CN110117799A - 附载体铜箔 - Google Patents

附载体铜箔 Download PDF

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Publication number
CN110117799A
CN110117799A CN201910106665.3A CN201910106665A CN110117799A CN 110117799 A CN110117799 A CN 110117799A CN 201910106665 A CN201910106665 A CN 201910106665A CN 110117799 A CN110117799 A CN 110117799A
Authority
CN
China
Prior art keywords
resin
layer
copper
carrier
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910106665.3A
Other languages
English (en)
Chinese (zh)
Inventor
古曳伦也
永浦友太
坂口和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012271613A external-priority patent/JP5286443B1/ja
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN110117799A publication Critical patent/CN110117799A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201910106665.3A 2012-11-20 2013-11-20 附载体铜箔 Pending CN110117799A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012-254793 2012-11-20
JP2012254793 2012-11-20
JP2012-271613 2012-12-12
JP2012271613A JP5286443B1 (ja) 2012-11-20 2012-12-12 キャリア付き銅箔
JP2013-187783 2013-09-10
JP2013187783 2013-09-10
CN201380060497.XA CN104812944B (zh) 2012-11-20 2013-11-20 附载体铜箔

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380060497.XA Division CN104812944B (zh) 2012-11-20 2013-11-20 附载体铜箔

Publications (1)

Publication Number Publication Date
CN110117799A true CN110117799A (zh) 2019-08-13

Family

ID=50776138

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201910106665.3A Pending CN110117799A (zh) 2012-11-20 2013-11-20 附载体铜箔
CN201380060497.XA Active CN104812944B (zh) 2012-11-20 2013-11-20 附载体铜箔
CN201711470157.0A Pending CN108277509A (zh) 2012-11-20 2013-11-20 附载体铜箔
CN201911075883.1A Pending CN110863221A (zh) 2012-11-20 2013-11-20 附载体铜箔

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201380060497.XA Active CN104812944B (zh) 2012-11-20 2013-11-20 附载体铜箔
CN201711470157.0A Pending CN108277509A (zh) 2012-11-20 2013-11-20 附载体铜箔
CN201911075883.1A Pending CN110863221A (zh) 2012-11-20 2013-11-20 附载体铜箔

Country Status (6)

Country Link
JP (1) JP2015078422A (ko)
KR (4) KR102051787B1 (ko)
CN (4) CN110117799A (ko)
PH (1) PH12015501129A1 (ko)
TW (1) TWI504504B (ko)
WO (1) WO2014080959A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112226790A (zh) * 2020-10-19 2021-01-15 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
CN112792339A (zh) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 钨合金薄片的制备方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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JP5746402B2 (ja) * 2013-06-13 2015-07-08 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、及び、プリント配線板の製造方法
US10893616B2 (en) 2015-08-11 2021-01-12 Showa Denko Materials Co., Ltd. Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board
JP2017035843A (ja) * 2015-08-11 2017-02-16 日立化成株式会社 接着層付き金属箔、これを用いた金属張積層板および多層プリント配線板
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
CN106544709B (zh) * 2016-11-03 2019-04-05 山东金宝电子股份有限公司 一种提高电解铜箔高温防氧化性能的表面处理工艺
CN106757181B (zh) * 2016-11-16 2019-04-16 山东金宝电子股份有限公司 一种超薄载体铜箔的制备方法
CN106757245B (zh) * 2016-11-16 2019-05-21 山东金宝电子股份有限公司 一种黑化铜箔的表面处理工艺
JP7356209B2 (ja) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2019131093A1 (ja) * 2017-12-26 2019-07-04 Ｊｘ金属株式会社 放熱用銅箔及び放熱部材
KR102302184B1 (ko) * 2018-02-01 2021-09-13 에스케이넥실리스 주식회사 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법
CN110079840A (zh) * 2019-04-26 2019-08-02 山东金宝电子股份有限公司 一种提高铜箔高温防氧化性能的表面处理混合添加剂
TWI748769B (zh) * 2020-11-27 2021-12-01 臻鼎科技股份有限公司 高分子分散液及其製備方法、高分子複合膜及其應用
EP4317532A1 (en) * 2021-03-25 2024-02-07 Namics Corporation Method for manufacturing laminate
CN113286439A (zh) * 2021-07-22 2021-08-20 深圳市志金电子有限公司 一种内置引线电镀线路板制作方法

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CN105189829A (zh) * 2013-06-13 2015-12-23 Jx日矿日石金属株式会社 附载体的铜箔、覆铜积层板、印刷电路板、电子机器、及印刷电路板的制造方法

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CN105189829A (zh) * 2013-06-13 2015-12-23 Jx日矿日石金属株式会社 附载体的铜箔、覆铜积层板、印刷电路板、电子机器、及印刷电路板的制造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112226790A (zh) * 2020-10-19 2021-01-15 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
CN112792339A (zh) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 钨合金薄片的制备方法

Also Published As

Publication number Publication date
TWI504504B (zh) 2015-10-21
KR102015838B1 (ko) 2019-08-29
CN104812944B (zh) 2019-02-19
WO2014080959A1 (ja) 2014-05-30
KR20190025739A (ko) 2019-03-11
KR20160145198A (ko) 2016-12-19
TW201434622A (zh) 2014-09-16
CN110863221A (zh) 2020-03-06
KR101954051B1 (ko) 2019-03-05
PH12015501129A1 (en) 2015-08-03
KR20190103452A (ko) 2019-09-04
KR102051787B1 (ko) 2019-12-03
JP2015078422A (ja) 2015-04-23
KR20150086541A (ko) 2015-07-28
CN108277509A (zh) 2018-07-13
CN104812944A (zh) 2015-07-29

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190813

WD01 Invention patent application deemed withdrawn after publication