CN109891375B - 触摸面板、触摸面板的制造方法 - Google Patents

触摸面板、触摸面板的制造方法 Download PDF

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Publication number
CN109891375B
CN109891375B CN201780066616.0A CN201780066616A CN109891375B CN 109891375 B CN109891375 B CN 109891375B CN 201780066616 A CN201780066616 A CN 201780066616A CN 109891375 B CN109891375 B CN 109891375B
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China
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layer
wiring layer
touch panel
general formula
transparent
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CN109891375A (zh
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三井博子
诹访充史
山铺有香
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Toray Industries Inc
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Toray Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
CN201780066616.0A 2016-11-01 2017-10-26 触摸面板、触摸面板的制造方法 Active CN109891375B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016-214110 2016-11-01
JP2016214110 2016-11-01
JP2017017326 2017-02-02
JP2017-017326 2017-02-02
PCT/JP2017/038692 WO2018084067A1 (ja) 2016-11-01 2017-10-26 タッチパネル、タッチパネルの製造方法

Publications (2)

Publication Number Publication Date
CN109891375A CN109891375A (zh) 2019-06-14
CN109891375B true CN109891375B (zh) 2022-04-12

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JP (1) JP6933142B2 (ko)
KR (1) KR102338021B1 (ko)
CN (1) CN109891375B (ko)
TW (1) TWI736700B (ko)
WO (1) WO2018084067A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7120819B2 (ja) * 2018-06-12 2022-08-17 旭化成株式会社 ポリイミドフィルムとフレキシブルガラスとの積層体
KR20210088551A (ko) 2018-11-09 2021-07-14 도레이 카부시키가이샤 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스
WO2020203447A1 (ja) * 2019-04-02 2020-10-08 東レ株式会社 導電層付き基材およびタッチパネル
WO2021106627A1 (ja) * 2019-11-25 2021-06-03 東レ株式会社 ポリイミド、ポリイミド樹脂膜、積層体およびフレキシブルデバイス

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199954A (ja) * 1999-01-06 2000-07-18 Toray Ind Inc 感光性導電ペ―ストおよび微細電極パタ―ン形成方法
JP2002048913A (ja) * 2000-08-04 2002-02-15 Fuji Photo Film Co Ltd 位相差板、円偏光板および反射型液晶表示装置
JP2006241395A (ja) * 2005-03-07 2006-09-14 Fuji Photo Film Co Ltd ポリエステルおよびその製造方法
JP2007084650A (ja) * 2005-09-21 2007-04-05 Fujifilm Corp 高耐熱ポリマー前駆体フィルム、光学フィルムおよびその製造方法、並びに、これを用いた画像表示装置
JP2011208009A (ja) * 2010-03-30 2011-10-20 Toray Ind Inc 絶縁性樹脂組成物、それから形成された硬化膜、および硬化膜を有するタッチパネル用素子
KR20130070165A (ko) * 2011-12-19 2013-06-27 삼성전기주식회사 터치센서 및 그 제조방법
JP2013196997A (ja) * 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物
CN104160365A (zh) * 2012-03-08 2014-11-19 日本写真印刷株式会社 柔性触摸屏
KR20140138834A (ko) * 2012-03-29 2014-12-04 도레이 카부시키가이샤 폴리아미드산 및 그것을 함유하는 수지 조성물
JP2016095615A (ja) * 2014-11-13 2016-05-26 凸版印刷株式会社 タッチセンサー用基板
WO2016144038A1 (ko) * 2015-03-11 2016-09-15 동우화인켐 주식회사 필름 터치 센서
WO2016158864A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ

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GB9313841D0 (en) * 1993-07-05 1993-08-18 Philips Electronics Uk Ltd An electro-optic device
JP5998508B2 (ja) * 2011-02-21 2016-09-28 東レ株式会社 含フッ素樹脂積層フィルムおよびその製造方法
JP5764435B2 (ja) * 2011-08-29 2015-08-19 綜研化学株式会社 粘着剤組成物、粘着シートおよびタッチパネル用積層体
KR102085964B1 (ko) * 2012-11-30 2020-03-09 삼성디스플레이 주식회사 플렉서블 터치 스크린 패널 및 이의 제조방법
JP2016004487A (ja) * 2014-06-18 2016-01-12 富士フイルム株式会社 光学的パターン読み取り方法、光学的パターン読み取りシステム、光学的パターン読み取り装置、および光学的パターンを含む光学部材
JP7076986B2 (ja) * 2017-11-24 2022-05-30 キヤノン株式会社 トナー及び画像形成方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199954A (ja) * 1999-01-06 2000-07-18 Toray Ind Inc 感光性導電ペ―ストおよび微細電極パタ―ン形成方法
JP2002048913A (ja) * 2000-08-04 2002-02-15 Fuji Photo Film Co Ltd 位相差板、円偏光板および反射型液晶表示装置
JP2006241395A (ja) * 2005-03-07 2006-09-14 Fuji Photo Film Co Ltd ポリエステルおよびその製造方法
JP2007084650A (ja) * 2005-09-21 2007-04-05 Fujifilm Corp 高耐熱ポリマー前駆体フィルム、光学フィルムおよびその製造方法、並びに、これを用いた画像表示装置
JP2011208009A (ja) * 2010-03-30 2011-10-20 Toray Ind Inc 絶縁性樹脂組成物、それから形成された硬化膜、および硬化膜を有するタッチパネル用素子
KR20130070165A (ko) * 2011-12-19 2013-06-27 삼성전기주식회사 터치센서 및 그 제조방법
CN104160365A (zh) * 2012-03-08 2014-11-19 日本写真印刷株式会社 柔性触摸屏
JP2013196997A (ja) * 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物
KR20140138834A (ko) * 2012-03-29 2014-12-04 도레이 카부시키가이샤 폴리아미드산 및 그것을 함유하는 수지 조성물
CN104204037A (zh) * 2012-03-29 2014-12-10 东丽株式会社 聚酰胺酸和含有其的树脂组合物
JP2016095615A (ja) * 2014-11-13 2016-05-26 凸版印刷株式会社 タッチセンサー用基板
WO2016144038A1 (ko) * 2015-03-11 2016-09-15 동우화인켐 주식회사 필름 터치 센서
KR20160109526A (ko) * 2015-03-11 2016-09-21 동우 화인켐 주식회사 필름 터치 센서
WO2016158864A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ

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Publication number Publication date
JP6933142B2 (ja) 2021-09-08
CN109891375A (zh) 2019-06-14
TWI736700B (zh) 2021-08-21
JPWO2018084067A1 (ja) 2019-09-19
WO2018084067A1 (ja) 2018-05-11
KR102338021B1 (ko) 2021-12-10
KR20190077363A (ko) 2019-07-03
TW201824300A (zh) 2018-07-01

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