CN109689294B - 研磨垫 - Google Patents

研磨垫 Download PDF

Info

Publication number
CN109689294B
CN109689294B CN201780053882.XA CN201780053882A CN109689294B CN 109689294 B CN109689294 B CN 109689294B CN 201780053882 A CN201780053882 A CN 201780053882A CN 109689294 B CN109689294 B CN 109689294B
Authority
CN
China
Prior art keywords
polishing pad
particles
cerium oxide
polymer
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780053882.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN109689294A (zh
Inventor
赤时正敏
伊藤一则
喜多良夫
河井奈绪子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nida Dupont Co ltd
Original Assignee
Nida Dupont Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nida Dupont Co ltd filed Critical Nida Dupont Co ltd
Publication of CN109689294A publication Critical patent/CN109689294A/zh
Application granted granted Critical
Publication of CN109689294B publication Critical patent/CN109689294B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201780053882.XA 2016-09-16 2017-09-15 研磨垫 Active CN109689294B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016181919 2016-09-16
JP2016-181919 2016-09-16
PCT/JP2017/033533 WO2018052133A1 (ja) 2016-09-16 2017-09-15 研磨パッド

Publications (2)

Publication Number Publication Date
CN109689294A CN109689294A (zh) 2019-04-26
CN109689294B true CN109689294B (zh) 2022-01-25

Family

ID=61619530

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780053882.XA Active CN109689294B (zh) 2016-09-16 2017-09-15 研磨垫

Country Status (5)

Country Link
JP (1) JP7123799B2 (ja)
KR (1) KR102449663B1 (ja)
CN (1) CN109689294B (ja)
TW (1) TWI745432B (ja)
WO (1) WO2018052133A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111558865A (zh) * 2020-05-23 2020-08-21 安徽财经大学 一种大尺寸tft-lcd玻璃基板的面研磨装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250166A (ja) * 2006-02-14 2007-09-27 Hoya Corp 磁気ディスク用ガラス基板の製造方法
CN104552033A (zh) * 2013-10-16 2015-04-29 三芳化学工业股份有限公司 制造研磨垫及研磨装置的方法
CN104552034A (zh) * 2013-10-18 2015-04-29 三芳化学工业股份有限公司 研磨垫、研磨装置及制造研磨垫的方法
JP2015140402A (ja) * 2014-01-29 2015-08-03 東ソー株式会社 遊離砥粒、遊離砥粒研磨用研磨剤及びその製造方法
CN105500225A (zh) * 2015-12-25 2016-04-20 江苏锋芒复合材料科技集团有限公司 一种高综合性能复合研磨片及其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128573A (ja) * 1984-07-18 1986-02-08 Mitsubishi Mining & Cement Co Ltd 研磨パツド及びその製造方法
JPH03270883A (ja) * 1990-03-22 1991-12-03 Mitsui Mining & Smelting Co Ltd 酸化セリウム研磨材
JPH10249737A (ja) * 1997-03-14 1998-09-22 Nikon Corp 磁気記録媒体用基板の研磨用パッド及び研磨方法
JP3560484B2 (ja) * 1998-08-05 2004-09-02 昭和電工株式会社 Ｌｓｉデバイス研磨用研磨材組成物及び研磨方法
JP2000273443A (ja) 1999-03-23 2000-10-03 Asahi Glass Co Ltd ディスプレイ用ガラス基板の研磨用砥材、研磨方法および砥材の品質評価方法
EP1201607B1 (en) 1999-05-28 2014-07-30 Hitachi Chemical Company, Ltd. Cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device
JP2002346912A (ja) * 2001-05-18 2002-12-04 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
JP2003062754A (ja) * 2001-08-24 2003-03-05 Ricoh Co Ltd 研磨具及び研磨具の製造方法
JP2004358584A (ja) * 2003-06-03 2004-12-24 Fuji Spinning Co Ltd 研磨布及び研磨加工方法
JP2005007520A (ja) * 2003-06-19 2005-01-13 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法並びに研磨方法
CN102149789A (zh) * 2008-09-12 2011-08-10 费罗公司 化学-机械抛光组合物及其制造和使用的方法
KR101186531B1 (ko) * 2009-03-24 2012-10-08 차윤종 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드
KR102398130B1 (ko) * 2014-10-31 2022-05-13 주식회사 쿠라레 연마층용 비다공성 성형체, 연마 패드 및 연마 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250166A (ja) * 2006-02-14 2007-09-27 Hoya Corp 磁気ディスク用ガラス基板の製造方法
CN104552033A (zh) * 2013-10-16 2015-04-29 三芳化学工业股份有限公司 制造研磨垫及研磨装置的方法
CN104552034A (zh) * 2013-10-18 2015-04-29 三芳化学工业股份有限公司 研磨垫、研磨装置及制造研磨垫的方法
JP2015140402A (ja) * 2014-01-29 2015-08-03 東ソー株式会社 遊離砥粒、遊離砥粒研磨用研磨剤及びその製造方法
CN105500225A (zh) * 2015-12-25 2016-04-20 江苏锋芒复合材料科技集团有限公司 一种高综合性能复合研磨片及其制造方法

Also Published As

Publication number Publication date
TW201815963A (zh) 2018-05-01
JPWO2018052133A1 (ja) 2019-07-04
KR102449663B1 (ko) 2022-09-29
WO2018052133A1 (ja) 2018-03-22
TWI745432B (zh) 2021-11-11
KR20190043544A (ko) 2019-04-26
CN109689294A (zh) 2019-04-26
JP7123799B2 (ja) 2022-08-23

Similar Documents

Publication Publication Date Title
CN107107307B (zh) 研磨垫
JP6539910B2 (ja) 研磨パッド及びその製造方法
TWI722108B (zh) 研磨墊及研磨墊之製造方法
CN111542415B (zh) 研磨垫
CN109689294B (zh) 研磨垫
JP6983001B2 (ja) 研磨パッド
JP2005068168A (ja) ガラス研磨ポリウレタンパッド用２液型組成物、該組成物を用いたガラス研磨ポリウレタンパッド、及びその製造方法
JP6483991B2 (ja) 研磨材料の製造方法
TWI833693B (zh) 研磨墊、研磨墊之製造方法、研磨光學材料或半導體材料之表面之方法、及減少研磨光學材料或半導體材料之表面時之刮痕之方法
JP6570403B2 (ja) 研磨パッド
JP7489808B2 (ja) 研磨パッド、研磨方法及び研磨パッドの評価方法
JP4491837B2 (ja) ウレタンフォームの製造方法。
JP2018127562A (ja) 高分子体、研磨パッド、および、高分子体の製造方法
JP2006282719A (ja) ポリウレタンフォームの製造方法
JP6941712B1 (ja) 研磨パッド
JP6570404B2 (ja) 研磨パッド
CN111542416B (zh) 研磨垫
JP2019034385A (ja) 研磨パッド
JP2011212775A (ja) ポリウレタン研磨パッド部材組成物
JP2008126363A (ja) ポリウレタン研磨パッドの製造方法
JP2022098805A (ja) 研磨パッド
JP2021112801A (ja) 研磨パッド
JP2022098103A (ja) 研磨パッド
JP2006299076A (ja) ポリウレタンフォーム
JP2017064885A (ja) 研磨パッド

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Osaka, Japan

Applicant after: Nida DuPont Co., Ltd

Address before: Osaka, Japan

Applicant before: NITTA HAAS Inc.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant