CN109819619B - 锁定机构 - Google Patents

锁定机构 Download PDF

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CN109819619B
CN109819619B CN201811384758.4A CN201811384758A CN109819619B CN 109819619 B CN109819619 B CN 109819619B CN 201811384758 A CN201811384758 A CN 201811384758A CN 109819619 B CN109819619 B CN 109819619B
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printed circuit
engaging
circuit board
engagement
lock mechanism
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CN109819619A (zh
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鹿国强
久保义幸
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Fanuc Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1401Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1409Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by lever-type mechanisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735Printed circuits including an angle between each other
    • H01R12/737Printed circuits being substantially perpendicular to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452Mounting of connectors; Switching; Reinforcing of back panels
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314Back frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/166Alignment or registration; Control of registration

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Abstract

本发明提供一种将经由连接器(24、26)而与箱体(18)内的背板(20)连接的多个印制电路板(22)在箱体(18)内进行固定的锁定机构(10),其具有卡合部件(32),该卡合部件具备与形成于多个印制电路板(22)的各个印制电路板的卡合部(28)卡合的多个卡合片(30),在使卡合片(30)卡合于卡合部(28)时,卡合片(30)向印制电路板(22)的连接器(26)与背板(20)的连接器(24)嵌合的方向按压印制电路板(22)。

Description

锁定机构
技术领域
本发明涉及将经由连接器而与箱体内的背板连接的多个印制电路板在箱体内进行固定的锁定机构。
背景技术
日本实公平01-035518号公报中公开一种防止印制电路板从安装有多片印制电路板的箱体脱出的锁定机构。
发明内容
在日本实公平01-035518号公报的技术中,无法限制在箱体内的印制电路板的移动,从而有印制电路板与经由连接器而连接的部件之间的连接变得不稳定的担忧。
