CN110092656B - 电介质陶瓷组合物、电子部件及层叠陶瓷电容器 - Google Patents

电介质陶瓷组合物、电子部件及层叠陶瓷电容器 Download PDF

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CN110092656B
CN110092656B CN201910072676.4A CN201910072676A CN110092656B CN 110092656 B CN110092656 B CN 110092656B CN 201910072676 A CN201910072676 A CN 201910072676A CN 110092656 B CN110092656 B CN 110092656B
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ceramic composition
dielectric ceramic
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dielectric
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CN110092656A (zh
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高野弘介
佐佐木桃世
兼子俊彦
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Abstract

本发明提供一种具有优异的可靠性的电介质陶瓷组合物及适用了该电介质陶瓷组合物的电子部件。一种电介质陶瓷组合物,其在A表示A位点的元素、B表示B位点的元素、O表示氧元素的情况下,以通式ABO3表示的钙钛矿型化合物为主成分,A包含Ba,A进一步包含选自Ca及Sr中的至少1种,B包含Ti,由X射线衍射法求得的烧结体晶格体积为
Figure DDA0001957754680000011
以下。

Description

电介质陶瓷组合物、电子部件及层叠陶瓷电容器
技术领域
本发明涉及一种电介质陶瓷组合物及适用有该电介质陶瓷组合物的电子部件、特别是层叠陶瓷电容器。
背景技术
层叠陶瓷电容器从其可靠性的高度和成本的廉价性方面考虑,被用于许多电子设备。其中,近年来,对用作车载用的层叠陶瓷电容器的电介质层,要求高的可靠性。
一直以来,在具备以钙钛矿型化合物为主成分的电介质陶瓷组合物作为电介质层的层叠陶瓷电容器中,有在电介质陶瓷组合物的晶粒中形成氧缺陷的倾向。而且,对这样的电介质陶瓷组合物施加电场时,氧缺陷缓慢地移动至阴极侧,成为可靠性降低的原因。
对此,例如专利文献1中公开有通过控制电介质层中的添加物的分布来抑制氧缺陷量的偏差的技术。但是,该情况下,有时在电介质陶瓷组合物的特性上产生偏差,有可能无法得到充分的可靠性。
另外,关于成为电介质陶瓷组合物的原料的母材,研究了各种制造方法。
例如,专利文献2中公开了作为原料,使用氧化钛、碳酸钙及氢氧化钡,利用固相法得到母材的技术。
专利文献3中公开了将钛酸钡、稀土氧化物、氧化钙及氧化镁在900~1100℃下进行煅烧而得到煅烧物,将其作为原料得到电介质陶瓷组合物的技术。
专利文献4中公开了一边将钛酸钡和氢氧化钙进行搅拌一边煮沸,从而得到钛酸钡钙的技术。
现有技术文献
专利文献
专利文献1:日本特开2017-108128号公报
专利文献2:日本特开2012-176857号公报
专利文献3:日本特开2001-143955号公报
专利文献4:日本特开2006-89368号公报
发明内容
发明所要解决的技术问题
本发明的目的在于提供一种具有良好的可靠性的电介质陶瓷组合物及适用了该电介质陶瓷组合物的电子部件、特别是层叠陶瓷电容器。
用于解决问题的技术方案
本发明者们为了实现上述目的进行了深入研究,直至完成本发明。
即,本发明的电介质陶瓷组合物为在A表示A位点的元素、B表示B位点的元素、O表示氧元素的情况下,以通式ABO3表示的钙钛矿型化合物为主成分的电介质陶瓷组合物,其中,
A包含Ba,
A进一步包含选自Ca及Sr中的至少1种,
B包含Ti,
由X射线衍射法求得的烧结体晶格体积为
Figure GDA0003247180020000021
以下。
本发明的电介质陶瓷组合物通过这样成为规定值以下的烧结体晶格体积,从而具有可靠性变得良好的效果。
