Publication number
WO2020031613A1
WO2020031613A1 PCT/JP2019/027651 JP2019027651W WO2020031613A1 WO 2020031613 A1 WO2020031613 A1 WO 2020031613A1 JP 2019027651 W JP2019027651 W JP 2019027651W WO 2020031613 A1 WO2020031613 A1 WO 2020031613A1
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WIPO (PCT)
Prior art keywords
circuit board
printed circuit
thin portion
thickness direction
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/027651
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English (en)
French (fr)
Japanese (ja)
Inventor
良介 笹岡
柴田　直樹
恭也 大薮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to CN201980052081.0A priority Critical patent/CN112534970A/zh
Priority to US17/265,925 priority patent/US11452215B2/en
Publication of WO2020031613A1 publication Critical patent/WO2020031613A1/ja
Anticipated expiration legal-status Critical
Priority to US17/884,176 priority patent/US12167544B2/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Definitions

  • the present invention relates to a printed circuit board, a method for manufacturing the same, and a printed circuit board assembly sheet, and more particularly, to a printed circuit board, a method for manufacturing the same, and a printed circuit board assembly sheet used therein.
  • These material substrates have one flat surface and the other flat surface facing each other in the thickness direction.
  • burr pieces are easily generated in the remaining portion of the narrow piece. Specifically, when the cutting blade is pressed against one surface of the narrow piece to cut it, or when the other side of the narrow piece is irradiated with laser light, a burr piece projecting from the other surface toward the other side in the thickness direction is formed. Easy to occur.
  • one surface in the thickness direction of the circuit board including the remaining portion to be cut is not flat, so that the handleability of the circuit board is reduced, and further, one side of the circuit board is brought into contact with the flat surface of another board.
  • the mountability of the circuit board is reduced.
  • the present invention provides a printed circuit board excellent in handleability and mountability, a method of manufacturing the same, and a printed circuit board assembly sheet.
  • the present invention (1) relates to a support sheet, a plurality of printed circuit boards supported by the support sheet, and a connection between the support sheet and the plurality of printed circuit boards to form a flat one surface; A joint having a second surface facing the first surface and a second surface facing the other surface at an interval in the thickness direction, wherein the other surface has a thin portion recessed toward the one surface.
  • a method for manufacturing a printed circuit board comprising: one step; and a second step of cutting the thin part while forming a burr part protruding toward the other side in the thickness direction.
  • the thin portion recessed toward one surface is cut. Therefore, even if the burr portion is formed so as to protrude toward the other side in the thickness direction, the thin portion is removed. It can be located on one side in the thickness direction than the other surface around the part. For this reason, it is possible to suppress a decrease in the handleability of the printed circuit board and, consequently, a reduction in the mountability of the printed circuit board.
  • the present invention (2) includes the method for manufacturing a wired circuit board according to (1), wherein in the second step, a cutting blade is brought into contact with the one surface.
  • a thin blade can be easily cut because a cutting blade is used.
  • the support sheet includes a direct connection portion to which the joint is directly connected, the direct connection portion has a weak portion, and in the second step, the weak portion is cut at the same time as the thin portion.
  • the cutting blade in contact with the thin portion has a relatively small shearing force. While the thin blade can be cut, the cutting blade in contact with the directly connected portion cannot cut the thick directly connected portion without a greater shearing force. Further, the shearing force applied to the thick directly-connected portion is likely to be larger than the shearing force applied to the thin-walled portion, and therefore, the difference between the shearing force applied to the directly-connected portion and the shearing force applied to the thin-walled portion becomes excessive. At this time, the posture of the cutting blade becomes unstable, and the cutting accuracy is likely to decrease.
  • the shearing force applied to the fragile portion can be made approximately the same as the shearing force applied to the thin-walled portion. Therefore, the posture of the cutting blade at the time of cutting can be stabilized, and a decrease in cutting accuracy can be suppressed.
  • the pressure of the cutting blade in contact with the thin portion is reduced, the amount of protrusion of the burr portion toward the other side in the thickness direction can be reduced as much as possible. As a result, it is possible to further suppress a decrease in the handleability of the printed circuit board, and further to suppress a decrease in the mountability of the printed circuit board.
  • the load on the cutting blade can be reduced, the number of replacements of the cutting blade can be reduced, and as a result, the manufacturing cost can be reduced.
  • the present invention (4) includes the method for manufacturing a printed circuit board according to (3), wherein the fragile portion includes a second thin portion and / or a through hole.