本发明是为了解决上述的问题而完成的,其目的在于提供一种能够在箱体内使印制电路板与经由连接器而连接的背板稳定地连接的锁定机构。
本发明的方案是一种将经由连接器而与箱体内的背板连接的多个印制电路板在上述箱体内进行固定的锁定机构,其具有卡合部件,上述卡合部件具备与形成于多个上述印制电路板的各个印制电路板的卡合部卡合的多个卡合片,在使上述卡合片卡合于上述卡合部时,上述卡合片向上述印制电路板的上述连接器与上述背板的上述连接器嵌合的方向按压上述印制电路板。
根据本发明,能够在箱体内使印制电路板与经由连接器而连接的背板稳定地连接。
根据以下的参照附图而说明的实施方式的说明,上述的目的、特征以及优点会容易被了解。
附图说明
图1A是示出由锁定机构锁定印制电路板的状态下的箱体的内部状态的示意图。图1B是示出解除锁定机构对印制电路板的锁定的状态下的箱体的内部状态的示意图。
图2是锁定机构的示意性分解立体图。
图3是从背面观察液晶面板以及控制装置的示意图。
图4A是示出由锁定机构锁定印制电路板的状态下的箱体的内部状态的示意图。图4B是示出解除锁定机构对印制电路板的锁定的状态下的箱体的内部状态的示意图。
图5是锁定机构的示意性分解立体图。
图6A是示出由锁定机构锁定印制电路板的状态下的箱体的内部状态的示意图。图6B是示出解除锁定机构对印制电路板的锁定的状态下的箱体的内部状态的示意图。
具体实施方式
〔第一实施方式〕
[锁定机构的概要]
在安装于数值控制装置12的液晶面板14的背面的控制装置16的箱体18的内部,实施方式的锁定机构10用于固定与背板20连接的多个印制电路板22。
图1A是示出由锁定机构10锁定印制电路板22的状态下的箱体18的内部状态的示意图。图1B是示出解除锁定机构10对印制电路板22的锁定的状态下的箱体18的内部状态的示意图。
各印制电路板22具有与背板20的连接器24嵌合的连接器26。由作业员等将各印制电路板22的连接器26嵌合于背板20的连接器24。若由锁定机构10锁定印制电路板22,则由锁定机构10向各印制电路板22的连接器26与背板20的连接器24嵌合的方向按压印制电路板22。
[锁定机构的结构]
图2是锁定机构10的示意性分解立体图。锁定机构10具有形成为在厚度方向上贯通印制电路板22的孔的卡合部28、具有卡合片30的卡合部件32、以及支撑卡合部件32的固定部件34。
卡合部28形成于印制电路板22的设有连接器26的位置的附近。固定部件34固定于箱体18。固定部件34具有能够滑动地支撑卡合部件32的支撑部36、以及卡合片30插入的插入孔38。
卡合部件32具有棱柱状的轴部40、从轴部40起沿与轴部40的轴向大致垂直的方向延伸的延长部42、以及从延长部42起沿与延长部42的轴向大致垂直的方向延伸的卡合片30。在以轴部40相对于卡合片30位于上方的方式从侧面观察卡合部件32时,延长部42以及卡合片30从轴部40起大致呈L字状延伸地形成。并且,在以轴部40相对于卡合片30位于上方的方式从侧面观察卡合部件32时,在卡合片30的与轴部40对置的一侧的面形成有倾斜部44,该倾斜部44在从卡合片30的延长部42侧朝向前端下降的方向上倾斜。如图1A以及图1B所示,卡合部件32具有多个卡合片30。卡合部件32具有至少印制电路板22的片数以上的个数的卡合片30。卡合片30可以在轴部40的轴向上等间隔地设置,也可以不等间隔地设置。
在由锁定机构10锁定印制电路板22时,通过使卡合部件32向图2的箭头方向移动,来使卡合片30贯通印制电路板22的卡合部28,并插入至固定部件34的插入孔38。由此,卡合片30与卡合部28卡合,并且由卡合片30的倾斜部44向背板20侧按压印制电路板22。并且,印制电路板22由延长部42和固定部件34夹持。
图3是从背面观察液晶面板14以及控制装置16的示意图。在从背面观察液晶面板14以及控制装置16的状态下,锁定机构10以夹持背板20的连接器24和印制电路板22的连接器26的方式配置在两处。并且,如图1A以及图1B所示,卡合部件32配置于印制电路板22与背板20之间。
如图1A以及图1B所示,在箱体18的外侧设有作为操作杆而形成的操作部46。作业员通过操作操作部46,能够使卡合部件32在轴部40的轴向移动,从而能够进行印制电路板22的卡合部28与卡合部件32的卡合片30的卡合以及卡合解除。