优选由X射线衍射法求得的所述电介质陶瓷组合物的烧结体晶格体积为
Figure GDA0003247180020000023
以下。
优选所述电介质陶瓷组合物的A包含Ca。
优选由X射线衍射法求得的所述电介质陶瓷组合物的烧结体晶格体积为
Figure GDA0003247180020000022
以上。
本发明的电子部件只要是具有上述电介质陶瓷组合物的电子部件,就没有特别限定,可以列举例如交替地层叠有电介质层和内部电极层的层叠陶瓷电容器等。
附图说明
图1是本实施方式的层叠陶瓷电容器的剖视图。
图2A是表示本实施方式的烧结体的X射线衍射的测定方法的剖视图。
图2B是表示本实施方式的烧结体的X射线衍射的测定方法的剖视图,并且是图2A所示的IIB部的放大剖视图。
图3A是表示本实施方式的母材的X射线衍射的测定方法的剖视图。
图3B是表示本实施方式的母材的X射线衍射的测定方法的剖视图。
图4A是实施例的试样编号10及试样编号21的XRD图案。
图4B是实施例的试样编号10及试样编号21的XRD图案。
符号的说明:
1…层叠陶瓷电容器
10…电容器元件主体
10a…电容器元件主体的上表面
11…外层区域
13…内层区域
2…内层电介质层
2a…母材
20a…被压制后的母材的上表面
3…内部电极层
4…外部电极
30…树脂
30a…树脂的上表面
40…模具
40a…模具的上表面
42…空腔
44…板
具体实施方式
以下,基于附图所示的实施方式,对本发明进行说明。
层叠陶瓷电容器的整体结构
图1是本实施方式的层叠陶瓷电容器1的剖视图。
如图1所示,本实施方式的层叠陶瓷电容器1具有包含交替地层叠有内层电介质层2和内部电极层3的结构的电容器元件主体10。
交替地层叠内层电介质层2和内部电极层3的部分为内层区域13。
另外,电容器元件主体10在其层叠方向Z(Z轴)的两端面具有外层区域11。外层区域11是将比构成内层区域13的内层电介质层2厚的外层电介质层层叠多层而形成的。
此外,以下,有时将“内层电介质层2”及“外层电介质层”一并记为“电介质层”。
在电容器元件主体10的X轴两端部形成分别与在电容器元件主体10的内部交替地配置的内部电极层3导通的一对外部电极4。对电容器元件主体10的形状没有特别限制,通常设为长方体状。
内层电介质层2的厚度根据用途等适当确定即可,通常每一层为0.5~20μm左右。此外,内层电介质层2的层叠数通常为2~1000左右。
构成外层区域11的外层电介质层的总厚度也根据用途等适当确定即可,通常为15~300μm左右。
内部电极层3以各端面在电容器元件主体10的相对的2端部的表面交替地露出的方式层叠。一对外部电极4形成于电容器元件主体10的两端部,与交替地配置的内部电极层3的露出端面连接,构成电容器电路。
内部电极层3中所含的导电材料没有特别限定,由于电介质层的构成材料具有耐还原性,因此,可以使用贱金属。作为用作导电材料的贱金属,优选Ni或Ni合金。作为Ni合金,优选选自Mn、Cr、Co及Al中的1种以上的元素与Ni的合金,合金中的Ni含量优选为95重量%以上。此外,在Ni或Ni合金中,可以含有P等各种微量成分0.1重量%左右以下。内部电极层3的厚度根据用途等适当确定即可。
外部电极4中所含的导电材料没有特别限定,本实施方式中,可以使用廉价的Ni、Cu、或它们的合金。外部电极4的厚度根据用途等适当确定即可。
电介质层
内层电介质层2及构成外层区域11的外层电介质层的材质可以相同,也可以不同。
电介质层由本实施方式的电介质陶瓷组合物构成。本实施方式的电介质陶瓷组合物在A表示A位点的元素、B表示B位点的元素、O表示氧元素的情况下,以通式ABO3表示的钙钛矿型化合物为主成分。
本实施方式的电介质陶瓷组合物包含Ba作为A位点的元素,进一步包含选自Ca及Sr中的至少1种作为A位点的元素。由此,可靠性变得良好。
将电介质陶瓷组合物中的Ba、Ca及Sr的合计设为100摩尔份时,在电介质陶瓷组合物中,优选含有Ba 99摩尔份~90摩尔份,更优选含有95摩尔份~90摩尔份。
电介质陶瓷组合物中的Ca或Sr优选以(Ba+Ca+Sr)/(Ti+Zr)比成为1的方式含有。由此,容易使烧结体晶格体积成为规定值以下。
此外,优选在A位点上包含Ca。由此,可以进一步改善高温负荷寿命(HALT)。
本实施方式的电介质陶瓷组合物在B位点包含Ti。由此,容易使烧结体晶格体积为规定值以下。
另外,B位点可以进一步包含Zr及Hf。Hf为附随于Zr的元素,相对于Zr和Hf的合计100摩尔份,Hf优选为0.10摩尔份~2.00摩尔份。
