CN111304715B - 镀覆装置、镀覆方法 - Google Patents

镀覆装置、镀覆方法 Download PDF

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Publication number
CN111304715B
CN111304715B CN202010257887.8A CN202010257887A CN111304715B CN 111304715 B CN111304715 B CN 111304715B CN 202010257887 A CN202010257887 A CN 202010257887A CN 111304715 B CN111304715 B CN 111304715B
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power supply
supply member
substrate
plating
current
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CN111304715A (zh
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岭润子
中田勉
矢作光敏
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
    • H01L2224/1146—Plating
    • H01L2224/11462—Electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Robotics (AREA)
CN202010257887.8A 2015-08-28 2016-08-23 镀覆装置、镀覆方法 Active CN111304715B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015168969A JP6317299B2 (ja) 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ
JP2015-168969 2015-08-28
CN201610710826.6A CN106480480B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201610710826.6A Division CN106480480B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

Publications (2)

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CN111304715A CN111304715A (zh) 2020-06-19
CN111304715B true CN111304715B (zh) 2021-01-26

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CN201610710826.6A Active CN106480480B (zh) 2015-08-28 2016-08-23 镀覆装置、镀覆方法

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US (2) US10316426B2 (enExample)
JP (2) JP6317299B2 (enExample)
KR (1) KR102483669B1 (enExample)
CN (2) CN111304715B (enExample)
SG (1) SG10201607132XA (enExample)
TW (1) TWI687555B (enExample)

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WO2018161079A1 (en) 2017-03-03 2018-09-07 Harland Medical Systems, Inc. Coating composition comprised of a hydrophilic crosslinker, a hydrophobic crosslinker and optionally a hydrogel and methods of making and using the same
JP6859150B2 (ja) * 2017-03-22 2021-04-14 株式会社荏原製作所 めっき装置及びめっき槽構成の決定方法
US11299817B2 (en) * 2017-06-28 2022-04-12 Ebara Corporation Holder for holding substrate and system for plating
JP6891060B2 (ja) 2017-07-11 2021-06-18 株式会社荏原製作所 レギュレーションプレート、アノードホルダ、及び基板ホルダ
WO2019050962A1 (en) * 2017-09-05 2019-03-14 Harland Medical Systems, Inc. COATING APPARATUS WITH AUTOMATIC FLUID LEVEL SYSTEM, AND METHODS OF USING THE SAME
CN111247273B (zh) * 2017-10-20 2022-12-20 Almex 科技株式会社 表面处理装置和工件保持夹具
JP6975650B2 (ja) * 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
JP6993288B2 (ja) * 2018-05-07 2022-01-13 株式会社荏原製作所 めっき装置
JP7182911B2 (ja) * 2018-06-21 2022-12-05 株式会社荏原製作所 めっき装置、及びめっき方法
KR102111304B1 (ko) * 2018-08-09 2020-05-18 (주)선우하이테크 정전류 제어기능을 갖는 전기 도금 시스템 및 방법
CN108754590A (zh) * 2018-08-22 2018-11-06 深圳市创智成功科技有限公司 导电环、基于其的供电装置及基于供电装置的电镀治具
TWI728668B (zh) * 2019-01-31 2021-05-21 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
JP7079224B2 (ja) * 2019-06-14 2022-06-01 株式会社荏原製作所 めっき方法、めっき装置、プログラムを記憶する不揮発性の記憶媒体
JP7256708B2 (ja) 2019-07-09 2023-04-12 株式会社荏原製作所 めっき装置
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
TWI722555B (zh) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 電鍍治具
JP7296832B2 (ja) * 2019-09-10 2023-06-23 株式会社荏原製作所 めっき装置
US12152311B2 (en) * 2020-12-28 2024-11-26 Ebara Corporation Wetting method for substrate and plating apparatus
CN115119515B (zh) * 2021-01-20 2023-03-24 株式会社荏原制作所 镀覆装置以及基板的膜厚测定方法
CN114959842B (zh) * 2021-02-18 2024-06-07 日月光半导体制造股份有限公司 电镀装置及制造封装结构的方法
WO2022185435A1 (ja) * 2021-03-03 2022-09-09 株式会社荏原製作所 基板ホルダ、めっき装置、及びめっき装置の製造方法
JP7027622B1 (ja) * 2021-06-17 2022-03-01 株式会社荏原製作所 抵抗体、及び、めっき装置
JP7093478B1 (ja) * 2021-06-18 2022-06-29 株式会社荏原製作所 めっき装置及びめっき方法
US20250075364A1 (en) * 2021-10-18 2025-03-06 Ebara Corporation Method of plating and apparatus for plating
US20240209539A1 (en) * 2021-10-28 2024-06-27 Ebara Corporation Plating apparatus
JP7626695B2 (ja) * 2021-12-28 2025-02-04 株式会社荏原製作所 めっき装置およびめっき方法
CN117545879B (zh) * 2022-06-27 2024-12-31 株式会社荏原制作所 镀覆装置及镀覆方法

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CN103650113A (zh) * 2011-05-18 2014-03-19 应用材料公司 电化学处理器
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JP2018090911A (ja) 2018-06-14
US10316426B2 (en) 2019-06-11
CN106480480A (zh) 2017-03-08
TW201708623A (zh) 2017-03-01
JP6317299B2 (ja) 2018-04-25
KR102483669B1 (ko) 2023-01-02
US20170058423A1 (en) 2017-03-02
US20190249326A1 (en) 2019-08-15
KR20170026112A (ko) 2017-03-08
CN106480480B (zh) 2020-05-05
TWI687555B (zh) 2020-03-11
SG10201607132XA (en) 2017-03-30
CN111304715A (zh) 2020-06-19
JP6488041B2 (ja) 2019-03-20
US10513795B2 (en) 2019-12-24
JP2017043815A (ja) 2017-03-02

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