CN109689294B - Polishing pad - Google Patents
Polishing pad Download PDFInfo
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- CN109689294B CN109689294B CN201780053882.XA CN201780053882A CN109689294B CN 109689294 B CN109689294 B CN 109689294B CN 201780053882 A CN201780053882 A CN 201780053882A CN 109689294 B CN109689294 B CN 109689294B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a polishing pad and the like, the polishing pad having a pad main body formed of a polymer body including a polyurethane resin and ceria particles, the pad main body being a portion constituting a polishing surface, the ceria particles being included in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles.
Description
Cross reference to related applications
The priority of Japanese patent application 2016-.
Technical Field
The present invention relates to a polishing pad.
Background
As a polishing pad for polishing an object to be polished (e.g., a glass plate), a polishing pad formed of a polymer containing a urethane resin and cerium oxide particles is used (e.g., patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2007-250166.
Disclosure of Invention
Technical problem
However, linear flaws called scratches may be generated on the surface of the object to be polished by polishing. In recent years, reduction of the scratches has been demanded in polishing using a polishing pad.
In view of the above-mentioned needs, an object of the present invention is to provide a polishing pad which is less likely to cause scratches on an object to be polished.
Means for solving the problems
A polishing pad according to one aspect of the present invention is a polishing pad having a polishing surface,
the polishing pad has a pad main body formed of a polymer body containing a polyurethane resin and cerium oxide particles,
the pad main body is a portion constituting the polishing surface,
the ceria particles are contained in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles, and the ratio of the ceria particles contained in the polymer body with a particle diameter of 30 μm or more is 7,000 particles/cm3The following.
In the polishing pad according to one aspect of the present invention, the ceria particles are contained in the polymer material so as to have a maximum particle diameter of 80 μm or less.
In addition, a polishing pad according to another aspect of the present invention is a polishing pad having a polishing surface,
the polishing pad has a pad main body formed of a polymer body containing a polyurethane resin and cerium oxide particles,
the pad main body is a portion constituting the polishing surface,
the ceria particles are contained in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles, and are contained in the polymer body at a maximum particle diameter of 80 μm or less.
In the polishing pad according to the present invention, it is preferable that the volume-based median particle diameter of the cerium oxide particles contained in the polymer is 0.80 to 2.00 μm as measured by a laser diffraction method.
Detailed Description
Next, an embodiment of the invention will be explained.
< embodiment 1 >
First, a polishing pad according to embodiment 1 will be described.
The polishing pad according to embodiment 1 has a polishing surface.
The polishing pad according to embodiment 1 has a pad body formed of a polymer body containing a polyurethane resin and cerium oxide particles.
The polishing pad according to embodiment 1 is used for polishing a glass plate as an object to be polished.
The pad body is a portion constituting a polishing surface of the polishing pad.
Cerium oxide particles are dispersed in the polymer.
The ceria particles are contained in a polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles.
The polishing pad according to embodiment 1 can improve the polishing rate of a glass plate as an object to be polished by containing cerium oxide particles.
In addition, the polishing pad according to embodiment 1 contains the cerium oxide particles, and thus an interface is formed between the cerium oxide particles and the polyurethane resin, and as a result, the shear rate can be increased by this interface. That is, the polishing pad according to embodiment 1 contains the ceria particles, and therefore has excellent dressing properties.
It is important that the ceria particles are contained in the polymer in a proportion of 7,000 particles/cm and a particle diameter of 30 μm or more3Preferably 200 to 6,000 pieces/cm3More preferably 1,000 to 4,000 pieces/cm3More preferably 1,000 to 2,000 pieces/cm3。
In other words, it is important that the ratio of the cerium oxide particles contained in the polymer body have a particle diameter of 30 μm or more and a maximum particle diameter or less is 7,000 particles/cm3Preferably 200 to 6,000 pieces/cm3More preferably 1,000 to 4,000 pieces/cm3More preferably 1,000 to 2000 pieces/cm3。
The ratio of the cerium oxide particles contained in the polymer body is 7,000 particles/cm, and the particle diameter of the cerium oxide particles is 30 μm or more3The number of the ceria particles contained in the polymer is suppressed. As a result, according to the polishing pad of embodiment 1, scratches are less likely to occur in the object to be polished.
The ratio of the cerium oxide particles contained in the polymer body is 200 particles/cm, with a particle size of 30 μm or more3As described above, a plurality of interfaces between the cerium oxide particles and the urethane resin, which easily increase the shear rate, are formed. As a result, the polishing pad according to embodiment 1 is excellent in the dressing property.
The ratio of the cerium oxide particles contained in the polymer body with a particle size of 30 μm or more can be determined by using an X-ray CT apparatus. In addition, the ratio (pieces/cm)3) Volume (cm) of the denominator part of (c)3) Refers to the volume of the polymer. In addition, even in the case where the polymer body is a foam as described below, the ratio (pieces/cm) is3) Volume (cm) of the denominator part of (c)3) It also means the volume of the polymer body as a foam.
Specifically, the volume of each ceria particle contained in two places in a measurement target range of the polymer (for example, 0.7mm × 1.6mm × 1.6mm) is measured using an X-ray CT apparatus, and the diameter of each ceria particle is determined by using the diameter of a sphere having the same volume as the diameter of each ceria particle.
Next, the number of ceria particles having a particle diameter of 30 μm or more, which are contained in two places in the range to be measured of the polymer, is determined.
Then, the ratio of the ceria particles contained in the polymer body with a particle diameter of 30 μm or more was determined.
The ceria particles are preferably contained in the polymer body at a maximum particle size of 80 μm or less, more preferably at a maximum particle size of 30 to 70 μm, and still more preferably at a maximum particle size of 40 to 50 μm.
The ceria particles are contained in the polymer body at a maximum particle diameter of 80 μm or less, whereby the number of relatively large ceria particles contained in the polymer body is suppressed. As a result, according to the polishing pad of embodiment 1, scratches are less likely to occur in the object to be polished.
The maximum particle size of the cerium oxide particles contained in the polymer can be determined using an X-ray CT apparatus.
Specifically, the volume of each ceria particle contained in a measurement target range of a polymer to be measured (for example, 30mm (vertical) × 30mm (horizontal) × 1 to 3mm (thickness) (thickness is appropriately adjusted depending on the thickness of the mat)) is measured using an X-ray CT apparatus, and the diameter of each ceria particle is determined by using the diameter of a sphere having the same volume as the diameter of each ceria particle.
Then, the maximum particle size of the cerium oxide particles contained in the polymer is determined.
When the cerium oxide particles are contained in the polymer body in a maximum particle size of 80 μm or less, the ratio of the cerium oxide particles contained in the polymer body in a particle size of 30 to 80 μm is preferably 7,000 particles/cm3More preferably 200 to 6,000 pieces/cm3More preferably 1,000 to 4,000 pieces/cm3Particularly preferably 1,000 to 2,000 pieces/cm3。
The average particle diameter of the cerium oxide particles contained in the polymer is preferably 7.0 to 29 μm, more preferably 10 to 20 μm, and still more preferably 10 to 15 μm.
The average particle diameter of the cerium oxide particles contained in the polymer can be determined using an X-ray CT apparatus.
Specifically, the volume of each cerium oxide particle contained in a measurement target range (for example, 0.7mm × 1.6mm × 1.6mm) of a polymer to be measured is measured using an X-ray CT apparatus, and the diameter of each cerium oxide particle is determined by setting the diameter of a sphere having the same volume as the diameter of each cerium oxide particle.
In addition, when the diameter of each cerium oxide particle is determined using an X-ray CT apparatus, particles smaller than 4.0 μm cannot be observed due to the spatial resolution of the apparatus, and therefore, only particles of 4.0 μm or more are used as the particles to be measured.
Then, the average particle diameter of the cerium oxide particles contained in the polymer is determined by arithmetically averaging the diameter values of the cerium oxide particles.
As the X-ray CT apparatus, TDM 1000H-I manufactured by Yamato scientific Co., Ltd can be used.
The volume-based median particle diameter of the cerium oxide particles measured by a laser diffraction method is preferably 0.80 to 2.00. mu.m, and more preferably 0.90 to 1.50. mu.m.
That is, the volume-based median particle diameter of the cerium oxide particles contained in the polymer is preferably 0.80 to 2.00 μm, more preferably 0.90 to 1.50 μm, as measured by a laser diffraction method.
Since the median particle diameter is 0.80 μm or more, the particle diameter of the primary particles of ceria becomes large. As a result, the specific surface area of the ceria primary particles is reduced, and the aggregation of the ceria particles is suppressed.