将电介质陶瓷组合物中的Ti、Zr及Hf的合计设为100摩尔份时,在电介质陶瓷组合物中,优选含有Ti 100摩尔份~95摩尔份,更优选含有100摩尔份~99摩尔份。
电介质陶瓷组合物中的Zr及Hf优选以(Ba+Ca+Sr)/(Ti+Zr)比成为1的方式含有。由此,容易使烧结体晶格体积为规定值以下。
就本实施方式的构成内层电介质层2的电介质陶瓷组合物而言,由X射线衍射法求出的烧结体晶格体积(以下,称为“烧结体晶格体积”)为
Figure GDA0003247180020000051
以下。由此,可靠性变得良好。此外,在此,可靠性是指故障率低。
从上述的观点出发,构成内层电介质层2的电介质陶瓷组合物的利用X射线衍射法求出的烧结体晶格体积优选为
Figure GDA0003247180020000052
以下,更优选为
Figure GDA0003247180020000053
以上。
此外,外层电介质层的烧结体晶格体积没有特别限定,构成外层电介质层的电介质陶瓷组合物的利用X射线衍射法求出的烧结体晶格体积也为
Figure GDA0003247180020000061
以下,优选为
Figure GDA0003247180020000062
以下,更优选为
Figure GDA0003247180020000063
以上。
本实施方式的烧结体晶格体积通过以下的方法求出。
首先,从层叠陶瓷电容器1中除去外部电极4。将这样得到的多个电容器元件主体10以电容器元件主体10的X-Y平面露出的方式填埋于树脂30。
接着,将电容器元件主体10的上表面10a(外层区域11)和树脂30的上表面30a进行镜面抛光,得到形成电容器元件主体10内部的外层区域11的电介质陶瓷组合物、即烧结体的X射线衍射测定面(图2A、图2B)。此外,图2B是图2A的放大剖视图。
接着,进行X射线衍射的测定,由Rietveld分析算出每个晶胞的体积(晶格体积)。
此外,上述的方法为内层电介质层2的母材和外层区域11的外层电介质层的母材相同的情况下的测定方法。在内层电介质层2的母材和外层电介质层的母材相同的情况下,内层电介质层2的烧结体晶格体积与外层电介质层的烧结体晶格体积相同。因此,如上所述,通过测定外层区域11的烧结体晶格体积,可以确认内层电介质层2的烧结体晶格体积。
但是,在内层电介质层2的母材和外层区域11的外层电介质层的母材不同的情况下,以内层电介质层2露出的方式进行镜面抛光,得到内层电介质层2的X射线衍射测定面,进行X射线衍射的测定,由Rietveld分析算出每个晶胞的体积(晶格体积)。
就本实施方式的构成内层电介质层2的电介质陶瓷组合物而言,利用X射线衍射法求出的母材晶格体积(以下,称为“母材晶格体积”)(X)和烧结体晶格体积(Y)的晶格体积比(Y/X)优选为0.998以上。由此,可靠性变得良好。
本实施方式的母材晶格体积通过以下的方法求出。
母材为进行浆料化而得到电介质层用浆料之前的电介质原料中的、不含有副成分的材料。将该母材2a填充于模具40的空腔42,在图3A的箭头方向利用板44进行压制。此时,制作尽可能平滑的表面。
在被压制后的母材的上表面20a和模具的上表面40a,得到X射线衍射测定面(图3B)。
接着,进行X射线衍射的测定,由Rietveld分析算出每个晶胞的体积(晶格体积)。
就本实施方式的电介质陶瓷组合物而言,烧结体晶格体积为规定值以下。这被认为是由于,Ca或Sr取代A位点的Ba,Ca或Sr几乎不取代B位点的Ti。
在ABO3表示的钙钛矿型化合物中,认为Ca或Sr取代作为B位点的元素的Ti时,产生氧缺陷。
与此相对,认为本实施方式的电介质陶瓷组合物如上所述,Ca或Sr取代A位点的Ba,Ca或Sr几乎不取代B位点的Ti。因此,本实施方式的电介质陶瓷组合物可以抑制氧缺陷。其结果,使用了本实施方式的电介质陶瓷组合物的电子部件,其故障率低,可以得到良好的可靠性。
另外,这样本实施方式的电介质陶瓷组合物的主成分含有Ca或Sr作为A位点的元素,Ca或Sr几乎不取代B位点的Ti,因此,成为烧结体晶格体积变小的倾向。
此外,可以由烧结体晶格体积为
Figure GDA0003247180020000071
以下推测含有Ca或Sr作为A位点的元素,并且Ca或Sr没有取代B位点的Ti。因为Sr及Ca的离子半径比Ti大,因此,Sr及Ca、或者Sr或Ca取代了Ti位点的情况下,烧结体晶格体积会成为
Figure GDA0003247180020000072