  • the fragile portion since the fragile portion includes the second thin portion and / or the through hole, the fragile portion can be reliably cut even with a small shearing force.
  • the present invention (5) includes the method for producing a printed circuit board according to (1), wherein in the second step, the other surface is irradiated with a laser beam.
  • a thin portion can be cut with high accuracy because a laser beam is used.
  • the present invention (6) is characterized in that the printed circuit board has a concave portion that is depressed inward from an outer peripheral edge when viewed in a thickness direction, and the thin-walled portion is formed when viewed in a thickness direction.
  • the thin portion is located outside the virtual outer peripheral line, the thin portion is likely to be an obstacle when handling or mounting the printed circuit board.
  • the thin portion is arranged in the recess so as to be located inside the virtual outer peripheral line along the outer peripheral edge in the second step when viewed in the thickness direction. Therefore, the burr portion can be located inside the virtual outer peripheral line. For this reason, the thin portion where the burr portion is formed does not become an obstacle, and it is possible to further suppress a reduction in handleability and a reduction in mounting of the printed circuit board.
  • the present invention (7) provides a support sheet, a plurality of printed circuit boards supported by the support sheet, and a connection between the support sheet and the plurality of printed circuit boards to form a flat one surface; A joint having a second surface facing the other surface at an interval in the thickness direction, the joint including a printed circuit board assembly sheet having a thin portion in which the other surface is concave toward the one surface.
  • the joint has a thin portion in which the other surface is depressed toward one surface, so if the thin portion that is depressed toward one surface is cut, a burr portion formed in the thin portion is formed. It can be located on one side in the thickness direction than the other surface around the thin portion. For this reason, it is possible to suppress a decrease in the handleability of the printed circuit board and, consequently, a reduction in the mountability of the printed circuit board.
  • the present invention (8) has an outer peripheral portion, wherein the outer peripheral portion has a cutting residue projecting outward, and the cutting residue is continuous from a base end and one end in the thickness direction of the base end. And, having a free end portion thinner than the base end portion, an outer edge of the free end portion has a burr portion projecting toward the other side in the thickness direction, and the burr portion is
  • the printed circuit board includes a printed circuit board that overlaps the base end when projected in the protruding direction of the remaining cut portion.
  • the burr portion overlaps the base end portion when projected in the protruding direction of the remaining cutting portion, so that the burr portion is closer to one side in the thickness direction than the other surface around the thin portion. To position. For this reason, the printed circuit board can suppress a decrease in handleability and, as a result, a decrease in mountability.
  • the wired circuit board the method of manufacturing the same, and the wired circuit board assembly sheet of the present invention, it is possible to suppress a decrease in handleability and mountability of the wired circuit board.
  • FIG. 1 shows a plan view of an embodiment of the printed circuit board assembly sheet of the present invention.
  • FIG. 2 shows an enlarged bottom view of the joint of the printed circuit board assembly sheet shown in FIG. 3A and 3B are cross-sectional views of the joint shown in FIG. 2.
  • FIG. 3A is a cross-sectional view taken along line AA of FIG. 2
  • FIG. 3B is a cross-sectional view taken along line BB of FIG.
  • FIG. 4 shows a bottom view of the printed circuit board separated from the printed circuit board assembly sheet of FIG.
  • FIG. 5 is a cross-sectional view of the printed circuit board of FIG. 4 along the line CC.
  • FIG. 6 shows a sectional view of a modification of the first thin portion shown in FIG. 3A.
  • FIG. 7A and 7B are bottom views of a modified example of the fragile portion shown in FIG. 2, and FIG. 7A is a modified example in which the fragile portion includes only the second thin portion, and FIG. A modified example consisting only of the following is shown.
  • FIG. 8 is a bottom view of a modified example of the fragile portion shown in FIG. 2 (an embodiment in which the fragile portion includes two second openings and one second thin portion).
  • FIG. 1 the area indicated by the thick broken line indicates the area drawn in FIG.
  • a thick dashed line draws a line through which the cutting blade 27 (described later) passes.
  • a first thin portion 5 to be described later
  • a second thin portion 11 to be described later, are drawn by hatching to clearly show their relative positions.
  • the printed circuit board assembly sheet 1 has a substantially rectangular shape extending in a longitudinal direction (a direction in which a printed circuit board 3 to be described later extends) (one direction orthogonal to a thickness direction). It has a sheet shape. As shown in FIGS. 3A and 3B, printed circuit board assembly sheet 1 has one surface 21 and the other surface 22 facing each other in the thickness direction. As shown in FIGS. 1 and 2, the printed circuit board assembly sheet 1 includes a support sheet 2, a printed circuit board 3, and a joint 4.
  • the support sheet 2 has the same outer shape as the outer shape of the printed circuit board assembly sheet 1 in plan view.
  • the support sheet 2 has a substantially lattice shape in plan view. As shown in FIGS. 3A and 3B, the support sheet 2 includes the one surface 21 and the other surface 22 described above.
  • the support sheet 2 has a plurality of first openings 7 formed around the printed circuit board 3 to be described below, corresponding to the printed circuit board 3. Have been. Further, the support sheet 2 includes a direct connection portion 9 to which the joint 4 is directly connected. A plurality of direct connection portions 9 are formed on the support sheet 2 corresponding to the printed circuit board 3.
  • a metal-based material for example, a resin such as polyimide, and the like can be given.
  • a metal-based material is used.
  • the metal-based material include metal elements classified into Groups 1 to 16 in the periodic table, and alloys containing two or more of these metal elements.
  • the metal-based material may be either a transition metal or a typical metal. More specifically, examples of the metal-based material include Group 2 metal elements such as calcium, Group 4 metal elements such as titanium and zirconium, Group 5 metal elements such as vanadium, chromium, molybdenum, and tungsten.
  • the metal-based material is an alloy, more preferably, a copper alloy.
  • the support sheet 2 may be a plurality of layers made of different types of materials.
  • the thickness of the support sheet 2 is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more, and is, for example, 10 mm or less, preferably 1 mm or less.
  • a plurality of printed circuit boards 3 are arranged on the support sheet 2 at intervals in the longitudinal direction and the width direction (directions orthogonal to the longitudinal direction and the thickness direction). Each printed circuit board 3 is disposed in the first opening 7 and is connected to the direct connection portion 9 of the support sheet 2 via the joint 4.
  • the printed circuit board 3 has a substantially rectangular plate shape in plan view along the longitudinal direction. Specifically, the printed circuit board 3 has an outer peripheral edge 15 that is substantially rectangular in a plan view. In other words, the outer peripheral edge 15 of one printed circuit board 3 is opposed to two first edges facing each other at an interval in the longitudinal direction, and is spaced apart from each other in the width direction. And two second edges that connect both edges in the direction.
  • the printed circuit board 3 has the one surface 21 and the other surface 22 described above.
  • the printed circuit board 3 has a recess 12 that is recessed inward from the outer peripheral edge 15.
  • a plurality of recesses 12 are provided corresponding to a plurality of joints 4 described later. More specifically, the plurality of recesses 12 are formed by cutting out substantially rectangular shapes from each of the two first edges of the outer peripheral edge 15 toward the inside in the longitudinal direction (that is, each one of the first edges). And one portion of the outer peripheral edge 15 that is cut into a substantially rectangular shape from each of the two second edges toward the inside in the width direction (that is, one portion for each second edge).
  • the concave portion 12 includes two first sides 23 that are continuous with the corresponding outer peripheral edge 15, and a second side 24 that connects the leading edges of the two first sides 23 in the concave direction.
  • the two first sides 23 are opposed to each other at an interval in a direction along the corresponding outer peripheral edge 15.
  • each of the two first sides 23 is at right angles to the corresponding outer peripheral edge 15.
  • the second side 24 is located at an interval inward (in the direction of the depression) with respect to the virtual outer peripheral line 6 along the outer peripheral edge 15.
  • the second side 24 is parallel to the virtual outer peripheral line 6 along the corresponding outer peripheral edge 15.
  • the printed circuit board 3 includes a metal support layer (not shown), a base insulating layer (not shown), a conductor layer 25, and a cover insulating layer in the thickness direction.
  • the metal support layer forms the other surface 22 in the thickness direction (see FIG. 3A)
  • the cover insulating layer forms the one surface 21 in the thickness direction (see FIG. 3A).
  • the materials of the metal support layer and the conductor layer 25 are the same as, for example, the metal-based materials exemplified for the support sheet 2.
  • the material of the base insulating layer and the cover insulating layer is, for example, the same as the resin exemplified in the support sheet 2.
  • the dimensions of the printed circuit board 3 are appropriately set according to the application and purpose.