[作用效果]
在数值控制装置12且在箱体18的内部,在背板20的连接器24连接有多个印制电路板22的连接器26。由于数值控制装置12大多配置于工作机械等的附近,所以有向数值控制装置12传递工作机械等的振动的担忧、因作业员、机械材料等碰到数值控制装置12而向数值控制装置12输入冲击的担忧。由此,有印制电路板22的连接器26从背板20的连接器24脱离、以及因连接器24与连接器26不完全地嵌合而产生接触不良的担忧。并且,在连接器24与连接器26不完全地嵌合的状态下,若向数值控制装置12输入振动等,则连接器26相对于连接器24移动,从而有连接器24、连接器26的销的脱落而销腐蚀的担忧。
因此,在本实施方式中,在由锁定机构10锁定印制电路板22时,卡合部件32的卡合片30与印制电路板22的卡合部28卡合,从而向背板20的连接器24与印制电路板22的连接器26嵌合的方向按压印制电路板22。由此,能够使背板20的连接器24与印制电路板22的连接器26稳固地嵌合。另外,在由锁定机构10锁定印制电路板22的状态下,能够由卡合片30来限制印制电路板22的在印制电路板22的连接器26从背板20的连接器24脱离的方向上的移动。因此,能够抑制印制电路板22的连接器26从背板20的连接器24脱离。另外,能够抑制连接器24与连接器26的相对移动,从而能够抑制连接器24和连接器26的销的腐蚀。
并且,在本实施方式中,在印制电路板22的连接器26的附近形成有卡合部28。由于从卡合部件32的卡合片30输入的力的作用点成为印制电路板22的连接器26的附近,所以能够使印制电路板22的连接器26与背板20的连接器24的嵌合变得稳固。
并且,在本实施方式中,卡合部件32配置于印制电路板22与背板20之间。由于印制电路板22与背板20通过连接器26与连接器24的嵌合来连接,所以在印制电路板22与背板20之间存在间隙。由于能够有效利用该间隙配置卡合部件32,因而能够抑制控制装置16的大型化。
并且,在本实施方式中,为了进行卡合片30与印制电路板22的卡合部28的卡合以及卡合解除,设有作业员使卡合部件32移动的操作部46。由此,作业员能够容易地进行锁定机构10的锁定和锁定解除的操作。
并且,在本实施方式中,卡合部28形成为在厚度方向上贯通印制电路板22的孔,通过使卡合部件32在印制电路板22的厚度方向移动,来进行卡合片30与卡合部28的卡合以及卡合解除。另外,在卡合片30的与印制电路板22抵接的一侧的面设有倾斜部44。由此,通过使卡合部件32在印制电路板22的厚度方向移动,从而能够使卡合片30与卡合部28卡合,而且利用倾斜部44,能够向印制电路板22的连接器26与背板20的连接器24嵌合的方向按压印制电路板22。
〔第二实施方式〕
在第一实施方式中,通过使卡合部件32在轴部40的轴向移动,来使卡合片30与印制电路板22的卡合部28卡合。在第二实施方式中,通过使卡合部件32绕轴部40的轴转动,来使卡合片30与印制电路板22的卡合部28卡合。
图4A是示出由锁定机构10锁定印制电路板22的状态下的箱体18的内部状态的示意图。图4B是示出解除锁定机构10对印制电路板22的锁定的状态下的箱体18的内部状态的示意图。图5是锁定机构10的示意性分解立体图。
锁定机构10具有呈圆弧状地切开印制电路板22来形成的卡合部28、具有卡合片30的卡合部件32、以及支撑卡合部件32的固定部件34。
卡合部28形成于印制电路板22的设有连接器26的位置的附近。卡合部28大致呈四分之一圆状。卡合部28形成为,随着从印制电路板22的边进入卡合部28的端部,圆弧的曲率变大。
固定部件34固定于箱体18。固定部件34具有能够滑动地支撑卡合部件32的支撑部36、以及卡合片30插入的插入孔38。插入孔38是呈与卡合部28相同形状的圆弧状地切开固定部件34来形成的。
卡合部件32具有圆柱状的轴部40、从轴部40起沿与轴部40的轴向大致垂直的方向延伸的延长部42、以及从延长部42起沿与延长部42的轴向大致垂直的方向延伸的卡合片30。在以轴部40相对于卡合片30位于上方的方式从侧面观察卡合部件32时,延长部42以及卡合片30从轴部40起大致呈L字状地延伸形成。如图4A以及图4B所示,卡合部件32具有多个卡合片30。卡合部件32具有至少印制电路板22的片数以上的个数的卡合片30。卡合片30可以在轴部40的轴向上等间隔地设置,也可以不等间隔地设置。