以上。此外,即使大部分的Sr及Ca、或者Sr或Ca取代了Ba位点,仅极少部分的Sr及Ca、或者Sr或Ca取代了Ti位点也会形成氧缺陷。这样的氧缺陷的形成可以通过可靠性的评价结果变差来确认。
本实施方式的电介质层除上述的主成分之外,也可以进一步含有副成分。副成分的种类和含量没有特别限定,可以列举例如以下的第1副成分~第5副成分。
第1副成分含有选自Mn、Cr、Co、Ni及Fe中的至少1种元素的氧化物。
第2副成分可以含有选自V、Mo及W中的至少1种元素的氧化物。
第3副成分含有选自R氧化物(其中,R为选自Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu中的至少1种)。
第4副成分含有Mg的氧化物。
第5副成分含有选自Si、Li、Al、Ge、Ba、Ca及B中的至少1种元素的氧化物。
层叠陶瓷电容器1的制造方法
本实施方式的层叠陶瓷电容器1与现有的层叠陶瓷电容器同样地,通过利用使用了浆料的通常的印刷法或片材法制作生坯芯片,将其进行烧成之后,将外部电极进行印刷或转印并烧成来进行制造。以下,对制造方法进行具体地说明。
首先,准备成为母材的ABO3
优选准备钛酸钡作为Ti及Ba的原料。钛酸钡的Ba/Ti的摩尔比优选低于1。由此,Ca或Sr容易进入ABO3的A位点。从上述的观点出发,钛酸钡的Ba/Ti的摩尔比优选为0.900~0.990。
制作母材的方法没有限定,除所谓的固相法之外,可以使用利用各种液相法(例如,草酸盐法、水热合成法、醇盐法、溶胶凝胶法等)制造的母材等用各种方法制造的母材。
例如,在利用固相法的情况下,通过以下的方法制作。
除上述的钛酸钡之外,作为Ca的原料,优选使用碳酸钙,作为Sr的原料,优选使用碳酸锶,作为Zr(也可以含有Hf)的原料,优选使用氧化锆。
以(Ba+Ca+Sr)/(Ti+Zr+Hf)成为1的方式使钛酸钡、Ca的原料、Sr的原料、Zr(也可以含有Hf)的原料分散于水溶液中而得到预浆料。
接着,将预浆料用球磨机在常温下进行分散,得到混合浆料。
将上述的混合浆料进行干燥,得到干燥粉末,优选在800℃~1200℃下进行煅烧,得到母材。
另外,在利用液相法的情况下,通过以下的方法来制作。
除上述的钛酸钡之外,作为Ca的原料,优选使用氢氧化钙,作为Sr的原料,优选使用氢氧化锶,作为Zr(也可以含有Hf)的原料,优选使用氧化锆。
使钛酸钡分散于水溶液中,调节为pH10.0~14.0。作为此时的pH调节剂,优选使用氢氧化钠。另外,此时,为了防止碳酸盐的析出,在氮置换中进行,得到预浆料。
接着,在调节了pH的预浆料中,以(Ba+Ca+Sr)/(Ti+Zr+Hf)成为1的方式添加预先溶解或分散于水的Ca的原料、Sr的原料、Zr(也可以含有Hf)的原料。接着,将上述的预浆料用搅拌机进行分散,得到混合浆料。
接着,将上述的混合浆料使用高压釜用反应器,优选在反应温度200℃~400℃下进行合成,得到合成处理后的混合浆料。
接着,将混合浆料进行过滤,将得到的固体成分优选在50℃~300℃下进行干燥而得到母材。
通过使用利用上述的方法制作的母材,可以使烧结体晶格体积为规定值以下,成为可靠性变得良好的倾向。
准备含有由这样得到的母材和上述的副成分构成的电介质原料的电介质层用浆料。上述的副成分优选与如上所述制作的母材一起在该阶段中添加。由此,可以使烧结体晶格体积为规定值以下,成为可靠性变得良好的倾向。
电介质原料中的各化合物的含量以在烧成后成为上述的电介质陶瓷组合物的组成的方式确定即可。在涂料化之前的状态下,电介质原料的粒径通常为平均粒径0.02~1μm左右。
电介质层用浆料可以为将电介质原料和有机载体混炼而成的有机系的涂料,也可以为水系的涂料。
有机载体是将粘合剂溶解于有机溶剂中而成的。用于有机载体的粘合剂没有特别限定,只要从乙基纤维素、聚乙烯基醇缩丁醛等通常的各种粘合剂中适当选择即可。使用的有机溶剂也没有特别限定,根据印刷法或片材法等利用的方法,从萜品醇、丁基卡必醇、丙酮、甲苯等各种有机溶剂中适当选择即可。
另外,在将电介质层用浆料制成水系的涂料的情况下,将使水溶性的粘合剂或分散剂等溶解于水而成的水系载体和电介质原料进行混炼即可。用于水系载体的水溶性粘合剂没有特别限定,例如使用聚乙烯醇、纤维素、水溶性丙烯酸树脂等即可。
内部电极层用浆料是将由上述的各种导电性金属或合金构成的导电材料和上述的有机载体进行混炼而制备的。也可以使用氧化物、有机金属化合物或树脂酸盐等来代替导电材料。上述的氧化物、有机金属化合物及树脂酸盐在烧成后成为上述的导电材料。另外,在内部电极层用浆料中,也可以含有常用材料。作为常用材料,没有特别限制,优选具有与主成分同样的组成。
外部电极用浆料与上述的内部电极层用浆料同样地制备即可。
对上述的各浆料中的有机载体的含量没有特别限制,设为通常的含量,例如粘合剂设为1~5重量%左右、溶剂设为10~50重量%左右即可。另外,在各浆料中,也可以根据需要含有选自各种分散剂、增塑剂、电介质、绝缘体等中的添加物。它们的总含量优选设为10重量%以下。
在使用印刷法的情况下,将电介质层用浆料及内部电极层用浆料在PET等基板上进行印刷、层叠,切断成规定形状之后,从基板上剥离而制成生坯芯片。
另外,在使用片材法的情况下,使用电介质层用浆料形成生坯片材,在其上印刷内部电极层用浆料而形成内部电极图案之后,将它们进行层叠而制成生坯芯片。
在烧成前,对生坯芯片实施脱粘合剂处理。作为脱粘合剂条件,将升温速度优选设为5~300℃/小时,将保持温度优选设为180~400℃,将温度保持时间优选设为0.5~24小时。另外,脱粘合剂气氛设为空气或还原性气氛。
脱粘合剂后,进行生坯芯片的烧成。在烧成中,将升温速度优选设为100~500℃/小时。烧成时的保持温度优选为1300℃以下,更优选为1150~1280℃,其保持时间优选为0.5~8小时,更优选为2~3小时。保持温度低于上述范围时,致密化变得不充分;超过该范围时,容易发生因内部电极层3的异常烧结而导致的电极的中断、或因内部电极层构成材料的扩散而导致的容量温度特性的恶化、电介质陶瓷组合物的还原。
烧成气氛优选设为还原性气氛,作为气氛气体,例如可以将N2和H2的混合气体进行加湿而使用。
另外,烧成时的氧分压根据内部电极层用浆料中的导电材料的种类适当确定即可,在使用Ni或Ni合金等贱金属作为导电材料的情况下,烧成气氛中的氧分压优选设为10-14~10-10MPa。氧分压低于上述范围时,有时内部电极层3的导电材料发生异常烧结并中断。另外,氧分压超过上述范围时,存在内部电极层3进行氧化的倾向。降温速度优选为50~500℃/小时。
在还原性气氛中进行烧成之后,优选对电容器元件主体实施退火。退火为用于将电介质层进行再氧化的处理,由此可以显著地延长IR寿命(绝缘电阻的寿命),因此,可靠性提高。
退火气氛中的氧分压优选设为10-9~10-5MPa。氧分压低于上述范围时,电介质层的再氧化困难,超过上述范围时,存在内部电极层3的氧化进展的倾向。
退火时的保持温度优选设为1100℃以下,特别优选设为1000~1100℃。保持温度低于上述范围时,电介质层的氧化变得不充分,因此,IR低,另外,IR寿命容易缩短。另一方面,保持温度超过所述范围时,不仅内部电极层3进行氧化而容量降低,而且内部电极层3与电介质基底进行反应,容易发生容量温度特性的恶化、IR的降低、IR寿命的降低。此外,退火可以仅由升温过程及降温过程构成。即,可以将温度保持时间设为零。该情况下,保持温度与最高温度相同含义。
作为其以外的退火条件,将温度保持时间优选设为0~20小时、更优选2~4小时,将降温速度优选设为50~500℃/小时、更优选100~300℃/小时。另外,作为退火的气氛气体,例如优选使用加湿后的N2气等。
在上述的脱粘合剂处理、烧成及退火中,为了将N2气或混合气体等进行加湿,例如使用加湿器等即可。该情况下,水温优选为5~75℃左右。
脱粘合剂处理、烧成及退火可以连续地进行,也可以独立地进行。
对如上所述得到的电容器元件主体,利用例如滚筒抛光或喷砂等实施端面抛光,涂布外部电极用浆料并进行烧成,形成外部电极4。然后,根据需要,在外部电极4表面利用镀敷等形成被覆层。
这样制造的本实施方式的层叠陶瓷电容器1可以通过焊接等安装于印刷基板上等,用于各种电子设备等中。
以上,对本发明的实施方式进行了说明,但本发明对这样的实施方式没有任何限定,当然可以在不脱离本发明的要点的范围内以各种方式实施。
例如,在上述的实施方式中,作为本发明的电子部件例示了层叠陶瓷电容器,但作为本发明的电子部件,并不限定于层叠陶瓷电容器,只要是具有上述的电介质陶瓷组合物的电子部件,则任何电子部件都可以。
实施例
以下,基于更详细的实施例来说明本发明,但本发明并不限定于这些实施例。
试样编号1(固相法)
准备平均SEM粒径为20nm、Ba/Ti的摩尔比为0.990的钛酸钡粉末。
使准备的钛酸钡粉末和碳酸钙分散于水溶液中,得到预浆料。预浆料中的钛酸钡的浓度设为30wt%,以Ca/Ti的摩尔比成为0.010的方式添加碳酸钙。
将上述的预浆料用球磨机分散20小时,得到混合浆料。
将上述的混合浆料在100℃下干燥10小时,得到干燥粉末。
将上述的干燥粉末在900℃下煅烧5小时,得到母材。