  • the thickness of the printed circuit board 3 is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more, and is, for example, 10 mm or less, preferably 1 mm or less.
  • the facing length L1 of the two first sides 23 is the length of the second side 24 and is, for example, 100 mm or less, preferably 10 mm or less. It is at least 01 mm, preferably at least 0.05 mm.
  • the ratio (L1 / L0) of the opposing length L1 of the two first sides 23 to the length L0 (see FIG. 1) of the corresponding outer peripheral edge 15 is, for example, 100 or less, preferably 1 or less, Further, for example, it is 2 ⁇ 10 ⁇ 5 or more, preferably 2 ⁇ 10 ⁇ 4 or more.
  • the length L2 of the first side 23 is a distance between the virtual outer peripheral line 6 and the second side 24, and is also a dent amount (depth) of the dent portion 12.
  • the length L2 of the first side 23 is, for example, 0.001 mm or more, preferably 0.01 mm or more, and is, for example, 10 mm or less, preferably 1 mm or less.
  • the ratio (L2 / L0) of the length L2 of the first side 23 to the opposing length L1 of the two first sides 23 is, for example, 2 ⁇ 10 ⁇ 6 or more, preferably 2 ⁇ 10 ⁇ 3 or more. And, for example, 1 or less, preferably 0.2 or less.
  • each joint 4 is provided corresponding to four recesses 12 provided in one printed circuit board 3.
  • the joint 4 connects the printed circuit board 3 and the support sheet 2 across the first opening 7 in a plan view. Specifically, the joint 4 is directly connected from the second side 24 of the concave portion 12 to a direct connection portion 9 (described later) provided on the support sheet 2 so as to bridge the first opening 7.
  • the support sheet 2 suspends the printed circuit board 3 by a joint 4 (described later) crossing the first opening 7.
  • the joint 4 extends from the central portion of the second side 24 in the direction along the outer peripheral edge 15 toward the outside of the joint 4 (the side opposite to the concave direction of the concave portion 12), and then to the direct connection portion 9. It has a shape that leads.
  • the joint 4 has a substantially rectangular plate shape in a plan view that is long from the printed circuit board 3 toward the outside. As shown in FIGS. 3A and 3B, the joint 4 has the one surface 21 and the other surface 22 described above.
  • One surface 21 of the joint 4 has a flat shape.
  • the other surface 22 of the joint 4 has a flat shape in a region outside the first thin portion 5 (region other than the first thin portion 5) described below.
  • the material and layer configuration of the joint 4 are the same as those of the support sheet 2.
  • the joint 4 is preferably made of a metal material, and specifically, made of a metal material.
  • the metal-based plate connects the support sheet 2 and the metal support layer of the printed circuit board 3.
  • the joint 4 has a first thin portion 5 as an example of a thin portion.
  • the first thin portion 5 is arranged at the leading end (inner end) of the recess 12 of the joint 4 in the recess direction (the end on the printed circuit board 3 side).
  • the first thin portion 5 is disposed in the recess 12 so as to be located inside the virtual outer peripheral line 6 along the outer peripheral edge 15 when viewed in the thickness direction.
  • the first thin portion 5 is a recess (first recess) in which the other surface 22 of the joint 4 is recessed toward the one surface 21.
  • the other surface 22 of the first thin portion 5 includes a ceiling surface 19 and two side surfaces 20.
  • the ceiling surface 19 is arranged on the joint 4 on one side in the thickness direction with respect to the other surface 22 around the first thin portion 5. Thus, the ceiling surface 19 overlaps with the joint 4 around the first thin portion 5 and the printed circuit board 3 when projected in the inward and outward directions of the printed circuit board 3 (the recess direction of the recess 12).
  • the ceiling surface 19 has a substantially rectangular shape as viewed from the bottom along the outer peripheral edge 15.
  • the two side surfaces 20 are inner side surfaces extending from both the inner and outer edges of the ceiling surface 19 toward the other side in the thickness direction.
  • the other end in the thickness direction of the two side surfaces 20 is connected to the other surface 22 around the first thin portion 5.
  • the two side surfaces 20 are arranged to face each other so as to be parallel to each other, and form a substantially right angle with the ceiling surface 19.
  • the one surface 21 of the first thin portion 5 forms one plane in the joint 4 continuously with the other surface 22 around the first thin portion 5. That is, they are flush.
