JP2015078422A - キャリア付き銅箔 - Google Patents

キャリア付き銅箔 Download PDF

Info

Publication number
JP2015078422A
JP2015078422A JP2013240475A JP2013240475A JP2015078422A JP 2015078422 A JP2015078422 A JP 2015078422A JP 2013240475 A JP2013240475 A JP 2013240475A JP 2013240475 A JP2013240475 A JP 2013240475A JP 2015078422 A JP2015078422 A JP 2015078422A
Authority
JP
Japan
Prior art keywords
resin
layer
carrier
copper foil
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013240475A
Other languages
English (en)
Japanese (ja)
Inventor
倫也 古曳
Michiya Kohiki
倫也 古曳
友太 永浦
Yuta Nagaura
友太 永浦
和彦 坂口
Kazuhiko Sakaguchi
和彦 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2013240475A priority Critical patent/JP2015078422A/ja
Publication of JP2015078422A publication Critical patent/JP2015078422A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2013240475A 2012-11-20 2013-11-20 キャリア付き銅箔 Pending JP2015078422A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013240475A JP2015078422A (ja) 2012-11-20 2013-11-20 キャリア付き銅箔

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012254793 2012-11-20
JP2012254793 2012-11-20
JP2013187783 2013-09-10
JP2013187783 2013-09-10
JP2013240475A JP2015078422A (ja) 2012-11-20 2013-11-20 キャリア付き銅箔

Publications (1)

Publication Number Publication Date
JP2015078422A true JP2015078422A (ja) 2015-04-23

Family

ID=50776138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013240475A Pending JP2015078422A (ja) 2012-11-20 2013-11-20 キャリア付き銅箔

Country Status (6)

Country Link
JP (1) JP2015078422A (ko)
KR (4) KR20150086541A (ko)
CN (4) CN104812944B (ko)
PH (1) PH12015501129A1 (ko)
TW (1) TWI504504B (ko)
WO (1) WO2014080959A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017035843A (ja) * 2015-08-11 2017-02-16 日立化成株式会社 接着層付き金属箔、これを用いた金属張積層板および多層プリント配線板
JP2018172785A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
US10893616B2 (en) 2015-08-11 2021-01-12 Showa Denko Materials Co., Ltd. Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5746402B2 (ja) * 2013-06-13 2015-07-08 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、及び、プリント配線板の製造方法
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
CN106544709B (zh) * 2016-11-03 2019-04-05 山东金宝电子股份有限公司 一种提高电解铜箔高温防氧化性能的表面处理工艺
CN106757245B (zh) * 2016-11-16 2019-05-21 山东金宝电子股份有限公司 一种黑化铜箔的表面处理工艺
CN106757181B (zh) * 2016-11-16 2019-04-16 山东金宝电子股份有限公司 一种超薄载体铜箔的制备方法
WO2019131093A1 (ja) * 2017-12-26 2019-07-04 Ｊｘ金属株式会社 放熱用銅箔及び放熱部材
KR102302184B1 (ko) * 2018-02-01 2021-09-13 에스케이넥실리스 주식회사 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법
CN110079840A (zh) * 2019-04-26 2019-08-02 山东金宝电子股份有限公司 一种提高铜箔高温防氧化性能的表面处理混合添加剂
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
TWI748769B (zh) * 2020-11-27 2021-12-01 臻鼎科技股份有限公司 高分子分散液及其製備方法、高分子複合膜及其應用
CN112792339A (zh) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 钨合金薄片的制备方法
CN116745462A (zh) * 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法
CN113286439A (zh) * 2021-07-22 2021-08-20 深圳市志金电子有限公司 一种内置引线电镀线路板制作方法
WO2024170635A1 (en) 2023-02-15 2024-08-22 Technische Hochschule Ingolstadt Copper-containing metal foil and method for producing a copper-containing metal foil

Family Cites Families (22)

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KR970006751B1 (ko) * 1993-12-13 1997-04-30 주식회사 코오롱 글라스 에폭시 적층판용 에폭시수지 조성물
WO2004005588A1 (ja) 2002-07-04 2004-01-15 Mitsui Mining & Smelting Co.,Ltd. キャリア箔付電解銅箔
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
US7341796B2 (en) * 2004-02-17 2008-03-11 Nippon Mining & Metals Co., Ltd Copper foil having blackened surface or layer
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
TW200704833A (en) * 2005-06-13 2007-02-01 Mitsui Mining & Smelting Co Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
JP4429979B2 (ja) 2005-06-29 2010-03-10 古河電気工業株式会社 キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法
CN101297067A (zh) * 2005-10-31 2008-10-29 三井金属矿业株式会社 电解铜箔的制造方法、该制造方法得到的电解铜箔、使用该电解铜箔得到的表面处理铜箔以及使用该电解铜箔或该表面处理铜箔得到的覆铜层压板
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
JP5129642B2 (ja) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
KR101497736B1 (ko) * 2007-08-28 2015-03-02 스미토모 베이클리트 컴퍼니 리미티드 다층 프린트 배선판용 절연 수지 조성물, 기재 부착 절연 수지 시트, 다층 프린트 배선판 및 반도체 장치
KR101271008B1 (ko) * 2008-05-26 2013-06-04 미쓰이 긴조꾸 고교 가부시키가이샤 다층 플렉서블 프린트 배선판의 접착층 형성용 수지 조성물
JP5224415B2 (ja) * 2008-07-31 2013-07-03 古河電気工業株式会社 電気電子部品用銅合金材料とその製造方法
JP5522051B2 (ja) * 2008-10-29 2014-06-18 住友ベークライト株式会社 多層プリント配線板及び半導体装置
WO2010110061A1 (ja) * 2009-03-25 2010-09-30 日鉱金属株式会社 電気抵抗膜付き金属箔及びその製造方法
KR101682886B1 (ko) * 2009-07-14 2016-12-06 아지노모토 가부시키가이샤 동박이 부착된 접착 필름
JP2010006071A (ja) 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
EP2615196A1 (en) * 2010-10-06 2013-07-17 Furukawa Electric Co., Ltd. Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
CN102452197B (zh) * 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
US20130256140A1 (en) * 2010-11-15 2013-10-03 Jx Nippon Mining & Metals Corporation Electrolytic copper foil
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
KR101762049B1 (ko) * 2013-06-13 2017-07-26 제이엑스금속주식회사 캐리어 부착 구리박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 및, 프린트 배선판의 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017035843A (ja) * 2015-08-11 2017-02-16 日立化成株式会社 接着層付き金属箔、これを用いた金属張積層板および多層プリント配線板
US10893616B2 (en) 2015-08-11 2021-01-12 Showa Denko Materials Co., Ltd. Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board
JP2018172785A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Also Published As

Publication number Publication date
KR102015838B1 (ko) 2019-08-29
CN104812944B (zh) 2019-02-19
CN110117799A (zh) 2019-08-13
CN104812944A (zh) 2015-07-29
KR20190103452A (ko) 2019-09-04
KR101954051B1 (ko) 2019-03-05
KR20160145198A (ko) 2016-12-19
CN108277509A (zh) 2018-07-13
WO2014080959A1 (ja) 2014-05-30
TW201434622A (zh) 2014-09-16
KR20190025739A (ko) 2019-03-11
KR20150086541A (ko) 2015-07-28
PH12015501129A1 (en) 2015-08-03
TWI504504B (zh) 2015-10-21
CN110863221A (zh) 2020-03-06
KR102051787B1 (ko) 2019-12-03

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