JPH0760624A - 半導体円板のエッジを研磨する方法 - Google Patents

半導体円板のエッジを研磨する方法

Info

Publication number
JPH0760624A
JPH0760624A JP6189009A JP18900994A JPH0760624A JP H0760624 A JPH0760624 A JP H0760624A JP 6189009 A JP6189009 A JP 6189009A JP 18900994 A JP18900994 A JP 18900994A JP H0760624 A JPH0760624 A JP H0760624A
Authority
JP
Japan
Prior art keywords
edge
semiconductor
semiconductor disk
polishing
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6189009A
Other languages
English (en)
Japanese (ja)
Inventor
Anton Huber
アントン・フーバー
Joachim Junge
ヨアシム・ユンゲ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of JPH0760624A publication Critical patent/JPH0760624A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P90/128—
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H10P90/129—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP6189009A 1993-07-29 1994-07-20 半導体円板のエッジを研磨する方法 Pending JPH0760624A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4325518A DE4325518A1 (de) 1993-07-29 1993-07-29 Verfahren zur Glättung der Kante von Halbleiterscheiben
DE43-25-518-3 1993-07-29

Publications (1)

Publication Number Publication Date
JPH0760624A true JPH0760624A (ja) 1995-03-07

Family

ID=6494026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6189009A Pending JPH0760624A (ja) 1993-07-29 1994-07-20 半導体円板のエッジを研磨する方法

Country Status (7)

Country Link
JP (1) JPH0760624A (enExample)
KR (1) KR950004435A (enExample)
CN (1) CN1103511A (enExample)
DE (1) DE4325518A1 (enExample)
IT (1) IT1272345B (enExample)
MY (1) MY130149A (enExample)
TW (1) TW260812B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177348A (ja) * 2007-01-18 2008-07-31 M Tec Kk ウェーハ面取り加工方法およびその装置
CN102189460A (zh) * 2010-02-26 2011-09-21 中村留精密工业株式会社 圆盘状工件的倒角装置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245151A (ja) * 1998-02-27 1999-09-14 Speedfam Co Ltd ワークの外周研磨装置
JP3197253B2 (ja) * 1998-04-13 2001-08-13 株式会社日平トヤマ ウエーハの面取り方法
JP2000158315A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法
KR20000076987A (ko) * 1999-03-31 2000-12-26 다구마시로오 피가공물 연삭방법 및 장치
JP3510584B2 (ja) * 2000-11-07 2004-03-29 スピードファム株式会社 円板形ワークの外周研磨装置
JP2002329687A (ja) * 2001-05-02 2002-11-15 Speedfam Co Ltd デバイスウエハの外周研磨装置及び研磨方法
JP3949941B2 (ja) * 2001-11-26 2007-07-25 株式会社東芝 半導体装置の製造方法および研磨装置
DE102009030294B4 (de) 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
CN102642253B (zh) * 2012-05-04 2014-12-10 上海华力微电子有限公司 一种硅片切边方法及其装置
SG11201406456XA (en) * 2012-05-07 2015-02-27 Shinetsu Handotai Kk Outer periphery polishing apparatus for disk-shaped workpiece
DE102013210057A1 (de) 2013-05-29 2014-12-04 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
JP7562994B2 (ja) * 2020-06-08 2024-10-08 株式会社Sumco ウェーハ外周部の研磨装置
CN113182971B (zh) * 2021-05-12 2022-11-25 四川雅吉芯电子科技有限公司 一种单晶硅外延片高精度磨边装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184662A (en) * 1981-05-09 1982-11-13 Hitachi Ltd Chamfering method and device of wafer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958827A (ja) * 1982-09-28 1984-04-04 Toshiba Corp 半導体ウエ−ハ、半導体ウエ−ハの製造方法及び半導体ウエ−ハの製造装置
JP2719855B2 (ja) * 1991-05-24 1998-02-25 信越半導体株式会社 ウエーハ外周の鏡面面取り装置
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
DE4120003A1 (de) * 1991-06-18 1992-12-24 Mueller Georg Nuernberg Vorrichtung und verfahren zum kantenverrunden von halbleiterronden
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184662A (en) * 1981-05-09 1982-11-13 Hitachi Ltd Chamfering method and device of wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177348A (ja) * 2007-01-18 2008-07-31 M Tec Kk ウェーハ面取り加工方法およびその装置
CN102189460A (zh) * 2010-02-26 2011-09-21 中村留精密工业株式会社 圆盘状工件的倒角装置
JP2011194561A (ja) * 2010-02-26 2011-10-06 Nakamura Tome Precision Ind Co Ltd 円盤状ワークの面取装置

Also Published As

Publication number Publication date
IT1272345B (it) 1997-06-16
ITRM940495A1 (it) 1996-01-27
CN1103511A (zh) 1995-06-07
TW260812B (enExample) 1995-10-21
ITRM940495A0 (it) 1994-07-27
DE4325518A1 (de) 1995-02-02
MY130149A (en) 2007-06-29
KR950004435A (ko) 1995-02-18

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