  • the width L3 of the joint 4 (the length in a direction perpendicular to the direction in which the joint 4 extends and the thickness direction) L3 is equal to the opposing length L1 of the two first sides 23. It is small, and the ratio of L3 to L1 (L3 / L1) is, for example, 0.5 or less, preferably 0.3 or less, and is, for example, 0.05 or more, preferably 0.1 or more.
  • the width L3 of the joint 4 is, for example, 100 mm or less, preferably 10 mm or less, and is, for example, 10 ⁇ m or more, preferably 50 ⁇ m or more.
  • the width (length in the inward and outward directions) L4 of the first thin portion 5 is, for example, 0.1 ⁇ m or more, preferably 1 ⁇ m or more, and is, for example, 10 mm or less, preferably 1 mm or less.
  • the distance L5 between the first thin portion 5 and the virtual outer peripheral line 6 (specifically, the distance between the outer side surface 20 of the two side surfaces 20 and the virtual outer peripheral line 6) L5 is, for example, It is at least 0.01 ⁇ m, preferably at least 1 ⁇ m, and for example, at most 10 mm, preferably at most 1 mm.
  • the distance L6 between the first thin portion 5 and the second side 24 (specifically, the distance between the side surface 20 located inside of the two side surfaces 20 and the second side 24) L6 is, for example, , 0.01 ⁇ m or more, preferably 1 ⁇ m or more, and for example, 10 mm or less, preferably 1 mm or less.
  • L4 / [L4 + L5 + L6] is, for example, 1 ⁇ 10 ⁇ 3 or more, preferably 0.1 or more, and is, for example, 1 or less, preferably 0.8 or less.
  • L5 / L2 is, for example, 1 ⁇ 10 ⁇ 3 or more, preferably 0.1 or more, and is, for example, 1 or less, preferably 0.8 or less.
  • L6 / L2 is, for example, 1 ⁇ 10 ⁇ 3 or more, preferably 0.1 or more, and is, for example, 1 or less, preferably 0.8 or less.
  • the thickness T1 of the first thin portion 5 is, for example, 10 mm or less, preferably 1 mm or less, and is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more.
  • the ratio (T1 / T0) of the thickness T1 of the first thin portion 5 to the thickness T0 of the portion around the first thin portion 5 is, for example, 0.7 or less, preferably 0.4 or less, In addition, for example, it is 0.01 or more, preferably 0.1 or more.
  • the depth D of the ceiling surface 19 of the first thin portion 5 from the other surface 22 around the first thin portion 5 is from the thickness T0 of the portion around the first thin portion 5 to the first thin portion 5.
  • This depth D is, for example, 10 mm or less, preferably 1 mm or less, and is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more.
  • the ratio (D / T0) of the depth D to the thickness T0 of the portion around the first thin portion 5 is, for example, 0.7 or less, preferably 0.4 or less, and for example, 0.01. Above, preferably 0.1 or more.
  • the direct connection portion 9 is a region of the support sheet 2 directly connected to the joint 4. Specifically, the direct connection portion 9 is a portion of the support sheet 2 which is disposed to face each of the recessed portions 12 of the printed circuit board 3 so as to face each other.
  • the directly connected portion 9 has a weak portion 26.
  • the fragile portion 26 has a second thin portion 11 and a second opening 10.
  • the second thin portions 11 are arranged at both ends of the direct connection portion 9 in the direction in which the outer peripheral edge 15 extends. As shown in FIGS. 3A and 3B, the second thin portion 11 has the same configuration as the first thin portion 5. That is, the second thin portion 11 specifically has a ceiling surface 19 and two side surfaces 20. The ceiling surface 19 of each of the two second thin portions 11 is arranged on one side in the thickness direction with respect to the other surface 22 around the second thin portion 11 at the direct connection portion 9, and the second thin portion 11 is In the direct connection portion 9, the other surface 22 (the ceiling surface 19) is a concave portion (a second concave portion) toward the one surface 21.
  • the second opening 10 is disposed at an outer end (the opposite side of the recess 12 in the recess direction) of the direct connection portion 9.
  • the second openings 10 are arranged outside the first openings 7 so as to face each other with an interval.
  • the second opening 10 has a substantially rectangular shape in plan view extending parallel to the first opening 7.
  • the second opening 10 is an example of a through hole that penetrates the direct connection portion 9 in the thickness direction.
  • the fragile portion 26 has the second opening 10 and the second thin portion 11 described above, the fragile portion 26 is more fragile than the periphery of the second opening 10 and the second thin portion 11.