In the present specification, the median diameter can be measured as follows.
First, a polymer sample of a polishing pad was placed in a platinum crucible, and the platinum crucible containing the sample was heated in a combustion furnace to carbonize the sample. During the heating, the polishing pad was not scattered outside the platinum crucible.
Next, the platinum crucible containing the carbonized sample was heated at 400 ℃ for 28 hours in an air atmosphere using an electric furnace, and the carbonized sample was ashed to take out the ceria.
Then, the ceria taken out of the polishing pad is dispersed in a dispersion medium (e.g., deionized water or the like) to obtain a dispersion.
Then, the dispersion was supplied to a laser diffraction particle size distribution measuring apparatus and analyzed to determine the volume-based median particle diameter of cerium oxide. In other words, the volume-based particle size distribution of the ceria contained in the dispersion is determined by the laser diffraction method, and the volume-based median particle diameter of the ceria particles contained in the dispersion is determined from the particle size distribution.
Then, the "volume-based median particle diameter of the cerium oxide particles in the dispersion" is defined as "volume-based median particle diameter of the cerium oxide particles contained in the polymer body measured by a laser diffraction method".
The polymer contains preferably 3 to 40 mass%, more preferably 5 to 30 mass%, and still more preferably 7 to 24 mass% of cerium oxide particles.
The urethane resin is obtained by bonding an active hydrogen compound and polyisocyanate as an isocyanate compound.
The polyurethane resin includes a 1 st constituent unit derived from an active hydrogen-containing compound (hereinafter also referred to as an "active hydrogen compound") and a 2 nd constituent unit derived from an isocyanate group-containing compound (hereinafter also referred to as an "isocyanate compound").
Examples of the polyisocyanate include polyisocyanate and polyisocyanate polymer.
Examples of the polyisocyanate include aromatic diisocyanates, aliphatic diisocyanates, and alicyclic diisocyanates.
As the aromatic diisocyanate, there can be used: crude diphenylmethane diisocyanate (crude MDI) obtained by reacting an amine compound obtained by condensing aniline and formaldehyde with phosgene or the like in an inert solvent, diphenylmethane diisocyanate (pure MDI) obtained by purifying the crude MDI, polymethylene polyphenylene polyisocyanate (polymeric MDI), and modified products thereof, and Toluene Diisocyanate (TDI), 1, 5-naphthalene diisocyanate, xylylene diisocyanate, 1, 3-phenylene diisocyanate, 1, 4-phenylene diisocyanate, and the like can also be used. These aromatic diisocyanates may be used alone or in combination of two or more.
Examples of the modified diphenylmethane diisocyanate include a carbodiimide-modified product, a urethane-modified product, an allophanate-modified product, a urea-modified product, a biuret-modified product, an isocyanurate-modified product, and an oxazolidone-modified product. Specific examples of the modified product include carbodiimide-modified diphenylmethane diisocyanate (carbodiimide-modified MDI).
Examples of the aliphatic diisocyanate include ethylene diisocyanate, 2, 4-trimethylhexamethylene diisocyanate, and 1, 6-hexamethylene diisocyanate.
Examples of the alicyclic diisocyanate include 1, 4-cyclohexane diisocyanate, 4' -dicyclohexylmethane diisocyanate, isophorone diisocyanate, norbornane diisocyanate, and methylenebis (4, 1-cyclohexylene) diisocyanate.
Examples of the polyisocyanate polymer include polymers obtained by bonding a polyol and at least one diisocyanate selected from aromatic diisocyanates, aliphatic diisocyanates, and alicyclic diisocyanates.
As the polyisocyanate, diphenylmethane diisocyanate (pure MDI), polymeric MDI or a modified product thereof is preferable in that the vapor pressure is low, the polyisocyanate is not easily volatilized, and the working environment can be easily controlled. Further, carbodiimide-modified MDI, polymeric MDI, or a mixture thereof with MDI is preferable in terms of lower viscosity and ease of handling.
The active hydrogen compound is an organic compound having an active hydrogen group capable of reacting with an isocyanate group in the molecule. Specific examples of the active hydrogen group include a hydroxyl group, a primary amino group, a secondary amino group, a thiol group, and other functional groups, and the active hydrogen compound may have only 1 kind of the functional group in the molecule or may have a plurality of kinds of the functional groups in the molecule.
