CN109689294B - 研磨垫 - Google Patents
研磨垫 Download PDFInfo
- Publication number
- CN109689294B CN109689294B CN201780053882.XA CN201780053882A CN109689294B CN 109689294 B CN109689294 B CN 109689294B CN 201780053882 A CN201780053882 A CN 201780053882A CN 109689294 B CN109689294 B CN 109689294B
- Authority
- CN
- China
- Prior art keywords
- polishing pad
- particles
- cerium oxide
- polymer
- contained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016181919 | 2016-09-16 | ||
JP2016-181919 | 2016-09-16 | ||
PCT/JP2017/033533 WO2018052133A1 (ja) | 2016-09-16 | 2017-09-15 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109689294A CN109689294A (zh) | 2019-04-26 |
CN109689294B true CN109689294B (zh) | 2022-01-25 |
Family
ID=61619530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780053882.XA Active CN109689294B (zh) | 2016-09-16 | 2017-09-15 | 研磨垫 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7123799B2 (ja) |
KR (1) | KR102449663B1 (ja) |
CN (1) | CN109689294B (ja) |
TW (1) | TWI745432B (ja) |
WO (1) | WO2018052133A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111558865A (zh) * | 2020-05-23 | 2020-08-21 | 安徽财经大学 | 一种大尺寸tft-lcd玻璃基板的面研磨装置及方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007250166A (ja) * | 2006-02-14 | 2007-09-27 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法 |
CN104552033A (zh) * | 2013-10-16 | 2015-04-29 | 三芳化学工业股份有限公司 | 制造研磨垫及研磨装置的方法 |
CN104552034A (zh) * | 2013-10-18 | 2015-04-29 | 三芳化学工业股份有限公司 | 研磨垫、研磨装置及制造研磨垫的方法 |
JP2015140402A (ja) * | 2014-01-29 | 2015-08-03 | 東ソー株式会社 | 遊離砥粒、遊離砥粒研磨用研磨剤及びその製造方法 |
CN105500225A (zh) * | 2015-12-25 | 2016-04-20 | 江苏锋芒复合材料科技集团有限公司 | 一种高综合性能复合研磨片及其制造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6128573A (ja) * | 1984-07-18 | 1986-02-08 | Mitsubishi Mining & Cement Co Ltd | 研磨パツド及びその製造方法 |
JPH03270883A (ja) * | 1990-03-22 | 1991-12-03 | Mitsui Mining & Smelting Co Ltd | 酸化セリウム研磨材 |
JPH10249737A (ja) * | 1997-03-14 | 1998-09-22 | Nikon Corp | 磁気記録媒体用基板の研磨用パッド及び研磨方法 |
JP3560484B2 (ja) * | 1998-08-05 | 2004-09-02 | 昭和電工株式会社 | Lsiデバイス研磨用研磨材組成物及び研磨方法 |
JP2000273443A (ja) | 1999-03-23 | 2000-10-03 | Asahi Glass Co Ltd | ディスプレイ用ガラス基板の研磨用砥材、研磨方法および砥材の品質評価方法 |
EP1201607B1 (en) | 1999-05-28 | 2014-07-30 | Hitachi Chemical Company, Ltd. | Cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device |
JP2002346912A (ja) * | 2001-05-18 | 2002-12-04 | Nippon Sheet Glass Co Ltd | 情報記録媒体用ガラス基板及びその製造方法 |
JP2003062754A (ja) * | 2001-08-24 | 2003-03-05 | Ricoh Co Ltd | 研磨具及び研磨具の製造方法 |
JP2004358584A (ja) * | 2003-06-03 | 2004-12-24 | Fuji Spinning Co Ltd | 研磨布及び研磨加工方法 |
JP2005007520A (ja) * | 2003-06-19 | 2005-01-13 | Nihon Micro Coating Co Ltd | 研磨パッド及びその製造方法並びに研磨方法 |
CN102149789A (zh) * | 2008-09-12 | 2011-08-10 | 费罗公司 | 化学-机械抛光组合物及其制造和使用的方法 |
KR101186531B1 (ko) * | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
KR102398130B1 (ko) * | 2014-10-31 | 2022-05-13 | 주식회사 쿠라레 | 연마층용 비다공성 성형체, 연마 패드 및 연마 방법 |
-
2017
- 2017-09-15 KR KR1020197006222A patent/KR102449663B1/ko active IP Right Grant
- 2017-09-15 JP JP2018539197A patent/JP7123799B2/ja active Active
- 2017-09-15 WO PCT/JP2017/033533 patent/WO2018052133A1/ja active Application Filing
- 2017-09-15 CN CN201780053882.XA patent/CN109689294B/zh active Active
- 2017-09-15 TW TW106131825A patent/TWI745432B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007250166A (ja) * | 2006-02-14 | 2007-09-27 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法 |
CN104552033A (zh) * | 2013-10-16 | 2015-04-29 | 三芳化学工业股份有限公司 | 制造研磨垫及研磨装置的方法 |
CN104552034A (zh) * | 2013-10-18 | 2015-04-29 | 三芳化学工业股份有限公司 | 研磨垫、研磨装置及制造研磨垫的方法 |
JP2015140402A (ja) * | 2014-01-29 | 2015-08-03 | 東ソー株式会社 | 遊離砥粒、遊離砥粒研磨用研磨剤及びその製造方法 |
CN105500225A (zh) * | 2015-12-25 | 2016-04-20 | 江苏锋芒复合材料科技集团有限公司 | 一种高综合性能复合研磨片及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201815963A (zh) | 2018-05-01 |
JPWO2018052133A1 (ja) | 2019-07-04 |
KR102449663B1 (ko) | 2022-09-29 |
WO2018052133A1 (ja) | 2018-03-22 |
TWI745432B (zh) | 2021-11-11 |
KR20190043544A (ko) | 2019-04-26 |
CN109689294A (zh) | 2019-04-26 |
JP7123799B2 (ja) | 2022-08-23 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Osaka, Japan Applicant after: Nida DuPont Co., Ltd Address before: Osaka, Japan Applicant before: NITTA HAAS Inc. |
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GR01 | Patent grant | ||
GR01 | Patent grant |