JP5585637B2 - 樹脂封止型半導体装置用フレーム - Google Patents
樹脂封止型半導体装置用フレーム Download PDFInfo
- Publication number
- JP5585637B2 JP5585637B2 JP2012257018A JP2012257018A JP5585637B2 JP 5585637 B2 JP5585637 B2 JP 5585637B2 JP 2012257018 A JP2012257018 A JP 2012257018A JP 2012257018 A JP2012257018 A JP 2012257018A JP 5585637 B2 JP5585637 B2 JP 5585637B2
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- JP
- Japan
- Prior art keywords
- resin
- frame
- lead
- grid
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
2 リード
3 ダイパッド
4 半導体素子
5 端子部
6 金属細線
7 封止樹脂
10 リードフレーム
11 薄肉部
12 くぼみ
C モールドキャビティ
F フレーム
L グリッドリード
S 半導体装置
α カットライン
Claims (2)
- 複数のリードフレームが端子部を突設したグリッドリードを介してマトリックス状に配列されており、その各リードフレームにおける吊りリードで支持されたダイパッド上にそれぞれ半導体素子を配列し、それらの半導体素子を一括してモールドした後、各リードフレームの端子部を残すようにしてグリッドリードのところをダイシングソーで切断して個々の樹脂封止型半導体装置を得るために用いられるフレームであって、フレームのグリッドリードを切断し個片化することにより、封止樹脂の切断面及び封止樹脂下面の端部に端子部が複数隣接して形成されるものであり、各端子部の付け根付近に裏面からのハーフエッチングにより薄肉部が設けられ、その薄肉部はダイシングソーによるカットラインより外側まで形成されていることを特徴とする樹脂封止型半導体装置用フレーム。
- 複数のリードフレームが端子部を突設したグリッドリードを介してマトリックス状に配列されており、その各リードフレームにおける吊りリードで支持されたダイパッド上にそれぞれ半導体素子を配列し、それらの半導体素子を一括してモールドした後、各リードフレームの端子部を残すようにしてグリッドリードのところをダイシングソーで切断して個々の樹脂封止型半導体装置を得るために用いられるフレームであって、フレームのグリッドリードを切断し個片化することにより、封止樹脂の切断面及び封止樹脂下面の端部に端子部が複数隣接して形成されるものであり、各端子部の付け根付近に、ダイシングソーによるカットラインのところからグリッドリードの一部にまで食い込んで形成された側面からのくぼみを設けたことを特徴とする樹脂封止型半導体装置用フレーム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012257018A JP5585637B2 (ja) | 2012-11-26 | 2012-11-26 | 樹脂封止型半導体装置用フレーム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012257018A JP5585637B2 (ja) | 2012-11-26 | 2012-11-26 | 樹脂封止型半導体装置用フレーム |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009231140A Division JP5467506B2 (ja) | 2009-10-05 | 2009-10-05 | 樹脂封止型半導体装置及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014087802A Division JP5971531B2 (ja) | 2014-04-22 | 2014-04-22 | 樹脂封止型半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013065879A JP2013065879A (ja) | 2013-04-11 |
JP5585637B2 true JP5585637B2 (ja) | 2014-09-10 |
Family
ID=48189040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012257018A Expired - Lifetime JP5585637B2 (ja) | 2012-11-26 | 2012-11-26 | 樹脂封止型半導体装置用フレーム |
Country Status (1)
Country | Link |
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JP (1) | JP5585637B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6938326B2 (ja) * | 2017-10-17 | 2021-09-22 | 大口マテリアル株式会社 | リードフレーム及びその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3304705B2 (ja) * | 1995-09-19 | 2002-07-22 | セイコーエプソン株式会社 | チップキャリアの製造方法 |
JP3209696B2 (ja) * | 1996-03-07 | 2001-09-17 | 松下電器産業株式会社 | 電子部品の製造方法 |
JPH1154663A (ja) * | 1997-08-04 | 1999-02-26 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とそれに用いられる回路部材、および回路部材の製造方法 |
JP3877410B2 (ja) * | 1997-12-26 | 2007-02-07 | 三洋電機株式会社 | 半導体装置の製造方法 |
JP3429246B2 (ja) * | 2000-03-21 | 2003-07-22 | 株式会社三井ハイテック | リードフレームパターン及びこれを用いた半導体装置の製造方法 |
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2012
- 2012-11-26 JP JP2012257018A patent/JP5585637B2/ja not_active Expired - Lifetime
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JP2013065879A (ja) | 2013-04-11 |
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