相对于上述的母材中的TiO2 100摩尔份,作为副成分,准备Y2O3:0.40摩尔份、SiO2:0.60摩尔份、MnO:0.20摩尔份、MgO:1.70摩尔份、V2O5:0.05摩尔份。将母材和副成分用球磨机湿式混合、粉碎10小时,并进行干燥,得到电介质原料。
将得到的电介质原料:100重量份、聚乙烯基醇缩丁醛树脂:10重量份、作为增塑剂的邻苯二甲酸二辛酯(DOP):5重量份、和作为溶剂的乙醇:100重量份用球磨机混合并浆料化,得到电介质层用浆料。
另外,将Ni颗粒:44.6重量份、萜品醇:52重量份、乙基纤维素:3重量份和苯并三唑:0.4重量份利用三辊机混炼,进行浆料化,制作内部电极层用浆料。
然后,使用上述制作的电介质层用浆料,在PET膜上以干燥后的厚度成为3.0μm的方式形成生坯片材。接着,在其上使用内部电极层用浆料,将内部电极层以规定图案印刷之后,从PET膜上剥离片材,制作具有内部电极层的生坯片材。
接着,将具有内部电极层的生坯片材层叠多张,通过加压粘接而制成生坯层叠体,将该生坯层叠体切断成规定尺寸,由此得到生坯芯片。
接着,对得到的生坯芯片,在下述条件下进行脱粘合剂处理、烧成及退火,得到电容器元件主体。
脱粘合剂处理条件设为升温速度:25℃/小时、保持温度:260℃、温度保持时间:8小时、气氛:空气中。
烧成条件设为升温速度:200℃/小时、保持温度:1200℃,将保持时间设为2小时。降温速度设为200℃/小时。此外,气氛气体设为加湿后的N2+H2混合气体,使氧分压成为10- 12MPa。
退火条件设为升温速度:200℃/小时、保持温度:1000℃、温度保持时间:2小时、降温速度:200℃/小时、气氛气体:加湿后的N2气(氧分压:10-7MPa)。
此外,在烧成及退火时的气氛气体的加湿中使用加湿器。
接着,将得到的电容器元件主体的端面通过喷砂抛光之后,作为外部电极涂布Cu,得到图1所示的层叠陶瓷电容器的试样。得到的电容器试样的尺寸为3.2mm×1.6mm×0.6mm,内层电介质层的厚度为2.5μm,内部电极层的厚度为1.1μm,夹持于内部电极层的内层电介质层的数量设为4。
对上述的母材及得到的电容器试样,在下述的条件下进行X射线衍射的测定,由Rietveld分析算出每个晶胞的体积(晶格体积)。
利用PANalytical制造的X‘Pert Pro、X射线(Cu-Kα线)衍射装置,在2θ=20~100°之间X射线发生条件设为45kV-40mA,扫描宽度设为0.033°,扫描速度设为0.13°/s,对于X射线检测条件,入射侧光学系统设为Ni滤光片10μm、索勒狭缝0.04rad、发散狭缝1/2°、掩模10mm、防散射狭缝1°,受入侧光学系统设为防散射狭缝5.5mm、索勒狭缝0.04rad、Ni滤光片20μm。
此外,由于内层电介质层的母材和外层电介质层的母材相同,因此,通过测定外层区域的烧结体晶格体积,确认内层电介质层的烧结体晶格体积。
对得到的电容器试样,分别通过下述所示的方法进行可靠性及高温负荷寿命(HALT)的测定。
(可靠性)
对于3000个电容器试样,测定在125℃下进行3000小时12.6V/μm的电压施加试验之后的故障率。
(高温负荷寿命)
对于电容器试样,在180℃下、在12.6V/μm的电场下保持于直流电压的施加状态,测定寿命时间,由此评价高温负荷寿命。在本实施例中,将从施加开始至绝缘电阻降低一个数量级的时间定义为寿命。另外,在本实施例中,对20个电容器试样进行上述的评价,将其平均值设为高温负荷寿命。
[表1]
Figure GDA0003247180020000151
试样编号2(液相法)
准备平均SEM粒径为20nm、Ba/Ti的摩尔比为0.990的钛酸钡粉末。
使准备的钛酸钡分散于水溶液中,使用pH调节剂调节为pH12.5,得到预浆料。作为pH调节剂,使用氢氧化钠。为了防止碳酸钠的析出,在氮置换中进行上述的操作。预浆料中的钛酸钡的浓度调节为20wt%。
在pH进行了调节的预浆料中,以Ca/Ti的摩尔比成为0.010的方式添加预先溶解或分散于水中的氢氧化钙水溶液。其后,将上述的预浆料用搅拌机进行分散,得到混合浆料。
使用高压釜用反应器在反应温度200℃下以反应时间6小时合成上述的混合浆料,得到合成处理后的混合浆料。其后,将混合浆料过滤,将得到的固体成分在100℃下干燥10小时,得到母材。
除使用上述的母材之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性及高温负荷寿命。将结果示于表1中。