As the active hydrogen compound, for example, a polyol compound having a plurality of hydroxyl groups in the molecule, a polyamine compound having a plurality of primary or secondary amino groups in the molecule, or the like can be used.
Examples of the polyol compound include a polyol monomer and a polyol polymer.
Examples of the polyol monomer include linear aliphatic diols such as 1, 4-benzenedimethanol, 1, 4-bis (2-hydroxyethoxy) benzene, ethylene glycol, propylene glycol, 1, 3-propanediol, 1, 3-butanediol, 1, 5-pentanediol, 3-methyl-1, 5-pentanediol, 1, 6-hexanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, tripropylene glycol, polyethylene glycol having a molecular weight of 400 or less, 1, 8-octanediol, and 1, 9-nonanediol, branched aliphatic diols such as neopentyl glycol, 3-methyl-1, 5-pentanediol, 2-methyl-1, 3-propanediol, 2-butyl-2-ethyl-1, 3-propanediol, and 2-methyl-1, 8-octanediol, alicyclic diols such as 1, 4-cyclohexanediol, 1, 4-cyclohexanedimethanol, and hydrogenated bisphenol A, examples thereof include polyfunctional polyols such as glycerin, trimethylolpropane, pentaerythritol, and sorbitol.
The polyol monomer is preferably ethylene glycol or diethylene glycol, because the strength during the reaction is more likely to be improved, the rigidity of the polishing pad comprising polyurethane foam to be produced is more likely to be improved, and the polishing pad is relatively inexpensive.
Examples of the polyol polymer include polyether polyols, polyester polycarbonate polyols, and polycarbonate polyols. Further, as the polyol polymer, there can be also cited a polyfunctional polyol polymer having 3 or more hydroxyl groups in the molecule.
Specifically, the polyether polyol includes polytetramethylene glycol (PTMG), polypropylene glycol (PPG), polyethylene glycol (PEG), ethylene oxide-added polypropylene polyol, and the like.
Examples of the polyester polyol include polybutylene adipate, polyhexamethylene adipate, and polycaprolactone polyol.
Examples of the polyester polycarbonate polyol include a reaction product of a polyester diol such as polycaprolactone polyol and alkylene carbonate, and a reaction product obtained by reacting ethylene carbonate and a polyol to obtain a reaction mixture, and further reacting the reaction mixture with an organic dicarboxylic acid.
Examples of the polycarbonate polyol include: reaction products of diols such as 1, 3-propanediol, 1, 4-butanediol, 1, 6-hexanediol, diethylene glycol, polyethylene glycol, polypropylene glycol, or polytetramethylene glycol with phosgene, diallyl carbonate (e.g., diphenyl carbonate), or cyclic carbonates (e.g., propylene carbonate), and the like.
The polyol polymer is preferably a polyol polymer having a number average molecular weight of 800 to 8000, more specifically, polytetramethylene glycol (PTMG) or ethylene oxide-added polypropylene polyol, in order to easily obtain a foamed polyurethane having elasticity.
In the present specification, the number average molecular weight refers to a value measured by GPC (gel permeation chromatography).
Examples of the polyvalent amine compound include 4,4 ' -methylenebis (2-chloroaniline) (MOCA), 2, 6-dichloro-p-phenylenediamine, 4 ' -methylenebis (2, 3-dichloroaniline), 3, 5-bis (methylthio) -2, 4-tolylenediamine, 3, 5-bis (methylthio) -2, 6-tolylenediamine, 3, 5-diethyltoluene-2, 4-diamine, 3, 5-diethyltoluene-2, 6-diamine, propyleneglycol-di-p-aminobenzoate, 1, 2-bis (2-aminophenylthio) ethane, 4 ' -diamino-3, 3 ' -diethyl-5, 5 ' -dimethyldiphenylmethane, and the like.
The polishing pad according to embodiment 1 is formed as described above, and a method for manufacturing the polishing pad according to embodiment 1 will be described below.
A method for manufacturing a polishing pad according to embodiment 1 is a method for manufacturing a polishing pad having a pad main body formed of a polymer body containing a polyurethane resin and cerium oxide particles.
