CN110494572A - 密封装置 - Google Patents

密封装置 Download PDF

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CN110494572A
CN110494572A CN201880024755.1A CN201880024755A CN110494572A CN 110494572 A CN110494572 A CN 110494572A CN 201880024755 A CN201880024755 A CN 201880024755A CN 110494572 A CN110494572 A CN 110494572A
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rotary damper
sealing device
steel band
furnace
roller
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CN110494572B (zh
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土居崇
笠井胜司
户部辉彦
小山琢实
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Jitomi Corp
JFE Steel Corp
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    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/52Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
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    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/74Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
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    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
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    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/52Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
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    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
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    • C23C16/24Deposition of silicon only
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45559Diffusion of reactive gas to substrate
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • C23C16/545Apparatus specially adapted for continuous coating for coating elongated substrates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/28Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity for treating continuous lengths of work
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F27D99/00Subject matter not provided for in other groups of this subclass
    • F27D99/0073Seals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
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Abstract

本发明的目的在于提供能够维持高密封性的密封装置。密封装置,其在供钢带通板的热处理设备内,所述密封装置具备旋转阻尼器、和在与所述旋转阻尼器相对的位置处被配置于所述钢带的下侧的辊,并且使钢带从所述旋转阻尼器与所述辊的相对部之间通板,所述旋转阻尼器被配置于所述钢带的上侧且能够与所述钢带接触,在所述密封装置中,成对的旋转阻尼器及辊在所述热处理设备内在通板方向上串联配置2对,非活性气体被供给至利用所述串联配置的所述成对的旋转阻尼器及辊彼此所分隔出的空间内。