试样编号3、试样编号5~试样编号14及试样编号26~试样编号31
以Ba、Ca、Sr、Ti及Zr(包含Hf)的摩尔比成为表1所示的方式,使Ca的原料、Sr的原料及Zr(包含Hf)的原料的添加量发生变化,除此之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性及高温负荷寿命。将结果示于表1中。
此外,作为Sr的原料,使用碳酸锶。
另外,将试样编号10的XRD图案示于图4A及图4B中。
试样编号21(固相法A)
以(Ba+Ca)/Ti的摩尔比成为1.000、Ca/Ti的摩尔比成为0.030的方式,准备碳酸钡原料、碳酸钙原料及二氧化钛原料。
使上述的原料分散于水溶液中,得到预浆料。预浆料中的钛酸钡的浓度设为30wt%。
将上述的预浆料用球磨机分散20小时,得到混合浆料。
将上述的混合浆料在100℃下干燥10小时,得到干燥粉末。
将上述的干燥粉末在900℃下煅烧5小时,得到母材。
除使用上述的母材之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性及高温负荷寿命。将结果示于表1中。另外,将XRD图案示于图4A及图4B中。
试样编号22(固相法B)
准备平均SEM粒径为20nm、Ba/Ti的摩尔比为0.970的钛酸钡粉末。
使准备的钛酸钡粉末和碳酸钙分散于水溶液中,得到预浆料。预浆料中的钛酸钡的浓度设为30wt%,以Ca/Ti的摩尔比成为0.030的方式添加碳酸钙。
在上述的预浆料中,以成为试样编号1中记载的配合比的方式添加试样编号1中记载的副成分,用球磨机分散20小时,得到混合浆料。
将上述的混合浆料在100℃下干燥10小时,得到干燥粉末。
将上述的干燥粉末在900℃下煅烧5小时,得到母材。
除使用上述的母材之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性及高温负荷寿命。将结果示于表1中。
试样编号23(液相法A)
准备平均SEM粒径为20nm、Ba/Ti的摩尔比为0.970的钛酸钡粉末。
使准备的钛酸钡分散于水溶液中,使用pH调节剂调节为pH12.5,得到预浆料。作为pH调节剂,使用氢氧化钡。为了防止碳酸钡的析出,上述的操作在氮置换中进行。预浆料中的钛酸钡的浓度调节为20wt%。
在pH进行了调节的预浆料中,以Ca/Ti的摩尔比成为0.030的方式添加预先使其溶解于水中的氢氧化钙水溶液。其后,将上述的预浆料用搅拌机进行分散,得到混合浆料。
将上述的混合浆料使用高压釜用反应器在反应温度110℃下以反应时间6小时合成,得到合成处理后的混合浆料。其后,将反应液过滤,将得到的固体成分在300℃下干燥5小时,得到母材。
除使用上述的母材之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性及高温负荷寿命。将结果示于表1中。
试样编号24(液相法B)
以(Ba+Ca)/Ti的摩尔比成为1.000、Ca/Ti的摩尔比成为0.030的方式准备氢氧化钡原料、氢氧化钙原料及二氧化钛原料。
使上述的原料分散于水溶液中,使用pH调节剂调节为pH12.5,得到预浆料。作为pH调节剂,使用氢氧化钡。预浆料中的钛酸钡的浓度调节为20wt%。
接着,为了防止碳酸钡的析出,在氮置换中将上述的预浆料用搅拌机进行分散,得到混合浆料。
将上述的混合浆料使用高压釜用反应器在反应温度200℃下以反应时间6小时进行合成,得到合成处理后的混合浆料。其后,将反应液过滤,将得到的固体成分在100℃下干燥10小时,得到母材。
除使用上述的母材之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性及高温负荷寿命。将结果示于表1中。
试样编号25(固相法C)
以Ca/Ti的摩尔比成为0.030的方式准备硝酸钙原料及二氧化钛原料。
使上述的原料分散于水溶液中,加热至70℃,以(Ba+Ca)/Ti的摩尔比成为1.000的方式投入氢氧化钡粉末而得到预浆料。为了防止碳酸钡的析出,将上述的预浆料在氮置换中在85℃下加热1小时,用搅拌机进行分散,得到混合浆料。
将上述的混合浆料在100℃下干燥10小时,得到干燥粉末。
将上述的干燥粉末在1050℃下煅烧5小时,得到母材。
除使用上述的母材之外,与试样编号1同样地操作,得到电容器试样,求出母材晶格体积及烧结体晶格体积,测定可靠性。将结果示于表1中。
由表1可以确认:烧结体晶格体积为
Figure GDA0003247180020000181