The method for manufacturing a polishing pad according to embodiment 1 includes the steps of: a dispersion step of mixing a liquid prepolymer having 2 or more isocyanate groups in a molecule and cerium oxide particles to obtain a mixed solution, and dispersing the cerium oxide particles in the mixed solution; and a curing step of curing the liquid prepolymer by mixing the mixed solution with an organic compound containing 2 or more active hydrogens in the molecule.
The method for producing a polishing pad according to embodiment 1 carries out the dispersion step, and the ratio of cerium oxide particles contained in the polymer body at a particle size of 30 μm or more is 7,000 particles/cm3The following.
In the above dispersion step, the shear stress is increased to stir the liquid prepolymer and the cerium oxide particles, so that the cerium oxide particles contained in the polymer body can be reduced.
In the dispersion step, the ceria particles contained in the polymer can be reduced by extending the stirring time of the liquid prepolymer and the ceria particles.
In the method for producing a polishing pad according to embodiment 1, it is preferable that the dispersion step is performed so that the ceria particles are contained in the polymer material at a maximum particle size of 80 μm or less.
The viscosity of the liquid prepolymer is preferably 1500 to 3000cps from the viewpoint of suppressing aggregation of the cerium oxide particles.
< embodiment 2 >
Next, the polishing pad and the method for manufacturing the same according to embodiment 2 will be described.
Note that description overlapping with embodiment 1 will not be repeated. What is not specifically described in embodiment 2 is considered to be the same as that described in embodiment 1.
In the polishing pad according to embodiment 2, it is important that the ceria particles are contained in the polymer material in a maximum particle size of 80 μm or less, preferably 30 to 70 μm, and more preferably 40 to 50 μm.
The ceria particles are contained in the polymer body at a maximum particle diameter of 80 μm or less, whereby the number of relatively large ceria particles contained in the polymer body is suppressed. As a result, according to the polishing pad of embodiment 2, scratches are less likely to occur in the object to be polished.
The ratio of the cerium oxide particles to the polymer is 30 μm or moreFor example, it is preferably 7,000 pieces/cm3More preferably 200 to 6,000 pieces/cm3More preferably 1,000 to 4,000 pieces/cm3More preferably 1,000 to 2,000 pieces/cm3。
The ratio of the cerium oxide particles contained in the polymer body is preferably 7,000 particles/cm, with a particle size of 30 μm or more3The number of the ceria particles contained in the polymer is suppressed. As a result, with the polishing pad according to embodiment 2, scratches are less likely to occur in the object to be polished.
The ratio of the cerium oxide particles contained in the polymer body is preferably 200 particles/cm, with a particle size of 30 μm or more3As described above, a plurality of interfaces between the cerium oxide particles and the urethane resin, which facilitate the increase in shear rate, can be formed. As a result, the polishing pad according to embodiment 2 is excellent in the dressing property.
The method for producing a polishing pad according to embodiment 2 performs the dispersion step so that the ceria particles are contained in the polymer material at a maximum particle size of 80 μm or less.
In the method for producing a polishing pad according to embodiment 2, the dispersion step is preferably performed such that the ceria particles are contained in the polymer in a proportion of 7,000 particles/cm and a particle diameter of 30 μm or more3The following.
The polishing pad according to the present embodiment is configured as described above, and therefore has the following advantages.
The inventors of the present invention conducted extensive studies to find that: the scratch was caused by the fact that, in the conventional polishing pad, the ceria particles aggregated to form large particles and existed on the polishing surface, and thus, embodiments 1 and 2 were completed.
That is, the polishing pad according to embodiment 1 is a polishing pad having a polishing surface.
The polishing pad according to embodiment 1 has a pad body formed of a polymer body containing a polyurethane resin and cerium oxide particles.
The pad body is a portion constituting the polishing surface.
The ceria particles are contained in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles.
The ratio of the cerium oxide particles contained in the polymer body at a particle size of 30 μm or more is 7,000 particles/cm3The following.
The polishing pad can be a polishing pad in which scratches are not easily generated in an object to be polished.
In the polishing pad according to embodiment 1, the ceria particles are preferably contained in the polymer material so as to have a maximum particle diameter of 80 μm or less.
The polishing pad according to embodiment 2 is a polishing pad having a polishing surface.
The polishing pad according to embodiment 2 has a pad body formed of a polymer body containing a polyurethane resin and cerium oxide particles.