  • the width, thickness and depth of the second thin portion 11 are the same as those of the first thin portion 5.
  • the width and length of the second opening 10 are appropriately adjusted according to the application and purpose.
  • a thick one-dot chain line is a line through which the cutting blade 27 (described later) passes, and such a line is a substantially rectangular line passing through the first thin portion 5 and the weak portion 26.
  • This method includes a first step of preparing the printed circuit board assembly sheet 1 and a second step of cutting the first thin portion 5.
  • a metal-based sheet made of a metal-based material is prepared, and then, a base insulating layer (not shown) and a conductor layer are provided on one side in the thickness direction of the metal-based sheet.
  • the printed circuit board 3 is manufactured by sequentially forming the insulating layer 25 and the cover insulating layer.
  • the metal sheet is opened to form the first opening 7 and the second opening 10.
  • the support sheet 2 and the joint 4 are formed.
  • the first thin portion 5 is formed on the joint 4, and the second thin portion 11 is formed on the support sheet 2.
  • half etching, laser processing, or the like is used, and preferably, half etching is used from the viewpoint of mass productivity.
  • the printed circuit board assembly sheet 1 is manufactured.
  • the cutting blade 27 is brought into contact with one surface 21 of the first thin portion 5 to cut the first thin portion 5.
  • the cutting blade 27 is brought into contact with one surface 21 of the second thin portion 11 to cut the fragile portion 26. That is, the first thin portion 5 and the fragile portion 26 are cut at the same time.
  • a Thomson blade for example, a rotatable disk-shaped dicing blade or the like can be used.
  • a Thomson blade is preferably used.
  • the Thomson blade has an endless shape in a plan view as shown by a thick dashed line in FIG.
  • the Thomson blade has a substantially rectangular frame that can pass through the first thin portion 5, the first opening 7, and the weak portion 26 (the second thin portion 11 and the second opening 10) in plan view. It has a shape.
  • the cutting blade 27 is arranged on one side in the thickness direction of the printed circuit board assembly sheet 1, and then, although not shown, the cutting blade 27 is moved to the other side in the thickness direction. Then, the cutting blade 27 is brought into contact with one surface 21 of the first thin portion 5 and the second thin portion 11. Subsequently, the cutting blade 27 is further moved to the other side in the thickness direction to reach the other surface 22 of the first thin portion 5 and the second thin portion 11, whereby the first thin portion 5 and the second thin portion 11 are moved. Shear (push off). Thereafter, the cutting blade 27 moves to the other side in the thickness direction of the other surface 22 of the first thin portion 5 and the second thin portion 11.
  • the burr portion 28 is not necessary in the printed circuit board 3 in particular because it causes a reduction in handleability and mountability. However, the burr portion 28 is inevitably formed in the second step of the manufacturing method described later. In this embodiment, as will be described later, since the burr portion 28 is formed in the first thin portion 5, the above-mentioned problem is solved.
  • the joint 4 is separated from the support sheet 2 around the direct connection portion 9 together with the direct connection portion 9.
  • the printed circuit board 3 is separated from the support sheet 2. Specifically, as shown by the thick dashed line in FIG. 2, the joint 4 and the direct connection portion 9 having a substantially T-shape in plan view are removed.
  • the printed circuit board 3 has the outer peripheral edge 14 including the outer peripheral edge 15 and the four recesses 12 described above.
  • the outer peripheral portion 14 is not connected to the joint 4 (see FIG. 2), that is, is already separated from the joint 4, while further having a cutting remaining portion 16 protruding outward from the concave portion 12.
  • the remaining cutting portion 16 integrally has a base end portion 17 and a free end portion 18.
  • the base end portion 17 has the same thickness T2 as the thickness T0 around the first thin portion 5 in the joint 4.
  • the free end 18 is continuous from one end in the thickness direction of the base end 17.
  • One surface 21 of free end portion 18 is continuous with one surface 21 of base end portion 17.
  • the other surface 22 of the free end portion 18 has a ceiling surface 19 and a side surface 20.
  • the ceiling surface 19 of the free end portion 18 is discontinuous with the other surface 22 of the base end portion 17.
  • the free end portion 18 is thinner than the base end portion 17.
  • the free end portion 18 has a shape that hangs to the other side in the thickness direction as going outward.
  • the outer edge 29 of the free end portion 18 has a burr portion 28 which is a protruding end (tip) protruding toward the other side in the thickness direction.
