CN109671695A - 引线框架及其制造方法 - Google Patents

引线框架及其制造方法 Download PDF

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Publication number
CN109671695A
CN109671695A CN201811203003.XA CN201811203003A CN109671695A CN 109671695 A CN109671695 A CN 109671695A CN 201811203003 A CN201811203003 A CN 201811203003A CN 109671695 A CN109671695 A CN 109671695A
Authority
CN
China
Prior art keywords
lead
mentioned
item
lead frame
obstruction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811203003.XA
Other languages
English (en)
Chinese (zh)
Inventor
大川内龙二
福崎润
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chang Wah Technology Co Ltd
Original Assignee
Da Kun Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Da Kun Electric Co Ltd filed Critical Da Kun Electric Co Ltd
Publication of CN109671695A publication Critical patent/CN109671695A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN201811203003.XA 2017-10-17 2018-10-16 引线框架及其制造方法 Pending CN109671695A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-201436 2017-10-17
JP2017201436A JP6938326B2 (ja) 2017-10-17 2017-10-17 リードフレーム及びその製造方法

Publications (1)

Publication Number Publication Date
CN109671695A true CN109671695A (zh) 2019-04-23

Family

ID=66142504

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811203003.XA Pending CN109671695A (zh) 2017-10-17 2018-10-16 引线框架及其制造方法

Country Status (3)

Country Link
JP (1) JP6938326B2 (ja)
CN (1) CN109671695A (ja)
TW (1) TWI783060B (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030543A (zh) * 2007-03-21 2007-09-05 宁波康强电子股份有限公司 表面贴装用的引线框架的制造方法
JP2013238406A (ja) * 2012-05-11 2013-11-28 Nisshoku Corp セシウム回収方法およびセシウム回収構造
JP2014036129A (ja) * 2012-08-09 2014-02-24 Mitsui High Tec Inc リードフレーム
JP2014192678A (ja) * 2013-03-27 2014-10-06 Panasonic Corp 情報処理装置
CN105679736A (zh) * 2014-12-05 2016-06-15 友立材料株式会社 引线框及其制造方法
JP2016122811A (ja) * 2014-12-25 2016-07-07 Ｓｈマテリアル株式会社 リードフレーム及びその製造方法
CN105845657A (zh) * 2015-01-30 2016-08-10 友立材料株式会社 引线框及其制造方法
JP2017069236A (ja) * 2015-09-28 2017-04-06 Ｓｈマテリアル株式会社 リードフレーム及びその製造方法
JP2017157643A (ja) * 2016-02-29 2017-09-07 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ及び多列型ｌｅｄ用リードフレーム、並びにそれらの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296254A (ja) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd リードフレーム
US5202577A (en) * 1990-02-06 1993-04-13 Dai Nippon Printing Co., Ltd. Leadframe having a particular dam bar
JPH0758262A (ja) * 1993-08-20 1995-03-03 Mitsui High Tec Inc リードフレーム
JP5807800B2 (ja) * 2010-11-18 2015-11-10 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
CN102738024A (zh) * 2011-04-01 2012-10-17 飞思卡尔半导体公司 半导体封装及其引线框
TWI460837B (zh) * 2012-06-19 2014-11-11 Chipbond Technology Corp 半導體封裝結構及其導線架
JP5585637B2 (ja) * 2012-11-26 2014-09-10 大日本印刷株式会社 樹脂封止型半導体装置用フレーム
TW201438173A (zh) * 2013-03-18 2014-10-01 矽品精密工業股份有限公司 導線架、封裝件及其製法
US9257306B2 (en) * 2013-04-18 2016-02-09 Dai Nippon Printing Co., Ltd. Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
KR101833312B1 (ko) * 2013-05-06 2018-03-02 해성디에스 주식회사 리드 프레임 제조 방법
US9607933B2 (en) * 2014-02-07 2017-03-28 Dawning Leading Technology Inc. Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030543A (zh) * 2007-03-21 2007-09-05 宁波康强电子股份有限公司 表面贴装用的引线框架的制造方法
JP2013238406A (ja) * 2012-05-11 2013-11-28 Nisshoku Corp セシウム回収方法およびセシウム回収構造
JP2014036129A (ja) * 2012-08-09 2014-02-24 Mitsui High Tec Inc リードフレーム
JP2014192678A (ja) * 2013-03-27 2014-10-06 Panasonic Corp 情報処理装置
CN105679736A (zh) * 2014-12-05 2016-06-15 友立材料株式会社 引线框及其制造方法
JP2016122811A (ja) * 2014-12-25 2016-07-07 Ｓｈマテリアル株式会社 リードフレーム及びその製造方法
CN105845657A (zh) * 2015-01-30 2016-08-10 友立材料株式会社 引线框及其制造方法
JP2017069236A (ja) * 2015-09-28 2017-04-06 Ｓｈマテリアル株式会社 リードフレーム及びその製造方法
JP2017157643A (ja) * 2016-02-29 2017-09-07 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ及び多列型ｌｅｄ用リードフレーム、並びにそれらの製造方法

Also Published As

Publication number Publication date
JP6938326B2 (ja) 2021-09-22
JP2019075482A (ja) 2019-05-16
TWI783060B (zh) 2022-11-11
TW201923988A (zh) 2019-06-16

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20231122

Address after: The road development processing zone Kaohsiung city Taiwan China No. 24

Applicant after: CHANG WAH TECHNOLOGY Co.,Ltd.

Address before: Kagoshima County, Japan

Applicant before: Oguchi Electric Materials Co.,Ltd.