The pad body is a portion constituting the polishing surface.
The ceria particles are contained in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles.
The ceria particles are contained in the polymer body so as to have a maximum particle diameter of 80 μm or less.
The polishing pad can be a polishing pad in which scratches are not easily generated in an object to be polished.
In the polishing pad according to embodiment 1 or 2, it is preferable that the volume-based median particle diameter of the cerium oxide particles contained in the polymer is 0.80 to 2.00 μm as measured by a laser diffraction method.
The polishing pad according to the present invention is not limited to the polishing pads according to embodiments 1 and 2. The polishing pad according to the present invention is not limited to the above-described effects. The polishing pad of the present invention can be variously modified within a range not departing from the gist of the present invention.
For example, in the polishing pad according to the present invention, the polymer body may be a foam.
When the polymer body is a foam, the dispersion step produces the mixed liquid further containing a foaming agent.
The foaming agent is not particularly limited as long as it generates gas to form bubbles when the polyurethane foam is molded, and the foaming agent forms bubbles in the polyurethane foam, and for example, an organic chemical foaming agent that generates gas by decomposition by heating, a low-boiling hydrocarbon having a boiling point of-5 to 70 ℃, a halogenated hydrocarbon, water, liquefied carbon dioxide, or the like may be used alone or in combination.
Examples of the organic chemical blowing agent include azo compounds (azodicarbonamide, azodiisobutyronitrile, diazoaminobenzene, barium azodicarboxylate, etc.), nitroso compounds (N, N '-dinitrosopentamethylenetetramine, N' -dinitroso-N, N '-dimethylterephthalamide, etc.), sulfonyl hydrazide compounds [ p, p' -oxybis (benzenesulfonyl hydrazide), p-toluenesulfonyl hydrazide, etc. ].
Examples of the low boiling point hydrocarbon include butane, pentane, cyclopentane, and a mixture thereof.
Examples of the halogenated hydrocarbon include methylene chloride and HFC (hydrofluorocarbons).
The foaming agent may be a heat-expandable spherical body. The particle size of the heat-expandable spherical body is, for example, 2 to 100 μm. The heat-expandable spherical body comprises a hollow body made of a thermoplastic resin, and a liquid hydrocarbon provided in the hollow portion of the hollow body. Examples of the heat-expandable spherical body include Expancel (registered trademark) manufactured by Fillite corporation of japan, and heat-expandable microcapsules (trademark: Matsumoto microspheres (registered trademark) (e.g., F-48D)) manufactured by panada oil and fat pharmaceuticals.
Examples
The present invention will be described in more detail below with reference to examples and comparative examples.
(example 1)
A liquid urethane prepolymer having 2 isocyanates as terminal groups, Mirek (registered trademark) E30 (manufactured by Mitsui Metal industries, Ltd.) as ceria particles, and a thermally expandable microcapsule (F-48D) as a foaming agent were put into a tank, and stirred for 10 minutes by a stirrer (stirring paddle: disk and paddle type, diameter of stirring paddle: 115mm, rotation speed: 1350rpm) to obtain a mixed solution. The median particle diameter of the ceria particles used as the material is determined by the above method.
Then, this mixed solution was mixed with 4, 4' -methylenebis (2-chloroaniline) (MOCA) and polymerized and foamed to obtain a disk-shaped polishing pad (concentration of ceria particles: 20.0 mass%) (820mm (diameter) × 2mm (thickness)).
The volume-based median particle diameter of the cerium oxide particles contained in the polymer body measured by a laser diffraction method was 1.26 μm. The median diameter is determined by the method described above.
(example 2)
A polymer polishing pad was obtained in the same manner as in example 1, except that Mirek (registered trademark) E10 (manufactured by mitsui metals industries) was used as the cerium oxide particles, the stirring time for obtaining the mixed solution was set to 15 minutes, and the concentration of the cerium oxide particles in the polishing pad was set to 7.0 mass%.
The volume-based median particle diameter of the cerium oxide particles contained in the polymer body measured by a laser diffraction method was 0.97 μm. The median diameter is determined by the method described above.
(example 3)
A polymer polishing pad was obtained in the same manner as in example 2, except that the stirring was performed at a shear rate higher than that in example 1, the stirring time for obtaining a mixed solution was set to 5 minutes, and the concentration of the ceria particles in the polymer polishing pad was set to 23.9 mass%.
