JP7396789B2 - 配線回路基板、その製造方法および配線回路基板集合体シート - Google Patents

配線回路基板、その製造方法および配線回路基板集合体シート Download PDF

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Publication number
JP7396789B2
JP7396789B2 JP2018152020A JP2018152020A JP7396789B2 JP 7396789 B2 JP7396789 B2 JP 7396789B2 JP 2018152020 A JP2018152020 A JP 2018152020A JP 2018152020 A JP2018152020 A JP 2018152020A JP 7396789 B2 JP7396789 B2 JP 7396789B2
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Japan
Prior art keywords
circuit board
printed circuit
thin
joint
support sheet
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JP2018152020A
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English (en)
Japanese (ja)
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JP2020027880A (ja
JP2020027880A5 (enExample
Inventor
良介 笹岡
直樹 柴田
恭也 大薮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2018152020A priority Critical patent/JP7396789B2/ja
Priority to PCT/JP2019/027651 priority patent/WO2020031613A1/ja
Priority to CN201980052081.0A priority patent/CN112534970A/zh
Priority to US17/265,925 priority patent/US11452215B2/en
Priority to TW108128034A priority patent/TWI831816B/zh
Publication of JP2020027880A publication Critical patent/JP2020027880A/ja
Publication of JP2020027880A5 publication Critical patent/JP2020027880A5/ja
Priority to US17/884,176 priority patent/US12167544B2/en
Priority to JP2023151684A priority patent/JP7685566B2/ja
Application granted granted Critical
Publication of JP7396789B2 publication Critical patent/JP7396789B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2018152020A 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート Active JP7396789B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018152020A JP7396789B2 (ja) 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート
CN201980052081.0A CN112534970A (zh) 2018-08-10 2019-07-12 布线电路基板及其制造方法和布线电路基板集合体片
US17/265,925 US11452215B2 (en) 2018-08-10 2019-07-12 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
PCT/JP2019/027651 WO2020031613A1 (ja) 2018-08-10 2019-07-12 配線回路基板、その製造方法および配線回路基板集合体シート
TW108128034A TWI831816B (zh) 2018-08-10 2019-08-07 配線電路基板、其製造方法及配線電路基板集合體片材
US17/884,176 US12167544B2 (en) 2018-08-10 2022-08-09 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
JP2023151684A JP7685566B2 (ja) 2018-08-10 2023-09-19 配線回路基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018152020A JP7396789B2 (ja) 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023151684A Division JP7685566B2 (ja) 2018-08-10 2023-09-19 配線回路基板およびその製造方法

Publications (3)

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JP2020027880A JP2020027880A (ja) 2020-02-20
JP2020027880A5 JP2020027880A5 (enExample) 2021-09-09
JP7396789B2 true JP7396789B2 (ja) 2023-12-12

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JP2018152020A Active JP7396789B2 (ja) 2018-08-10 2018-08-10 配線回路基板、その製造方法および配線回路基板集合体シート
JP2023151684A Active JP7685566B2 (ja) 2018-08-10 2023-09-19 配線回路基板およびその製造方法

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Country Status (5)

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US (2) US11452215B2 (enExample)
JP (2) JP7396789B2 (enExample)
CN (1) CN112534970A (enExample)
TW (1) TWI831816B (enExample)
WO (1) WO2020031613A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6979486B1 (ja) * 2020-06-25 2021-12-15 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258405A (ja) 2002-02-27 2003-09-12 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2006123308A (ja) 2004-10-28 2006-05-18 Brother Ind Ltd 薄板状部品の積層構造及びその製造方法
JP2012175081A (ja) 2011-02-24 2012-09-10 Hitachi Chem Co Ltd プリント配線板及びプリント配線板の製造方法
WO2013018344A1 (ja) 2011-07-29 2013-02-07 三洋電機株式会社 素子搭載用基板およびその製造方法、ならびに半導体モジュールおよびその製造方法
JP2013258405A (ja) 2012-06-08 2013-12-26 Tetrasun Inc 下層からのコーティングの選択的および／または高速化除去ならびにその太陽電池への適用
JP2014076528A (ja) 2012-10-12 2014-05-01 Murata Mfg Co Ltd 電子部品の製造方法
JP2015029078A (ja) 2013-06-27 2015-02-12 キヤノン・コンポーネンツ株式会社 フレキシブル配線板、発光装置、フレキシブル配線板の製造方法
JP2017204650A (ja) 2015-12-25 2017-11-16 太陽誘電株式会社 プリント配線板、及びカメラモジュール