  • the burr portion 28 overlaps the base end portion 17 when projected in the direction in which the remaining cutting portion 16 projects.
  • the burr portion 28 is located on one side in the thickness direction with respect to a virtual surface 30 (dashed line) along the other surface 22 of the base end portion 17.
  • the free end portion 18 has a thickness T3 that is close to the thickness T1 of the first thin portion 5 shown in FIG. 3A.
  • the thickness T3 of the free end portion 18 is smaller than the thickness T2 of the base end portion 17.
  • the ratio (T3 / T2) of the thickness T3 of the free end portion 18 to the thickness T2 of the base end portion 17 is, for example, 0.7 or less, preferably 0.4 or less, and, for example, 0.01 or more. , Preferably 0.1 or more.
  • the printed circuit board 3 is mounted on another board (not shown).
  • another substrate has a flat surface, and the other surface 22 of the printed circuit board 3 comes into contact with the flat surface.
  • the first thin portion 5 that is recessed toward the one surface 21 is cut, so that the burr portion 28 faces the other side in the thickness direction. Even if it protrudes, as shown in FIG. 5, since the burr portion 28 is formed in the first thin portion 5, the burr portion 28 is formed in the thickness direction more than the other surface 22 around the first thin portion 5. It can be located on one side. For this reason, it is possible to suppress a decrease in the handleability of the printed circuit board 3 and, consequently, a reduction in the mountability of the printed circuit board 3.
  • the first thin portion 5 can be easily cut.
  • the joint 4 includes the direct connection portion 9 having no fragile portion 26, and when the direct connection portion 9 is cut at the same time as the first thin portion 5 in the second step, the first thin portion 5
  • the cutting blade 27 that contacts the direct-connecting portion 9 can cut the thick direct-connecting portion 9 unless the shearing force is greater than the cutting blade 27 that contacts the direct-connecting portion 9 with a relatively small shearing force. Can't cut.
  • the shearing force applied to the thick direct-connecting portion 9 tends to be larger than the shearing force applied to the first thin-walled portion 5, and therefore, the difference between the shearing force applied to the direct-connecting portion 9 and the shearing force applied to the first thin-walled portion 5. Becomes excessive. As a result, the horizontal attitude of the cutting blade 27 at the time of cutting becomes unstable, and the cutting accuracy tends to decrease.
  • both the first thin portion 5 and the direct connection portion 9 can be cut at the same time using the cutting blade 27 with a relatively small shearing force.
  • the shearing force applied to the fragile portion 26 can be set to the same degree as the shearing force applied to the first thin portion 5. Therefore, the posture of the cutting blade 27 at the time of cutting can be stabilized, and a decrease in cutting accuracy can be suppressed.
  • the load on the cutting blade 27 can be reduced, the number of replacements of the cutting blade 27 can be reduced, and as a result, the manufacturing cost can be reduced.
  • the fragile portion 26 includes the second thin portion 11 and the second opening 10, so that the fragile portion 26 can be reliably cut even with a small shearing force.
  • the first thin portion 5 is located outside the virtual outer peripheral line 6, the first thin portion 5 is used when the printed circuit board 3 separated from the support sheet 2 is handled or mounted.
  • the thin portion 5 tends to be in the way.
  • the first thin portion 5 is separated from the virtual outer peripheral line 6 along the outer peripheral edge 15 when viewed in the thickness direction. Since the cutting blade 27 is located inside the recess 12 so as to be located inside, the cutting blade 27 can be located inside the virtual outer peripheral line 6. For this reason, the first thin portion 5 where the burr portion 28 is formed does not become an obstacle, and it is possible to further suppress a decrease in handleability and mounting of the printed circuit board 3.
  • the joint 4 has the first thin portion 5 in which the other surface 22 is recessed toward the one surface 21, so as shown in FIG. If the first thin portion 5 that is recessed toward the one surface 21 is cut, the burr portion 28 formed on the first thin portion 5 is positioned closer to one side in the thickness direction than the other surface 22 around the first thin portion 5. Can be located. For this reason, it is possible to suppress a decrease in the handleability of the printed circuit board 3 and, consequently, a reduction in the mountability of the printed circuit board 3.
  • the burr portion 28 when the burr portion 28 is projected in the protruding direction of the remaining cut portion 16, the burr portion 28 overlaps the base end portion 17, so that the burr portion 28 is formed around the first thin portion 5. It is located on one side in the thickness direction from the other surface 22. For this reason, the printed circuit board 3 can suppress a decrease in handleability and, consequently, a decrease in mountability.
