CN110383464B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN110383464B
CN110383464B CN201880015263.6A CN201880015263A CN110383464B CN 110383464 B CN110383464 B CN 110383464B CN 201880015263 A CN201880015263 A CN 201880015263A CN 110383464 B CN110383464 B CN 110383464B
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conductive member
mentioned
close contact
contact portion
electrode
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CN201880015263.6A
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Chinese (zh)
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CN110383464A (zh
Inventor
林英二
上泷领二
奥村知巳
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Denso Corp
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Denso Corp
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Priority claimed from PCT/JP2018/003734 external-priority patent/WO2018173511A1/ja
Publication of CN110383464A publication Critical patent/CN110383464A/zh
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201880015263.6A 2017-03-22 2018-02-05 半导体装置 Active CN110383464B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017-056316 2017-03-22
JP2017056316 2017-03-22
JP2017-117217 2017-06-14
JP2017117217A JP6696480B2 (ja) 2017-03-22 2017-06-14 半導体装置
PCT/JP2018/003734 WO2018173511A1 (ja) 2017-03-22 2018-02-05 半導体装置

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CN110383464A CN110383464A (zh) 2019-10-25
CN110383464B true CN110383464B (zh) 2023-06-30

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US (1) US10943859B2 (enExample)
JP (1) JP6696480B2 (enExample)
CN (1) CN110383464B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6696480B2 (ja) 2017-03-22 2020-05-20 株式会社デンソー 半導体装置
JP6737221B2 (ja) * 2017-04-11 2020-08-05 株式会社デンソー 電動パワーステアリング制御装置および電子ユニット。
JP2020145271A (ja) * 2019-03-05 2020-09-10 トヨタ自動車株式会社 半導体装置
JP7120150B2 (ja) * 2019-05-14 2022-08-17 株式会社デンソー 半導体モジュール
CN115244684A (zh) * 2020-03-11 2022-10-25 罗姆股份有限公司 半导体器件
JP7452233B2 (ja) * 2020-05-01 2024-03-19 株式会社デンソー 半導体装置および電力変換装置
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