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JPS6370489A (ja) * 1986-09-11 1988-03-30 松下電工株式会社 金属ベ−スプリント配線板の加工方法
JPH0766510A (ja) 1993-08-30 1995-03-10 Ibiden Co Ltd プリント配線板
JP2000091733A (ja) 1998-09-09 2000-03-31 Rohm Co Ltd ハイブリッド集積回路装置の製造方法とその製造方法に使用する素材基板の構造
TW511422B (en) * 2000-10-02 2002-11-21 Sanyo Electric Co Method for manufacturing circuit device
JP4503220B2 (ja) * 2002-07-25 2010-07-14 東洋製罐株式会社 多層体の切断方法および多層成型品
JP2005340385A (ja) 2004-05-25 2005-12-08 Nitto Denko Corp 配線回路基板および配線回路基板の接続構造
JP4515276B2 (ja) * 2005-01-31 2010-07-28 日東電工株式会社 配線回路基板集合体
JP2008053633A (ja) * 2006-08-28 2008-03-06 Mitsubishi Electric Corp プリント配線板及び分割方法
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
RU2469367C1 (ru) * 2008-08-27 2012-12-10 Шарп Кабусики Кайся Подложка активной матрицы, жидкокристаллическая панель, жидкокристаллический модуль отображения, жидкокристаллическое устройство отображения, телевизионный приемник и способ изготовления подложки активной матрицы
US8247888B2 (en) * 2009-04-28 2012-08-21 Dai Nippon Printing Co., Ltd. Semiconductor device and method for manufacturing metallic shielding plate
JP5319571B2 (ja) * 2010-02-12 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN107256903B (zh) * 2011-06-06 2021-06-01 帝斯曼先进太阳能有限公司 金属箔图案层叠体、金属箔层叠体、金属箔层叠基板、太阳能电池模块及其制造方法
KR20170105476A (ko) * 2015-01-22 2017-09-19 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법
JP6444273B2 (ja) * 2015-06-29 2018-12-26 シチズン時計株式会社 大判基板及びその製造方法
JP6534602B2 (ja) * 2015-11-17 2019-06-26 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258405A (ja) 2002-02-27 2003-09-12 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2006123308A (ja) 2004-10-28 2006-05-18 Brother Ind Ltd 薄板状部品の積層構造及びその製造方法
JP2012175081A (ja) 2011-02-24 2012-09-10 Hitachi Chem Co Ltd プリント配線板及びプリント配線板の製造方法
WO2013018344A1 (ja) 2011-07-29 2013-02-07 三洋電機株式会社 素子搭載用基板およびその製造方法、ならびに半導体モジュールおよびその製造方法
JP2013258405A (ja) 2012-06-08 2013-12-26 Tetrasun Inc 下層からのコーティングの選択的および／または高速化除去ならびにその太陽電池への適用
JP2014076528A (ja) 2012-10-12 2014-05-01 Murata Mfg Co Ltd 電子部品の製造方法
JP2015029078A (ja) 2013-06-27 2015-02-12 キヤノン・コンポーネンツ株式会社 フレキシブル配線板、発光装置、フレキシブル配線板の製造方法
JP2017204650A (ja) 2015-12-25 2017-11-16 太陽誘電株式会社 プリント配線板、及びカメラモジュール

Also Published As

Publication number Publication date
US20210185832A1 (en) 2021-06-17
TWI831816B (zh) 2024-02-11
CN112534970A (zh) 2021-03-19
US20220386463A1 (en) 2022-12-01
US12167544B2 (en) 2024-12-10
JP2020027880A (ja) 2020-02-20
JP2023164612A (ja) 2023-11-10
JP7685566B2 (ja) 2025-05-29
WO2020031613A1 (ja) 2020-02-13
TW202010372A (zh) 2020-03-01
US11452215B2 (en) 2022-09-20

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