在由锁定机构10锁定印制电路板22时,通过使卡合部件32绕轴部40的轴转动,来将卡合片30插入印制电路板22的卡合部28以及固定部件34的插入孔38。由此,进行卡合片30与卡合部28的卡合,并且卡合片30朝向卡合部28的端部移动,由此由卡合片30向背板20侧按压印制电路板22。并且,印制电路板22由延长部42和固定部件34夹持。
如图4A以及图4B所示,在箱体18的外侧设有作为拨盘而形成的操作部46。作业员通过使操作部46旋转,能够使卡合部件32绕轴部40的轴转动,从而能够进行印制电路板22的卡合部28与卡合部件32的卡合片30的卡合以及卡合解除。
[作用效果]
在本实施方式中,卡合部28是呈圆弧状地切开印刷电路板22来形成的,并且卡合部28形成为,随着从印制电路板22的边进入卡合部28的端部,圆弧的曲率变大。另外,通过使卡合部件32绕轴部40的轴转动,来进行卡合片30与卡合部28的卡合以及卡合解除。由此,通过使卡合部件32转动,从而能够使卡合片30与卡合部28卡合,而且利用卡合片30,能够向印制电路板22的连接器26与背板20的连接器24嵌合的方向进行按压。
[第三实施方式]
在第一实施方式中,通过由作业员操作操作部46,来进行卡合部件32的卡合片30与印制电路板22的卡合部28的卡合以及卡合解除。在第三实施方式中,在箱体18安装于液晶面板14的背面时,自动地进行卡合部件32的卡合片30与印制电路板22的卡合部28的卡合,在从液晶面板14的背面拆下箱体18后,自动地进行卡合部件32的卡合片30与印制电路板22的卡合部28的卡合解除。
图6A是示出由锁定机构10锁定印制电路板22的状态下的箱体18的内部状态的示意图。图6B是示出解除锁定机构10对印制电路板22的锁定的状态下的箱体18的内部状态的示意图。
在卡合部件32的轴部40的液晶面板14侧的端部形成有突出部48。在轴部40的与形成突出部48的一侧相反侧的端部且在与箱体18之间设有弹簧50。在箱体18未安装于液晶面板14的状态下,因弹簧50的作用力,卡合部件32向解除卡合片30与印制电路板22的卡合部28的卡合的方向移动。此时,突出部48向箱体18外突出。若箱体18安装于液晶面板14,则突出部48的前端被液晶面板14按压,使卡合部件32向卡合片30与印制电路板22的卡合部28卡合的方向移动。
[作用效果]
在本实施方式中,具有在使卡合部件32的突出部48向箱体18的外部突出的方向上按压卡合部件32的突出部48的弹簧50,在箱体18安装于液晶面板14时,液晶面板14按压卡合部件32的突出部48,由此使卡合部件32移动以使卡合部件32的卡合片30与印制电路板22的卡合部28卡合。
由此,在箱体18安装于液晶面板14的背面时,自动地进行卡合部件32的卡合片30与印制电路板22的卡合部28的卡合,在从液晶面板14的背面拆下箱体18后,自动地进行卡合部件32的卡合片30与印制电路板22的卡合部28的卡合解除。
〔从实施方式获得的技术思想〕
以下记载能够从上述实施方式把握的技术思想。
一种锁定机构(10),其将经由连接器(24、26)而与箱体(18)内的背板(20)连接的多个印制电路板(22)固定在上述箱体(18)内,其中,锁定机构(10)具有卡合部件(32),该卡合部件(32)具备与形成于多个上述印制电路板(22)的各个印制电路板的卡合部(28)卡合的多个卡合片(30),在使上述卡合片(30)卡合于上述卡合部(28)时,上述卡合片(30)向上述印制电路板(22)的上述连接器(26)与上述背板(20)的上述连接器(24)嵌合的方向按压上述印制电路板(22)。由此,能够使背板(20)的连接器(24)与印制电路板(22)的连接器(26)稳固地嵌合。
在上述的锁定机构(10)中,上述卡合部(28)也可以形成于上述印制电路板(22)的上述连接器(26)的附近。由此,能够使背板(20)的连接器(24)与印制电路板(22)的连接器(26)稳固地嵌合。
在上述的锁定机构(10)中,上述卡合部件(32)也可以配置于上述印制电路板(22)与上述背板(20)之间。由此,能够抑制箱体(18)的大型化。