Description

密封装置
技术领域
本发明涉及在例如钢板等钢带的热处理设备内设置的密封装置。特别地,涉及在通过具备化学气相沉积(下称CVD。)处理炉的连续渗硅处理设备来制造高硅钢板(6.5%Si钢)的热处理炉内设置的密封装置。
背景技术
以往,在金属材料的加热炉或者热处理炉中,将炉内的气氛维持为特定状态来实现热处理材料的外观上的性能的提高、或者材质的改善。作为在特定的炉内气氛中进行热处理、实现材质改善的方法,例如在专利文献1中记载有通过具有例如CVD处理炉的连续渗硅处理设备得到高硅钢板(6.5%Si钢)的方法。
就连续渗硅处理设备而言,图1所示那样的渗硅处理设备100由炉主体1构成,该炉主体1由形成隧道状空间的耐火物的炉壁形成。材质待改善的钢带(钢板)S按加热炉A-CVD处理炉B-扩散处理炉C-冷却炉D的顺序由辊2支撑而连续地通过炉内。此时,钢带S在加热炉A中在非氧化性气氛中被加热至CVD处理温度,然后被引导到CVD处理炉B中。向该CVD处理炉B中供给含有SiCl4的反应气体,反应气体被从吹喷喷嘴3喷射到钢带S的表面,进行渗硅处理。接着,钢带S被引导到扩散处理炉C中,在此被均热保持为规定的温度来进行Si的扩散处理。在这样的处理后,在冷却炉D中被冷却至常温或者适当的温度,并被卷绕为钢卷。
在连续渗硅处理设备这样的热处理炉中,为了将各炉内的气氛维持为特定状态,需要将材料的出入口等密封。即,必须可靠地进行加热炉A和CVD处理炉B之间、以及CVD处理炉B和扩散处理炉C之间的密封。为此,如图1所示,在各炉间设置有密封装置4。
关于这样的通过密封装置来提高密封性,例如在专利文献2中记载了下述这样的密封装置,其具备硬质材料的旋转阻尼器及辊、以及与所述旋转阻尼器的上方接触并将炉内密封的升降阻尼器,将旋转阻尼器与辊的轴间距离固定,并在旋转阻尼器中设置有旋转阻尼器与辊的半径的合计小于旋转阻尼器与辊的轴间距离的部分。由此,能够将与钢板等钢带的间隙设为极其微小,得到高密封性。
现有技术文献
专利文献
专利文献1:日本特开昭63-24038号公报
专利文献2:日本特开平7-268490号公报
发明内容
发明要解决的课题
但是,在专利文献2那样的密封装置的情况下,若成为在1000度以上的高温下的热处理,则位于紧靠旋转阻尼器下方的炉内辊将会偏心。其结果,钢带与旋转阻尼器的间隙变大,成为炉内气氛的泄漏路径。此外,靠近旋转阻尼器、炉内辊周边的耐火物(纤维)受CVD处理所用的SiCl4的影响而劣化,发生变薄、孔隙率的下降。因此,在旋转阻尼器、炉内辊的周边也产生间隙,这里可能成为泄漏路径。
本发明是鉴于上述情况做出的,其目的在于,提供能够维持高密封性的密封装置。
用于解决课题的手段
本申请的发明人深入研究了加热炉A和CVD处理炉B之间、以及CVD处理炉B和扩散处理炉C之间的密封性。结果发现,在专利文献2那样的用旋转阻尼器和辊将钢带上下夹住而得到密封性的密封装置中,通过将2个旋转阻尼器串联配置,并在该旋转阻尼器间引入N2等非活性气体,从而能够确保高密封性。
本发明是基于上述发现做出的,其要旨如下。
[1]密封装置,其在供钢带通板的热处理设备内,所述密封装置具备旋转阻尼器、和在与所述旋转阻尼器相对的位置处被配置于所述钢带的下侧的辊,并且使钢带从所述旋转阻尼器与所述辊的相对部之间通板,所述旋转阻尼器被配置于所述钢带的上侧且能够与所述钢带接触,所述密封装置中,成对的旋转阻尼器及辊在所述热处理设备内在通板方向上串联配置2对,非活性气体被供给至利用所述串联配置的所述成对的旋转阻尼器及辊彼此所分隔出的空间内。
[2]如[1]中记载的密封装置,其中,所述旋转阻尼器在钢带宽度方向上具有朝向所述钢带喷出非活性气体的孔。
[3]如[1]或[2]中记载的密封装置,其中,所述非活性气体的压力被设定为使得所述空间内的压力为5mmH2O~100mmH2O。
[4]如[1]至[3]任一项中记载的密封装置,其被设置于所述热处理设备内的CVD处理炉内。
[5]如[1]至[4]任一项中记载的密封装置,其被分别设置于所述热处理设备内的钢带通板方向上游侧及下游侧。
发明效果
根据本发明,由于在规定的空间内引入非活性气体,所以密封性提高。因此,能够减少炉内气氛气体的逆流。此外,根据本发明,通过提高密封性,能够减少各装置的更换频率、修理频率。
附图说明
图1是连续渗硅处理设备的概略图。
图2是本发明的一实施方式的密封装置的图。
图3是本发明的一实施方式的密封装置的放大图。
图4是表示本发明的其他实施方式的密封装置的图。
图5是对使用了本发明密封装置的情况下的缺陷发生率、以及使用以往密封装置的情况下的缺陷发生率进行比较的图。
图6是对使用了本发明的密封装置的情况下的旋转阻尼器的更换周期、以及使用以往密封装置的情况下的旋转阻尼器的更换周期进行比较的图。
具体实施方式
图2是表示本发明的一实施方式的密封装置的图。本发明的密封装置4设置于渗硅处理设备(热处理设备)100中的炉主体1内,成对旋转阻尼器5及辊6具有2对。
旋转阻尼器5被配置于钢带S的上侧。旋转阻尼器5以能够旋转的方式在横切炉主体1内的方向、即钢带长度方向上设置。对旋转阻尼器5的形状不特别限制,如图2所示,为在半径方向上设置了切口部分那样的、能够进行间隙调整那样的形状即可。升降阻尼器7设置于旋转阻尼器5的上方,并且设置为在炉主体1的顶板部中能够上下运动。通过升降阻尼器7的上升使旋转阻尼器5能够旋转,并且,通过使升降阻尼器7下降,对旋转阻尼器5的旋转动作进行适当控制。因此,以成为与热处理后的钢带S的厚度相应的距离的方式选择旋转阻尼器5的切口位置、并使升降阻尼器7下降来固定旋转阻尼器5以使之不旋转,由此,对针对钢带S的密封性进行适当操作。
辊6在与旋转阻尼器5相对的位置被配置于钢带S的下侧。辊6是在钢带宽度方向上支撑钢带S的支撑辊,钢带S从旋转阻尼器5与辊6的相对部之间通板。此外,作为密封壁的隔板8从炉主体1的底板部立起,并且在与旋转阻尼器5相对的位置与辊6相接触。
在本发明中,成对的旋转阻尼器5及辊6在通板方向上串联地配置2对。即,如图2所示,成对旋转阻尼器5及辊6在通板方向上串联地配置2组。如图2所示,非活性气体被供给至利用串联配置的成对的旋转阻尼器5及辊6彼此所分隔出的空间9内。通过用非活性气体充满空间9内,与炉内压力相比能够维持为高压,因此密封性提高,能够防止炉内气氛气体向其他炉中逆流的情况。此外,由于能够维持一定的密封性,所以能够减少靠近旋转阻尼器、炉内辊周边的耐火物(纤维)受CVD处理所用的SiCl4的影响而劣化的情况。因此,能够减少炉内辊等各装置的更换频率、周边的耐火物的修理频率。
对被供给到空间9内的非活性气体不特别限制,但是优选为N2。此外,对非活性气体的供给方法也不特别限制,例如在炉主体1的侧壁设置非活性气体的供给口(未图示),并从供给口向空间9内供给非活性气体即可。
在本发明中,优选旋转阻尼器5在钢带宽度方向上具有朝向钢带S喷出非活性气体的孔10。通过从旋转阻尼器5的孔10朝向钢带S喷出非活性气体,能够用非活性气体的气幕来将旋转阻尼器5和钢带S之间阻断。其结果,能够得到更高的密封性。
关于喷出非活性气体的孔10的排列,在钢带宽度方向上排列多个即可。对孔10的配置不特别限定,例如可以例举串联、交错、多排配置等。需要说明的是,图3是多排配置的例子。此外,对孔10的形状也不特别限定,例如可以例举圆孔、椭圆(宽度方向较长)、狭缝孔等。此外,对向旋转阻尼器5供给非活性气体的方法也不特别限定,例如从旋转阻尼器5的旋转轴部(未图示)供给非活性气体,从轴部穿过在旋转阻尼器5主体上设置的孔而喷出非活性气体即可。
需要说明的是,在从孔10喷出的非活性气体的压力过高或者温度过低的情况下,可能会针对在1000度以上的高温下被热处理的钢带产生变形等不良影响。因此,期望从旋转阻尼器5的孔向钢带喷射的非活性气体的压力为100mmH2O以下、温度为1000度以上。
作为非活性气体的压力,优选进行设定以使空间9内的压力为5mmH2O~100mmH2O。在空间9内的压力小于5mmH2O的情况下,压力过低而难以进行控制。另一方面,在空间9内的压力超过100mmH2O的情况下,由于旋转阻尼器5和钢带S间存在间隙,所以难以保持压力。更优选为10mmH2O~50mmH2O。
优选本发明的密封装置4设置于渗硅处理设备内100内的CVD处理炉B内。如前述,在CVD处理炉B中被供给含有SiCl4的反应气体,从吹喷喷嘴3向钢带S的表面喷射反应气体,从而进行渗硅处理。在该CVD处理炉B中的气氛中,作为渗硅处理时的副产物而含有氯化铁(气体)。若含有该氯化铁(气体)的CVD处理炉中的气氛气体逆流,则会在加热炉A、扩散热处理炉C内冷却,若低于1100℃则会凝聚并附着到钢带S上,由此使产品的外观恶化,缺陷发生率增加。因此,通过在CVD处理炉B中设置本发明的密封装置,能够维持高密封性,能够防止CVD处理炉B内的气氛气体的逆流。其结果,能够防止氯化铁附着导致的良品率恶化。