以下的电容器试样(试样编号1~试样编号3及试样编号5~试样编号14)与烧结体晶格体积大于
Figure GDA0003247180020000182
的电容器试样(试样编号21~试样编号25)相比,可靠性良好。
由表1可以确认:不含有Ca或Sr的电容器试样(试样编号26及试样编号29)其烧结体晶格体积不会成为
Figure GDA0003247180020000183
以下,成为可靠性低的倾向。
由表1可以确认:含有Ba的电容器试样(试样编号1~试样编号3及试样编号5~试样编号14)与不含有Ba的电容器试样(试样编号27、试样编号28及试样编号30)相比,可靠性及高温负荷寿命良好。
由表1可以确认:不含有Ti的电容器试样(试样编号29及试样编号31)其烧结体晶格体积不会成为
Figure GDA0003247180020000191
以下,成为可靠性低的倾向。
由表1可以确认:在烧结体晶格体积为
Figure GDA0003247180020000192
以下的情况下,含有Ca的电容器试样(试样编号10~试样编号14)与不含有Ca的电容器试样(试样编号8及试样编号9)相比,高温负荷寿命良好。
在试样编号21中,将碳酸钡、碳酸钙及二氧化钛进行混合并进行煅烧,因此,认为除钛酸钡钙之外,还生成了钛酸钡及钛酸钙。在试样编号21的制造方法中,钛酸钡的生成比例高。另外,钛酸钡的烧结体晶格体积通常为
Figure GDA0003247180020000193
因此,认为试样编号21的烧结体晶格体积大于
Figure GDA0003247180020000194
另外,在试样编号22中,相对于钛酸钡,与碳酸钙一起添加了MnO、Y2O3及V2O5等添加物,因此,Ca没有充分地固溶,与添加物竞争的结果,认为Ca取代了B位点的Ti。其结果,认为在试样编号22中,烧结体晶格体积大于
Figure GDA0003247180020000195
在试样编号23中,由于反应温度低,因此,认为Ca没有充分地固溶。其结果,认为在试样编号23中所测得的烧结体晶格体积成为主要依赖于钛酸钡的烧结体晶格体积
Figure GDA0003247180020000196
的晶格体积,从而烧结体晶格体积大于
Figure GDA0003247180020000197
在试样编号24中,使用氢氧化钡、氢氧化钙及二氧化钛利用液相法得到母材,因此,认为除钛酸钡钙之外,还生成了钛酸钡及钛酸钙。在试样编号24的制造方法中,钛酸钡的生成比例高。另外,钛酸钡的烧结体晶格体积通常为
Figure GDA0003247180020000198
因此,认为试样编号24的烧结体晶格体积大于
Figure GDA0003247180020000199
在试样编号25中,认为通过使Ca和Ti先反应,从而Ca不能充分地与钛酸钡固溶。其结果,烧结体晶格体积成为主要依赖于钛酸钡的烧结体晶格体积
Figure GDA00032471800200001910
的晶格体积,因此,认为烧结体晶格体积大于
Figure GDA00032471800200001911

Claims (6)

1.一种烧成后的电介质陶瓷组合物,其中,
在A表示A位点的元素、B表示B位点的元素、O表示氧元素的情况下,以通式ABO3表示的钙钛矿型化合物为主成分,
A包含Ba,
A进一步包含选自Ca及Sr中的至少1种,
B包含Ti,
将电介质陶瓷组合物中的Ti、Zr及Hf的合计设为100摩尔份时,在电介质陶瓷组合物中含有Ti 100摩尔份~99摩尔份,
由X射线衍射法求得的烧结体晶格体积为63.55Å3以上64.33Å3以下。
2.根据权利要求1所述的烧成后的电介质陶瓷组合物,其中,
在将所述烧成后的电介质陶瓷组合物中的Ba、Ca及Sr的合计设为100摩尔份时,所述烧成后的电介质陶瓷组合物中,含有Ba 99摩尔份~90摩尔份。
3.根据权利要求1或2所述的烧成后的电介质陶瓷组合物,其中,
由X射线衍射法求得的烧结体晶格体积为64.20Å3以下。
4.根据权利要求3所述的烧成后的电介质陶瓷组合物,其中,
A包含Ca。
5.一种电子部件,其中,
具有权利要求1~4中任一项所述的烧成后的电介质陶瓷组合物。
6.一种层叠陶瓷电容器,其中,
具有交替地层叠有内层电介质层和内部电极层的电容器元件主体,
所述内层电介质层由权利要求1~4中任一项所述的烧成后的电介质陶瓷组合物构成。
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