在上述的锁定机构(10)中,也可以为,上述卡合部件(32)具有操作部(46),通过操作上述操作部(46)来使上述卡合部件(32)移动,从而进行上述卡合部(28)与上述卡合片(30)的卡合以及卡合解除。由此,作业员能够容易地进行锁定机构(10)的锁定和锁定解除的操作。
在上述的锁定机构(10)中,也可以构成为,上述的锁定机构(10)具有在使上述卡合部件(32)的一部分向上述箱体(18)的外部突出的方向上按压上述卡合部件(32)的一部分的加力部件(50),在上述箱体(18)安装于其它设备(14)时,上述其它设备(14)按压上述卡合部件(32)的突出至上述箱体(18)的外部的部分,由此使上述卡合部件(32)移动以使上述卡合部(28)与上述卡合片(30)卡合。由此,在箱体(18)安装于其它设备(14)时,自动地进行卡合部件(32)的卡合片(30)与印制电路板(22)的卡合部(28)的卡合,在从其它设备(14)拆下箱体(18)时,自动地进行卡合部件(32)的卡合片(30)与印制电路板(22)的卡合部(28)的卡合解除。
在上述的锁定机构(10)中,也可以构成为,上述卡合部(28)形成为在厚度方向上贯通上述印制电路板(22)的孔,通过使上述卡合部件(32)在上述印制电路板(22)的厚度方向移动,来进行上述卡合片(30)与上述卡合部(28)的卡合或者卡合解除,并且上述卡合片(30)在与上述卡合部(28)抵接的面具有倾斜部(44)。由此,通过使卡合部件(32)在印制电路板(22)的厚度方向移动,能够使卡合片(30)与卡合部(28)卡合,而且利用倾斜部(44),能够向印制电路板(22)的连接器(26)与背板(20)的连接器(24)嵌合的方向按压印制电路板(22)。
在上述的锁定机构(10)中,上述卡合部(28)通过呈圆弧状地切开上述印制电路板(22)来形成,通过使上述卡合部件(32)转动,来进行上述卡合片(30)与上述卡合部(28)的卡合或者卡合解除。由此,通过使卡合部件(32)转动,能够使卡合片(30)与卡合部(28)卡合,而且利用卡合片(30),能够向印制电路板(22)的连接器(26)与背板(20)的连接器(24)嵌合的方向进行按压。

Claims (7)

1.一种锁定机构,其将多个印制电路板在箱体内进行固定,上述多个印制电路板通过该多个印制电路板所具备的连接器与上述箱体内的背板所具备的连接器嵌合而与上述背板连接,上述锁定机构的特征在于,
上述锁定机构具有固定于上述箱体的固定部件和卡合部件,上述卡合部件能够滑动地支撑于上述固定部件,并具备与形成于多个上述印制电路板的各个印制电路板的卡合部卡合的多个卡合片,
在使上述卡合片卡合于上述卡合部时,上述卡合片向上述印制电路板的连接器与上述背板的连接器嵌合的方向按压上述印制电路板。
2.根据权利要求1所述的锁定机构,其特征在于,
上述卡合部形成于上述印制电路板的上述连接器的附近。
3.根据权利要求2所述的锁定机构,其特征在于,
上述卡合部件配置于上述印制电路板与上述背板之间。
4.根据权利要求1~3任一项中所述的锁定机构,其特征在于,
上述卡合部件具有操作部,
通过操作上述操作部来使上述卡合部件移动,从而进行上述卡合部与上述卡合片的卡合以及卡合解除。
5.根据权利要求1~3任一项中所述的锁定机构,其特征在于,
上述锁定机构具有在使上述卡合部件的一部分向上述箱体的外部突出的方向上按压上述卡合部件的一部分的加力部件,
在上述箱体安装于其它设备时,上述其它设备按压上述卡合部件的突出至上述箱体的外部的部分,从而使上述卡合部件移动以使上述卡合部与上述卡合片卡合。
6.根据权利要求1~3任一项中所述的锁定机构,其特征在于,
上述卡合部形成为在厚度方向上贯通上述印制电路板的孔,
通过使上述卡合部件在上述印制电路板的厚度方向移动,来进行上述卡合片与上述卡合部的卡合或者卡合解除,
上述卡合片在与上述卡合部抵接的面具有倾斜部。
7.根据权利要求1~3任一项中所述的锁定机构,其特征在于,
上述卡合部通过呈圆弧状地切开上述印制电路板而形成,
通过使上述卡合部件转动,来进行上述卡合片与上述卡合部的卡合或者卡合解除。
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