CN111312576B - 基片处理系统、输送方法、输送程序和保持器具 - Google Patents

基片处理系统、输送方法、输送程序和保持器具 Download PDF

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Publication number
CN111312576B
CN111312576B CN201911193850.7A CN201911193850A CN111312576B CN 111312576 B CN111312576 B CN 111312576B CN 201911193850 A CN201911193850 A CN 201911193850A CN 111312576 B CN111312576 B CN 111312576B
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Prior art keywords
substrate
chamber
vacuum
consumable part
consumable
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Chinese (zh)
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CN111312576A (zh
Inventor
沼仓雅博
丰卷俊明
贝瀬精一
武山裕纪
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to CN202410793668.XA priority Critical patent/CN118737796B/zh
Priority to CN202410793615.8A priority patent/CN118737795A/zh
Priority to CN202410793422.2A priority patent/CN118737794B/zh
Publication of CN111312576A publication Critical patent/CN111312576A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1694—Program controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32899—Multiple chambers, e.g. cluster tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0471—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
CN201911193850.7A 2018-12-12 2019-11-28 基片处理系统、输送方法、输送程序和保持器具 Active CN111312576B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202410793668.XA CN118737796B (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793615.8A CN118737795A (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793422.2A CN118737794B (zh) 2018-12-12 2019-11-28 基片处理系统

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-232927 2018-12-12
JP2018232927 2018-12-12
JP2019047550A JP7126466B2 (ja) 2018-12-12 2019-03-14 基板処理システム、搬送方法、および搬送プログラム
JP2019-047550 2019-03-14

Related Child Applications (3)

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CN202410793615.8A Division CN118737795A (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793668.XA Division CN118737796B (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793422.2A Division CN118737794B (zh) 2018-12-12 2019-11-28 基片处理系统

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CN111312576A CN111312576A (zh) 2020-06-19
CN111312576B true CN111312576B (zh) 2024-07-05

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CN202410793422.2A Active CN118737794B (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793668.XA Active CN118737796B (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793615.8A Pending CN118737795A (zh) 2018-12-12 2019-11-28 基片处理系统

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CN202410793668.XA Active CN118737796B (zh) 2018-12-12 2019-11-28 基片处理系统
CN202410793615.8A Pending CN118737795A (zh) 2018-12-12 2019-11-28 基片处理系统

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US (2) US20260011593A1 (https=)
JP (6) JP7126466B2 (https=)
KR (5) KR102695160B1 (https=)
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TW (4) TWI843773B (https=)

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JP7519822B2 (ja) * 2020-06-19 2024-07-22 東京エレクトロン株式会社 収納モジュール、基板処理システムおよび消耗部材の搬送方法
JP7409976B2 (ja) 2020-06-22 2024-01-09 東京エレクトロン株式会社 プラズマ処理システム、プラズマ処理装置及びエッジリングの交換方法
JP7740921B2 (ja) 2020-08-17 2025-09-17 東京エレクトロン株式会社 搬送装置およびエンドエフェクタ
JP7486382B2 (ja) 2020-08-31 2024-05-17 東京エレクトロン株式会社 搬送装置および搬送方法
US11813757B2 (en) * 2020-10-13 2023-11-14 Applied Materials, Inc. Centerfinding for a process kit or process kit carrier at a manufacturing system
CN114582693B (zh) * 2020-11-30 2025-03-11 中微半导体设备(上海)股份有限公司 等离子体处理装置及其末端执行器、边缘环及方法
JP7574638B2 (ja) * 2020-12-18 2024-10-29 東京エレクトロン株式会社 基板を搬送する装置及び基板を処理するシステム並びに基板を搬送する方法。
JP7534048B2 (ja) * 2021-01-20 2024-08-14 東京エレクトロン株式会社 プラズマ処理システム及びプラズマ処理方法
JP7679136B2 (ja) * 2021-02-01 2025-05-19 東京エレクトロン株式会社 収納容器、処理システム及びベースプレート
JP7624844B2 (ja) 2021-02-26 2025-01-31 東京エレクトロン株式会社 基板収容装置および処理システム
WO2022186353A1 (ja) * 2021-03-05 2022-09-09 東京エレクトロン株式会社 基板処理装置および搬送方法
JP7534249B2 (ja) * 2021-03-24 2024-08-14 東京エレクトロン株式会社 プラズマ処理システム及び環状部材の取り付け方法
JP7744187B2 (ja) * 2021-09-15 2025-09-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システムおよび基板処理方法
KR102615218B1 (ko) * 2021-11-01 2023-12-15 세메스 주식회사 소모품 교체가 가능한 기판 처리 장치
KR102914465B1 (ko) * 2021-11-02 2026-01-21 세메스 주식회사 반송 로봇, 이를 가지는 기판 처리 장치
JP7775675B2 (ja) * 2021-11-29 2025-11-26 東京エレクトロン株式会社 基板の搬送を行う装置、及び基板の搬送を行う方法
KR102731436B1 (ko) * 2022-05-19 2024-11-18 피에스케이홀딩스 (주) 클램프 링 이탈 방지 가능한 기판 이송 장치 및 기판 이송 방법
WO2024071130A1 (ja) * 2022-09-30 2024-04-04 東京エレクトロン株式会社 基板処理システム
CN118922927A (zh) * 2022-09-30 2024-11-08 东京毅力科创株式会社 基片处理系统和输送方法
CN119998940A (zh) * 2022-10-07 2025-05-13 东京毅力科创株式会社 基片处理系统和输送方法
WO2025150433A1 (ja) * 2024-01-11 2025-07-17 東京エレクトロン株式会社 基板処理システム及び基板処理方法
WO2025225465A1 (ja) * 2024-04-26 2025-10-30 東京エレクトロン株式会社 メンテナンスシステム
CN118700016A (zh) * 2024-07-23 2024-09-27 吉姆西半导体科技(无锡)股份有限公司 一种晶圆加工设备

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