(example 4)
A polymer polishing pad was obtained in the same manner as in example 1, except that the stirring time for obtaining the mixed solution was set to 15 minutes and the concentration of the ceria particles in the polymer polishing pad was set to 10.0 mass%.
Comparative example 1
A polymer polishing pad was obtained in the same manner as in example 1, except that the stirring time for obtaining the mixed solution was set to 5 minutes, and the concentration of the ceria particles in the polymer polishing pad was set to 23.9 mass%.
(measurement of particle diameter)
The ratio of the above-mentioned cerium oxide particles contained in the polymer body in a particle size of 30 μm or more (hereinafter, also simply referred to as "particle ratio having a particle size of 30 μm or more") and the average particle size of the cerium oxide particles in the polymer body (hereinafter, also simply referred to as "average particle size") were determined by the above-mentioned methods.
(grinding test)
Under the following conditions, 2 glass plates (400mm (vertical) × 300mm (horizontal) × 0.4mm (thick)) were polished using a polishing pad as a polymer.
Grinding pressure: 90gf/cm2；
Grinding time: 10 minutes;
abrasive slurry: a polishing slurry containing ceria particles (Mirek (registered trademark) E30, manufactured by mitsui metals industries, ltd.) and water (concentration of Mirek (registered trademark) E30: 7 mass%);
then, the surface of the polished glass plate was observed with an optical microscope, and the total number of scratches (scratches having a length of 500 μm or more) in 2 glass plates (hereinafter, simply referred to as "total number of scratches") was confirmed.
[ Table 1]
As shown in Table 1, although no scratches were observed when the polishing pads of examples 1 to 4 were used, scratches were observed when the polishing pad of comparative example 1 was used.
Claims (4)
1. A polishing pad is characterized in that,
is a polishing pad having a polishing surface,
the polishing pad has a pad main body formed of a polymer body containing a polyurethane resin and cerium oxide particles,
the pad body is the portion that constitutes the abrasive surface,
the cerium oxide particles are contained in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles, and the ratio of the cerium oxide particles contained in the polymer body with a particle size of 30 [ mu ] m or more is 200 particles/cm3Above and 7,000 pieces/cm3The following.
2. The polishing pad of claim 1, wherein,
the cerium oxide particles are contained in the polymer body at a maximum particle diameter of 80 μm or less.
3. A polishing pad is characterized in that,
is a polishing pad having a polishing surface,
the polishing pad has a pad main body formed of a polymer body containing a polyurethane resin and cerium oxide particles,
the pad body is the portion that constitutes the abrasive surface,
the cerium oxide particles are contained in the polymer body as primary particles and secondary particles formed by aggregating a plurality of the primary particles, and are contained in the polymer body at a maximum particle diameter of 30 μm or more and 80 μm or less.
4. The polishing pad according to any one of claims 1 to 3,
the volume-based median particle diameter of the cerium oxide particles contained in the polymer body is 0.80 to 2.00 [ mu ] m as measured by a laser diffraction method.
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| JP2016181919 | 2016-09-16 | ||
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| PCT/JP2017/033533 WO2018052133A1 (en) | 2016-09-16 | 2017-09-15 | Polishing pad |
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| KR (1) | KR102449663B1 (en) |
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| CN111558865A (en) * | 2020-05-23 | 2020-08-21 | 安徽财经大学 | Surface grinding device and method for large-size TFT-LCD glass substrate |
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2017
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- 2017-09-15 JP JP2018539197A patent/JP7123799B2/en active Active
- 2017-09-15 CN CN201780053882.XA patent/CN109689294B/en active Active
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| CN104552033A (en) * | 2013-10-16 | 2015-04-29 | 三芳化学工业股份有限公司 | Method for manufacturing grinding pad and grinding device |
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| Publication number | Publication date |
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| JP7123799B2 (en) | 2022-08-23 |
| WO2018052133A1 (en) | 2018-03-22 |
| KR102449663B1 (en) | 2022-09-29 |
| TWI745432B (en) | 2021-11-11 |
| CN109689294A (en) | 2019-04-26 |
| JPWO2018052133A1 (en) | 2019-07-04 |
| TW201815963A (en) | 2018-05-01 |
| KR20190043544A (en) | 2019-04-26 |
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