MY189282A - Polysilicon manufacturing apparatus - Google Patents
Polysilicon manufacturing apparatusInfo
- Publication number
- MY189282A MY189282A MYPI2018700589A MYPI2018700589A MY189282A MY 189282 A MY189282 A MY 189282A MY PI2018700589 A MYPI2018700589 A MY PI2018700589A MY PI2018700589 A MYPI2018700589 A MY PI2018700589A MY 189282 A MY189282 A MY 189282A
- Authority
- MY
- Malaysia
- Prior art keywords
- rod
- manufacturing apparatus
- reaction chamber
- silicon
- polysilicon
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
- C23C16/466—Cooling of the substrate using thermal contact gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
- B01J4/001—Feed or outlet devices as such, e.g. feeding tubes
- B01J4/002—Nozzle-type elements
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/24—Stationary reactors without moving elements inside
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2208/00—Processes carried out in the presence of solid particles; Reactors therefor
- B01J2208/00008—Controlling the process
- B01J2208/00017—Controlling the temperature
- B01J2208/00106—Controlling the temperature by indirect heat exchange
- B01J2208/00318—Heat exchange inside a feeding nozzle or nozzle reactor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The present invention provides a polysilicon manufacturing apparatus that can prevent generation of popcorns in the entire CVD reaction process by cooling an upper portion of a silicon rod (40) where a rod bridge (31) is disposed. A polysilicon manufacturing apparatus according to an exemplary embodiment of the present invention includes: a reactor (10) provided on a base (21) and forming a reaction chamber (11); a pair of feedthroughs provided in the base (21) and extending into the reaction chamber (11); rod filament (30)s provided in the feedthroughs in the reaction chamber (11), connected with each other at upper ends thereof through a rod bridge (31), and where a silicon rod (40) of polysilicon is formed from a raw material gas through a chemical vapor deposition (CVD) process; and cooling spray nozzles spraying a cooling gas to the silicon rod (40) formed as silicon deposited around the rod bridge (31) and the rod filaments (30). Fig. 2
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150121963A KR101895526B1 (en) | 2015-08-28 | 2015-08-28 | Polysilicon manufacturing apparatus |
PCT/KR2016/009541 WO2017039246A1 (en) | 2015-08-28 | 2016-08-26 | Polysilicon preparation apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
MY189282A true MY189282A (en) | 2022-01-31 |
Family
ID=58188992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018700589A MY189282A (en) | 2015-08-28 | 2016-08-26 | Polysilicon manufacturing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180223432A1 (en) |
KR (1) | KR101895526B1 (en) |
CN (1) | CN107921403A (en) |
MY (1) | MY189282A (en) |
TW (1) | TWI605871B (en) |
WO (1) | WO2017039246A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113753899B (en) * | 2021-10-25 | 2022-05-03 | 江苏大学 | Heat preservation structure of reduction furnace, polycrystalline silicon reduction furnace and working method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1119457A (en) * | 1997-07-04 | 1999-01-26 | Niigata Eng Co Ltd | Gaseous hydrogen chloride absorption device |
JP4516318B2 (en) * | 2004-01-05 | 2010-08-04 | 株式会社日立国際電気 | Substrate processing apparatus and semiconductor device manufacturing method |
JP4495717B2 (en) * | 2006-12-08 | 2010-07-07 | 株式会社日立国際電気 | Substrate processing apparatus and semiconductor device manufacturing method |
US8961689B2 (en) * | 2008-03-26 | 2015-02-24 | Gtat Corporation | Systems and methods for distributing gas in a chemical vapor deposition reactor |
KR100892123B1 (en) * | 2008-12-31 | 2009-04-09 | (주)세미머티리얼즈 | Poly silicon deposition device |
CN102300808B (en) * | 2009-02-27 | 2013-08-21 | 株式会社德山 | Polycrystalline silicon rod and device for producing same |
US20120039760A1 (en) * | 2009-03-20 | 2012-02-16 | Hankook Silicon Co., Ltd. | Hermetic Container for Thermal Conversion Reaction |
US8399072B2 (en) * | 2009-04-24 | 2013-03-19 | Savi Research, Inc. | Process for improved chemcial vapor deposition of polysilicon |
JP5579634B2 (en) * | 2011-01-24 | 2014-08-27 | 信越化学工業株式会社 | Reactor for producing polycrystalline silicon and method for producing polycrystalline silicon |
KR101279414B1 (en) * | 2011-08-17 | 2013-06-27 | (주)세미머티리얼즈 | Apparatus for manufacturing polycrystalline silicon and method for manufacturing polycrystalline |
JP5917359B2 (en) * | 2012-10-16 | 2016-05-11 | 信越化学工業株式会社 | Method for supplying raw material gas for producing polycrystalline silicon and polycrystalline silicon |
CN104016349B (en) * | 2014-05-29 | 2015-09-30 | 姚迅 | A kind of production equipment of polycrystalline silicon rod and method thereof |
-
2015
- 2015-08-28 KR KR1020150121963A patent/KR101895526B1/en active IP Right Grant
-
2016
- 2016-08-26 WO PCT/KR2016/009541 patent/WO2017039246A1/en active Application Filing
- 2016-08-26 MY MYPI2018700589A patent/MY189282A/en unknown
- 2016-08-26 US US15/750,260 patent/US20180223432A1/en not_active Abandoned
- 2016-08-26 TW TW105127471A patent/TWI605871B/en active
- 2016-08-26 CN CN201680050302.7A patent/CN107921403A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20180223432A1 (en) | 2018-08-09 |
KR20170025477A (en) | 2017-03-08 |
CN107921403A (en) | 2018-04-17 |
TWI605871B (en) | 2017-11-21 |
TW201718084A (en) | 2017-06-01 |
WO2017039246A1 (en) | 2017-03-09 |
KR101895526B1 (en) | 2018-09-05 |
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