此外,优选本发明的密封装置4分别设置于钢带通板方向的上游侧以及下游侧。通过在上游侧以及下游侧分别设置密封装置,能够防止炉内气氛气体逆流到其他炉中的情况。更优选在CVD处理炉B内的钢带通板方向上游侧以及下游侧分别设置密封装置4(参见图4)。如图4所示,通过在渗硅处理前后的位置设置本发明的密封装置4,从而能够进一步防止CVD处理炉B内的气氛气体的逆流,并且能够进一步防止氯化铁附着导致的良品率恶化。
需要说明的是,对本发明的密封装置4的设置数不特别限制,从设备上的限制、维护的角度出发,优选为2~3个左右。
旋转阻尼器5例如为硬质材料即可。对形状等不特别限定,设置为在埋入炉主体1的顶板部中的状态下能够转动且周面的一部分在炉主体1内露出即可。此外,旋转阻尼器5设置为与辊6的垂直的上方平行即可。
此外,从能够使间隙极其微小且能够实现完全的密封状态的角度出发,优选如专利文献2那样将旋转阻尼器5和辊6的轴间距离固定、且在旋转阻尼器中设置有旋转阻尼器5与辊6的半径的合计小于旋转阻尼器5和辊6的轴间距离的部分。
此外,对升降阻尼器7也不特别限定。例如,由与旋转阻尼器5的上部平行地接触/分离的堰板状的陶瓷纤维形成、且设置为能够在炉主体1的顶部中上下运动即可。
实施例1
在具有如图1所示的设备结构的连续渗硅处理设备中,使用含有SiCl4的处理气体,对板厚0.1mm的钢带实施渗硅处理,制造了高硅钢带(6.5质量%Si硅材料)。此时,作为密封装置,使用图2所示的本发明的密封装置。成对的旋转阻尼器5及辊6在CVD处理炉B内的上游侧以及下游侧分别各设置2对。
由旋转阻尼器5和辊6形成的空间9的压力保持为30mmH2O。需要说明的是,与加热炉A、CVD处理炉B、扩散处理炉C的各炉内压力(20mmH2O)相比为高压。
求出了因气氛气体的逆流而氯化铁附着于钢带表面所导致的缺陷发生率。缺陷发生率的求法如下所示。
<缺陷发生率>
在发生了缺陷的情况下,将该缺陷部的前后1m作为缺陷长度,用1钢卷内的该缺陷长度的累计除以该钢卷的长度得到的结果作为缺陷发生率,以针对10个钢卷统计每个钢卷的缺陷发生率并进行平均而得的结果来进行比较。
在图5中示出在将作为以往密封装置使用了专利文献2的密封装置的情况下(比较例)的缺陷发生率设为1的情况下,比较使用了本发明的密封装置的情况下的缺陷发生率的结果。
从图5可知,与比较例相比,使用了本发明的密封装置的情况下(本发明例)的缺陷发生率减少至0.4。因此,通过使用本发明的密封装置,密封性提高,能够减少缺陷发生率。
实施例2
与实施例1同样制造高硅钢带,调查所使用的旋转阻尼器的更换周期。对于更换周期而言,将密封装置间压力与前后炉带的压力差连续为5mmH2O以下的情况判断为更换的时间点。在图6中示出将以往(变更前)的更换周期设为1而比较使用了本发明的密封装置的情况下的旋转阻尼器的更换周期的结果。
从图6可知,与比较例相比,使用了本发明的密封装置的情况下(本发明例)的更换周期成为1.5倍。因此,通过使用本发明的密封装置,密封性提高,能够减少更换频率。
附图标记说明
1 炉主体
2 辊
3 吹喷喷嘴
4 密封装置
5 旋转阻尼器
6 辊
7 升降阻尼器
8 隔板
9 空间
10 孔
100 渗硅处理设备
A 加热炉
B CVD处理炉
C 扩散处理炉
D 冷却炉
S 钢带(钢板)

Claims (5)

1.密封装置,其在供钢带通板的热处理设备内,
所述密封装置具备旋转阻尼器、和在与所述旋转阻尼器相对的位置处被配置于所述钢带的下侧的辊,并且使钢带从所述旋转阻尼器与所述辊的相对部之间通板,所述旋转阻尼器被配置于所述钢带的上侧且能够与所述钢带接触,
所述密封装置中,成对的旋转阻尼器及辊在所述热处理设备内在通板方向上串联配置2对,非活性气体被供给至利用所述串联配置的所述成对的旋转阻尼器及辊彼此所分隔出的空间内。
2.如权利要求1所述的密封装置,其中,所述旋转阻尼器在钢带宽度方向上具有朝向所述钢带喷出非活性气体的孔。
3.如权利要求1或2所述的密封装置,其中,所述非活性气体的压力被设定为使得所述空间内的压力为5mmH2O~100mmH2O。
4.如权利要求1至3中任一项所述的密封装置,其被设置于所述热处理设备内的CVD处理炉内。
5.如权利要求1至4中任一项所述的密封装置,其被分别设置于所述热处理设备内的钢带通板方向上游侧及下游侧。
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