  • the other surface 22 of the first thin portion 5 has a ceiling surface 19 and a side surface 20, but may have a curved surface 13 as shown in FIG. 6, for example.
  • the curved surface 13 has a shape that goes toward the middle part (central part) in the width direction (inward / outward direction) and thus approaches the ceiling surface 19.
  • the thickness T1 of the first thin portion 5 is the shortest distance between the one surface 21 and the curved surface 13 in the thickness direction.
  • the first thin portion 5 is located inside the imaginary outer peripheral line 6 along the outer peripheral edge 15. It may be located outside.
  • the printed circuit board 3 has the recess 12. However, for example, although not shown, the printed circuit board 3 may not have the recess 12.
  • the remaining cutting portion 16 is formed to protrude outward from the outer peripheral edge 15.
  • the weak portion 26 has both the second thin portion 11 and the second opening 10, but has only one of them as shown in FIGS. 7A and 7B. You can also.
  • the fragile portion 26 does not include the second opening 10 (see FIG. 2), but includes only the second thin portion 11.
  • the second thin portion 11 has a substantially U-shape in plan view that opens toward the first opening 7.
  • the fragile portion 26 does not include the second thin portion 11 (see FIG. 2), but includes only the second opening 10.
  • a plurality of second openings 10 are formed, specifically, forming perforated cuts.
  • the cut has a substantially U-shape in plan view that opens toward the first opening 7.
  • the fragile portion 26 includes one second opening 10 and two second thin portions 11, but the number is not limited thereto.
  • the weak portion 26 may include two second openings 10 and one second thin portion 11.
  • the arrangement and shape of the second opening 10 and the second thin portion 11 shown in FIG. 8 in plan view are the same as those of the second thin portion 11 and the second opening 10 shown in FIG. 2, respectively.
  • the directly connected portion 9 includes the fragile portion 26, but is not shown, but may not include the fragile portion 26, for example.
  • the cutting blade 27 may cut only the first thin portion 5.
  • the cutting blade 27 is used in the second step.
  • a laser beam may be used.
  • the other surface 22 is irradiated with a laser beam (not shown).
  • a light source (not shown) is arranged on the other side in the thickness direction of the printed circuit board assembly sheet 1, and in the second step, laser light is emitted from the light source to the ceiling surface 19 (the other surface) of the first thin portion 5. Irradiate toward 22).
  • a burr portion 28 protruding toward the other side in the thickness direction is formed.
  • Examples of the laser light include those capable of cutting the first thin portion 5 and the second thin portion 11 while forming the burr portion 28, and include, for example, a gas laser, a solid laser, and a liquid laser. And a gas laser.
  • Examples of the gas laser include a carbon dioxide laser, a helium neon laser, an argon ion laser, a carbon dioxide laser, and a nitrogen laser, and preferably, a carbon dioxide laser.
  • the laser beam is used in the second step, so that the first thin portion 5 can be cut accurately.
  • the printed circuit board assembly sheet is used for manufacturing a printed circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2019/027651 2018-08-10 2019-07-12 配線回路基板、その製造方法および配線回路基板集合体シート Ceased WO2020031613A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980052081.0A CN112534970A (zh) 2018-08-10 2019-07-12 布线电路基板及其制造方法和布线电路基板集合体片
US17/265,925 US11452215B2 (en) 2018-08-10 2019-07-12 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
US17/884,176 US12167544B2 (en) 2018-08-10 2022-08-09 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet

Applications Claiming Priority (2)

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JP2018-152020 2018-08-10
JP2018152020A JP7396789B2 (ja) 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート

Related Child Applications (2)

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US17/265,925 A-371-Of-International US11452215B2 (en) 2018-08-10 2019-07-12 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
US17/884,176 Division US12167544B2 (en) 2018-08-10 2022-08-09 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet

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JP6979486B1 (ja) * 2020-06-25 2021-12-15 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

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TWI831816B (zh) 2024-02-11
CN112534970A (zh) 2021-03-19
JP7396789B2 (ja) 2023-12-12
US20220386463A1 (en) 2022-12-01
US12167544B2 (en) 2024-12-10
JP2020027880A (ja) 2020-02-20
JP2023164612A (ja) 2023-11-10
JP7685566B2 (ja) 2025-05-29
TW202010372A (zh) 2020-03-01
US11452215B2 (en) 2022-09-20

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