CN1103511A - 精磨半导体晶片的边沿的方法 - Google Patents

精磨半导体晶片的边沿的方法 Download PDF

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Publication number
CN1103511A
CN1103511A CN94107806A CN94107806A CN1103511A CN 1103511 A CN1103511 A CN 1103511A CN 94107806 A CN94107806 A CN 94107806A CN 94107806 A CN94107806 A CN 94107806A CN 1103511 A CN1103511 A CN 1103511A
Authority
CN
China
Prior art keywords
semiconductor wafer
edge
working surface
diamond
cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN94107806A
Other languages
English (en)
Chinese (zh)
Inventor
安东·胡贝尔
乔基姆·琼格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of CN1103511A publication Critical patent/CN1103511A/zh
Pending legal-status Critical Current

Links

Classifications

    • H10P90/128—
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H10P90/129—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN94107806A 1993-07-29 1994-06-30 精磨半导体晶片的边沿的方法 Pending CN1103511A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4325518A DE4325518A1 (de) 1993-07-29 1993-07-29 Verfahren zur Glättung der Kante von Halbleiterscheiben
DEP4325518.3 1993-07-29

Publications (1)

Publication Number Publication Date
CN1103511A true CN1103511A (zh) 1995-06-07

Family

ID=6494026

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94107806A Pending CN1103511A (zh) 1993-07-29 1994-06-30 精磨半导体晶片的边沿的方法

Country Status (7)

Country Link
JP (1) JPH0760624A (enExample)
KR (1) KR950004435A (enExample)
CN (1) CN1103511A (enExample)
DE (1) DE4325518A1 (enExample)
IT (1) IT1272345B (enExample)
MY (1) MY130149A (enExample)
TW (1) TW260812B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102642253A (zh) * 2012-05-04 2012-08-22 上海华力微电子有限公司 一种硅片切边方法及其装置
CN104284755A (zh) * 2012-05-07 2015-01-14 信越半导体股份有限公司 圆板形工件用外周研磨装置
CN113182971A (zh) * 2021-05-12 2021-07-30 四川雅吉芯电子科技有限公司 一种单晶硅外延片高精度磨边装置
CN115551676A (zh) * 2020-06-08 2022-12-30 胜高股份有限公司 晶片外周部的研磨装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245151A (ja) * 1998-02-27 1999-09-14 Speedfam Co Ltd ワークの外周研磨装置
JP3197253B2 (ja) * 1998-04-13 2001-08-13 株式会社日平トヤマ ウエーハの面取り方法
JP2000158315A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法
KR20000076987A (ko) * 1999-03-31 2000-12-26 다구마시로오 피가공물 연삭방법 및 장치
JP3510584B2 (ja) * 2000-11-07 2004-03-29 スピードファム株式会社 円板形ワークの外周研磨装置
JP2002329687A (ja) * 2001-05-02 2002-11-15 Speedfam Co Ltd デバイスウエハの外周研磨装置及び研磨方法
JP3949941B2 (ja) * 2001-11-26 2007-07-25 株式会社東芝 半導体装置の製造方法および研磨装置
JP5112703B2 (ja) * 2007-01-18 2013-01-09 ダイトエレクトロン株式会社 ウェーハ面取り加工方法およびその装置
DE102009030294B4 (de) 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
JP2011194561A (ja) * 2010-02-26 2011-10-06 Nakamura Tome Precision Ind Co Ltd 円盤状ワークの面取装置
DE102013210057A1 (de) 2013-05-29 2014-12-04 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184662A (en) * 1981-05-09 1982-11-13 Hitachi Ltd Chamfering method and device of wafer
JPS5958827A (ja) * 1982-09-28 1984-04-04 Toshiba Corp 半導体ウエ−ハ、半導体ウエ−ハの製造方法及び半導体ウエ−ハの製造装置
JP2719855B2 (ja) * 1991-05-24 1998-02-25 信越半導体株式会社 ウエーハ外周の鏡面面取り装置
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
DE4120003A1 (de) * 1991-06-18 1992-12-24 Mueller Georg Nuernberg Vorrichtung und verfahren zum kantenverrunden von halbleiterronden
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102642253A (zh) * 2012-05-04 2012-08-22 上海华力微电子有限公司 一种硅片切边方法及其装置
CN102642253B (zh) * 2012-05-04 2014-12-10 上海华力微电子有限公司 一种硅片切边方法及其装置
CN104284755A (zh) * 2012-05-07 2015-01-14 信越半导体股份有限公司 圆板形工件用外周研磨装置
US9358655B2 (en) 2012-05-07 2016-06-07 Shin-Etsu Handotai Co., Ltd. Outer periphery polishing apparatus for disc-shaped workpiece
CN115551676A (zh) * 2020-06-08 2022-12-30 胜高股份有限公司 晶片外周部的研磨装置
US12485513B2 (en) 2020-06-08 2025-12-02 Sumco Corporation Device for polishing outer periphery of wafer
CN113182971A (zh) * 2021-05-12 2021-07-30 四川雅吉芯电子科技有限公司 一种单晶硅外延片高精度磨边装置

Also Published As

Publication number Publication date
IT1272345B (it) 1997-06-16
ITRM940495A1 (it) 1996-01-27
TW260812B (enExample) 1995-10-21
ITRM940495A0 (it) 1994-07-27
JPH0760624A (ja) 1995-03-07
DE4325518A1 (de) 1995-02-02
MY130149A (en) 2007-06-29
KR950004435A (ko) 1995-02-18

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C06 Publication
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C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: German Burghausen

Applicant after: Wacker Siltronic Gesellschaft Fuer, Halbleitermaterialien mbH

Address before: German Burghausen

Applicant before: Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe mbH

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: WACKER-CHEMITRONIC GESELLSCHAFT FUER ELEKTRONIK-GRUNDSTOFFE MBH TO: WACKER SILTRNOIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN MBH

C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication