CN109600983A - 部件安装装置以及安装基板的制造方法 - Google Patents

部件安装装置以及安装基板的制造方法 Download PDF

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CN109600983A
CN109600983A CN201811136659.4A CN201811136659A CN109600983A CN 109600983 A CN109600983 A CN 109600983A CN 201811136659 A CN201811136659 A CN 201811136659A CN 109600983 A CN109600983 A CN 109600983A
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substrate
component
support portion
multiple support
mounting
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CN109600983B (zh
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末野茂
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Panasonic Intellectual Property Management Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • HELECTRICITY
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069Holders for printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • HELECTRICITY
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    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/0882Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13454Drivers integrated on the active matrix substrate
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27Manufacturing methods
    • H01L2224/274Manufacturing methods by blanket deposition of the material of the layer connector
    • H01L2224/2743Manufacturing methods by blanket deposition of the material of the layer connector in solid form
    • H01L2224/27436Lamination of a preform, e.g. foil, sheet or layer
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    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/2919Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
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    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525Means for applying energy, e.g. heating means
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    • H01L2224/757Means for aligning
    • H01L2224/75743Suction holding means
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    • H01L2224/83201Compression bonding
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    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/00Metal working
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Abstract

本发明提供一种部件安装装置以及安装基板的制造方法。部件安装装置将搭载于基板的多个部件压接于所述基板,所述部件安装装置具备:基板保持部,保持所述基板,使保持的所述基板升降;多个支撑部,设置有从所述基板的下方支承搭载于所保持的所述基板的所述多个部件的至少一个并吸附所述基板的下表面的吸附口;吸引部,与所述吸附口连接,对被载置于所述多个支撑部上的所述基板进行真空吸引;和至少一个压接头,将搭载于所吸附的所述基板的所述多个部件压接于所述基板。

Description

部件安装装置以及安装基板的制造方法
技术领域
本公开涉及对搭载于基板的部件进行压接来制造安装基板的部件安装装置以及安装基板的制造方法。
背景技术
制造液晶面板基板等的安装基板的部件安装装置针对将部件重叠搭载于作为被贴付的粘合部件的带状的ACF(Anisotropic Conductive Film,各向异性导电膜)上的基板,通过压接头来从部件的上方施加压力从而将部件压接于基板(例如,参照JP特开2006-24797号公报)。JP特开2006-24797号公报中所述的部件安装装置为了矫正如大型的液晶面板等那样容易弯曲的基板的弯曲来压接部件,除了从下方支承被从上方加压的部件的支撑工作台,吸引基板的下表面来矫正基板的弯曲的弯曲矫正单元还与支撑工作台并排设置。
发明内容
本公开的部件安装装置将搭载于基板的多个部件压接于所述基板,所述部件安装装置具备:基板保持部,保持所述基板,使保持的所述基板升降;多个支撑部,设置有从所述基板的下方支承搭载于所保持的所述基板的所述多个部件的至少一个并吸附所述基板的下表面的吸附口;吸引部,与所述吸附口连接,对被载置于所述多个支撑部上的所述基板进行真空吸引;和至少一个压接头,将搭载于被吸附的所述基板的所述多个部件压接于所述基板。
本公开的安装基板的制造方法包含:基板保持工序,使用基板保持部来保持基板;基板下降工序,使所保持的所述基板下降,在从所述基板的下方支承搭载于所述基板的多个部件的至少一个的多个支撑部载置所述基板;基板吸附工序,从设置于所述多个支撑部的吸附口真空吸引来吸附所述基板的下表面;和部件压接工序,使用至少一个压接头,将被搭载于所吸附的所述基板的所述多个部件压接于所述基板。
通过本公开,即使是薄型面板也能够适当地将部件压接于基板。
附图说明
图1是本公开的一实施方式中的部件安装装置的立体图。
图2是本公开的一实施方式中的部件安装装置的立体图。
图3A是本公开的一实施方式中的部件安装装置的一部分的俯视图。
图3B是本公开的一实施方式中的部件安装装置的一部分的侧面图。
图4是表示本公开的一实施方式中的部件安装装置的控制系统的框图。
图5是对本公开的一实施方式中的部件安装装置的吸附高度进行设定的吸附高度设定窗口的说明图。
图6是表示基于本公开的一实施方式中的部件安装装置的安装基板的制造方法的流程的图。
具体实施方式
在包含JP特开2006-24797号公报的现有技术中,在基板的厚度较薄且容易产生褶皱、弯曲等变形的薄型面板中,存在弯曲的矫正不充分、为了将部件适当地压接于基板需要进一步的改善的课题。
因此,本公开的目的在于,提供一种即使是薄型面板也能够将部件适当地压接于基板的部件安装装置以及安装基板的制造方法。
以下,参照附图来对本公开的一实施方式进行说明。图1、图2、图3A以及图3B表示本实施方式中的部件安装装置1。部件安装装置1是将搭载于包含薄片状的部件的基板2(例如薄型面板、柔性基板)等的部件3进行压接并安装于基板2的装置。在以下的说明中,将从作业者OP来看的左右方向设为X轴方向。此外,将从作业者OP来看的前后方向设为Y轴方向,将上下方向设为Z轴方向。
图1中,在基板2的上表面的端部设置电极2a。在前工序中,在电极2a贴付ACF等的热固化性树脂带T。在热固化性树脂带T上,在使基板2的电极2a与形成于部件3的下表面的部件端子(省略图示)的位置一致的状态下搭载部件3。在图1的例子中,三个部件3被搭载于基板2。
部件安装装置1在基台11上具备基板保持移动部12、压接部13以及压接支承部14。基板保持移动部12被设置于基台11的前部(从作业者OP来看的近前侧),压接部13以及压接支承部14被设置于基台11的后部(从作业者OP来看的里侧)。
图1中,基板保持移动部12从下方起依次将以下部件重叠而具备:设置于基台11的工作台移动机构21、工作台升降部22(参照图3B)、基板保持工作台23。工作台移动机构21使工作台升降部22在X轴方向以及Y轴方向(即水平面内方向)移动。工作台升降部22使基板保持工作台23在Z轴方向升降。
基板保持工作台23在其上表面支承从部件安装装置1的外部提供的基板2的下表面的中央的区域。在基板保持工作台23的上表面,在支承基板2的下表面的区域,形成吸附基板2并进行保持的多个基板吸引口23a。这样,基板保持移动部12是保持基板2并使保持的基板2在水平面内方向移动并升降的基板保持单元。即,基板保持移动部12是基板保持部的一个例子。
图1中,压接部13具备:基底部31、和被安装于基底部31并且X轴方向的位置自由调整的多个压接单元32(在本例中为三个)。在基底部31设置在X轴方向伸长的一对引导部31a。在引导部31a,以垂直姿势设置的矩形平板状的多个安装部件33被在X轴方向自由调整地安装。
压接单元32具备加压机构34和压接头35。加压机构34被安装于安装部件33。加压机构34具有在上下伸缩自在的杆34a。在杆34a的下端部,安装压接头35。多个压接头35在压接支承部14的上方在X轴方向排列为一列而被配置。作业者OP通过使压接单元32调整到所希望的位置,从而结合搭载于基板2的部件3的位置来变更压接头35。
压接头35内置有加热器(省略图示),在部件3的压接前通过加热器而被加热到规定温度。压接头35通过加压机构34的驱动而下降,对搭载于基板2的部件3进行加热并且压接。此时,热固化性树脂带T通过从压接头35传来的热量从而促进固化。在基底部31,与压接的部件3的数量对应地安装有多个压接单元32。此外,部件安装装置1中,准备尺寸不同的压接头35,与压接的部件3的形状对应的压接头35被安装于杆34a。
图1中,压接支承部14具备:固定部41、安装于固定部41并且X轴方向的位置自在调整的多个支撑部42(在本例中为三个)。作业者OP结合搭载于基板2的部件3的位置来变更支撑部42的X轴方向的位置,通过固定部41来使支撑部42的位置固定。即,部件安装装置1能够根据搭载于基板2的多个部件3的位置,来变更多个支撑部42的设置位置。
图2、图3A以及图3B表示通过基板保持移动部12,将基板保持工作台23所保持的基板2的水平面内方向对位后,使基板2下降来使支撑部42支承的状态。
图3A以及图3B中,在支撑部42的上表面,多个吸附口42a在规定的位置开口。支撑部42的后部侧的侧面,连接口42b开口。在支撑部42的内部,形成从多个吸附口42a到连接口42b贯通的连通空间42c。设置于固定部41的多个支撑部42的连接口42b通过连结管43来并联连接并与真空阀44的一端连接。真空阀44的另一端经由连接管45来与真空泵46连接。在连接管45,连接对连接管45的内部的真空度进行测量的真空传感器47。
若在使真空泵46工作的状态下打开真空阀44,则从真空泵46到支撑部42的各个吸附口42a连通并被从吸附口42a真空吸引。若在将基板保持工作台23所保持的基板2与压接作业位置对位并使支撑部42支承基板2的下表面的状态下,使真空泵46工作并打开真空阀44,则基板2被吸附口42a真空吸引。即,真空泵46是与吸附口42a连接,对载置于多个支撑部42上的基板2进行真空吸引的吸引单元。换句话说,真空泵46是吸引部的一个例子。
若这样基板2被真空吸附,全部支撑部42的全部吸附口42a塞住基板2的下表面,则连接管45的真空度降低。另一方面,在基板2的高度位置较高且基板2的下表面与支撑部42的上表面之间存在缝隙、或者基板2翘曲并且一部分的吸附口42a与基板2的下表面之间存在缝隙的情况下,空气从打开的吸附口42a流入,连接管45的真空度不下降。因此,通过利用真空传感器47来测量连接管45的真空度,能够检测基板2被正常吸附于文撑部42。
即,真空传感器47是对基板2被吸附于支撑部42进行检测的吸附传感器。换句话说,真空传感器47对吸附口42a吸附基板2的下表面进行检测。另外,真空传感器47也可以按照每个支撑部42而设置。这样,能够选定在哪个支撑部42产生了吸附不良。此外,作为吸附传感器,也可以使用对支撑部42的上表面与基板2的下表面之间的间隔进行测量的缝隙测量单元。
图3B中,将被保持于基板保持工作台23的基板2所被正常吸附于支撑部42的高度位置称为从部件安装装置1中设定的基准高度H0来看的吸附高度Hs。将搭载于基板2的部件3与基板2压接时,在关闭真空阀44的状态下将基板保持工作台23所保持的基板2的水平面内方向对位后,使其下降到吸附高度Hs并使支撑部42支承。接下来,打开真空阀44,使支撑部42真空吸附基板2。
图3A中,从上方俯视,吸附口42a被设置于与隔着基板2而被多个支撑部42支承的多个部件3的至少一个不重叠的位置。由此,在通过压接头35来进行压接时,能够对部件3均匀地施加热量和压力,能够可靠地压接部件3。另外,也可以通过一个支撑部42来支承多个部件3。在该情况下,吸附口42a被设定于与多个部件3不重叠的位置。此外,也可以通过一个压接头35,压接多个支撑部42所支承的部件3。
这样,在与多个部件3的位置对应设置的多个支撑部42,设置从基板2的下方支承所保持的基板2上搭载的多个部件3的至少一个并吸附基板2的下表面的吸附口42a。与多个部件3的位置对应设置的多个压接头35将搭载于被吸附的基板2的多个部件3与基板2压接。即,部件安装装置1与支撑部42对应地具备多个压接头35。换句话说,多个压接头35分别对应于多个支撑部42。
图4中,部件安装装置1所具备的控制装置50具有部件安装控制部51、吸附高度设定部52、存储部53。存储部53是存储装置,存储吸附高度Hs等。部件安装控制部51进行基于工作台移动机构21的工作台升降部22向(即基板保持工作台23的)水平面内方向的移动、基于工作台升降部22的基板保持工作台23向Z轴方向的移动、基于加压机构34的杆34a的出没动作(即压接头35的升降动作)的各控制。
此外,部件安装控制部51进行真空阀44的开闭动作、真空泵46的工作、基于真空传感器47的真空度的测量的各控制。在控制装置50连接触摸面板等的输入输出装置54,作业者OP能够通过输入输出装置54来向部件安装装置1进行所要的输入。此外,作业者OP能够通过输入输出装置54来得到与部件安装装置1有关的各种信息。
图4中,吸附高度设定部52对工作台升降部22、真空阀44、真空泵46、真空传感器47进行控制,来执行安装高度Hs的设定作业。此外,吸附高度设定部52在安装高度Hs的设定时使输入输出装置54显示吸附高度设定窗口,辅助基于作业者OP的安装高度Hs的设定作业。
这里,参照图5,对显示于输入输出装置54的吸附高度设定窗口61的例子进行说明。在吸附高度设定窗口61,显示“吸附高度”显示框62、“上升”按钮63a、“下降”按钮63b、“真空度”显示框64、“吸附高度确定”按钮65。在“吸附高度”显示框62,显示当前的基板2的高度(吸附高度Hs)。若“上升”按钮63a被操作,则工作台升降部22使基板2上升规定量。若“下降”按钮63b被操作,则工作台升降部22使基板2下降规定量。
在“真空度”显示框64,显示真空传感器47所测量的当前的真空度。另外,在“真空度”显示框64,可知显示真空传感器47所测量的实测值,也可以仅显示比规定的真空度高还是低的结果。图5中,真空传感器47的测量结果比规定的真空度高,显示为“超过”。若“吸附高度确定”按钮65被操作,则当前的吸附高度Hs被存储于存储部53。
接下来,参照图5,对使用了显示于输入输出装置54的吸附高度设定窗口61的吸附高度Hs的设定作业的顺序进行说明。在执行吸附高度Hs的设定作业时,将支撑部42设定于规定的位置后,使基板2保持于基板保持工作台23并在水平面内方向进行对位。此外,吸附高度设定部52使真空泵46工作,打开真空阀44。
在吸附高度Hs的设定作业中,作业者OP操作“下降”按钮63b,基板2被完全吸附于支撑部42并使基板2下降直到“真空度”显示框64的显示比规定的真空度低。若基板2被吸附于支撑部42,则作业者OP在操作“上升”按钮63a和“下降”按钮63b来对高度进行微调后,操作“吸附高度确定”按钮65来确定吸附高度Hs。由此,所设定的吸附高度Hs被存储于存储部53。
接下来,沿着图6的流程,对将搭载于基板2的多个部件3压接于基板2的安装基板的制造方法进行说明。首先,作业者OP将支撑部42设置于与搭载于基板2的部件3对应的位置(ST1:支撑部设置工序)。接下来,作业者OP将压接头35设置于与支撑部42对应的位置(ST2:压接头设置工序)。
接下来,吸附高度设定部52使输入输出装置54显示吸附高度设定窗口61。作业者OP操作吸附高度设定窗口61并且确定吸附高度Hs。由此,在存储部53中存储吸附高度Hs。即,通过吸附口42a来真空吸引并且使保持于基板保持移动部12(基板保持单元)的基板2下降,测量并登记基板2被吸附于支撑部42的吸附高度Hs(ST3:吸附高度登记工序)。由此,针对基板2的压接作业的准备结束。
图6中,接下来,作业者OP使基板2保持于基板保持移动部12(基板保持单元)的基板保持工作台23(ST4:基板保持工序)。接下来,部件安装控制部51使基板保持工作台23移动来将保持的基板2的水平面内方向对位(ST5:基板保持工作台移动工序)。接下来,部件安装控制部51使基板保持工作台23所保持的基板2下降到吸附高度Hs,使基板2载置于从基板2的下方支承搭载于基板2的多个部件3的至少一个的多个支撑部42(ST6:基板下降工序)。
接下来,部件安装控制部51在使真空泵46工作的状态下打开真空阀44,从设置于支撑部42的吸附口42a真空吸引并开始吸附基板2的下表面的基板吸附(ST7:吸附开始工序)。接下来,部件安装控制部51根据真空传感器47的测量结果来判定基板2的下表面是否被吸附于支撑部42(ST8:吸附判定工序)。在基板2被吸附的情况下(ST8中为是),部件安装控制部51使压接头35下降,通过压接头35来将在吸附于支撑部42的基板2上搭载的部件3压接于基板2(ST9:部件压接工序)。
图6中,若压接结束,则部件安装控制部51关闭真空阀44并使基于支撑部42的基板2的吸附结束(ST10:吸附结束工序)。接下来,部件安装控制部51使基板2上升到不干扰支撑部42的高度,使其移动到将基板2运出的位置(即,保持基板2的位置),作业者OP将基板2取出(ST11:基板运出工序)。由此,基于部件安装装置1的一系列的部件压接作业结束,返回到基板保持工序(ST4),使基板保持工作台23保持下一个作业对象的基板2。
在吸附判定工序(ST8)中基板2的下表面未被吸附的情况下(ST8中为否),部件安装控制部51使其基板2跳过部件压接工序(ST9),执行吸附结束工序(ST10)和基板运出工序(ST11)。即,在不将部件3压接的情况下从部件安装装置1取出。由此,即使在由于基板2的弯曲等导致基板2不能正常地吸附于支撑部42的情况下也执行部件压接作业,能够避免产生压接不良。
如上述那样,从吸附开始工序(ST7)到吸附结束工序(ST10)是从设置于支撑部42的吸附口42a真空吸引并吸附基板2的下表面的基板吸附工序。然后,在基板吸附工序中判定基板2的下表面是否被吸附(ST8),在基板2的下表面未被吸附的情况下(ST8中为否),该基板2跳过部件压接工序(ST9)。
如上述说明那样,本实施方式的部件安装装置1具备:基板保持单元(基板保持移动部12),保持基板2并使保持的基板2升降;多个支撑部42,设置有吸附口42a,从基板2的下方支承搭载于被保持的基板2的多个部件3的至少一个并吸附基板2的下表面;吸引单元(真空泵46),与吸附口42a连接并对载置于多个支撑部42上的基板2进行真空吸引;和压接头35,将搭载于被吸附的基板2的多个部件3压接于基板2,将搭载于基板2的多个部件3压接于基板2。由此,即使是薄型面板也能够适当地将部件3压接于基板2。
另外,部件安装装置1并不限定于具有对搭载于基板2的部件3进行压接的功能的独立的装置。例如,也可以如如下结构:在一体地具备在基板2上贴付热固化性树脂带T的带贴付部、在基板2搭载部件3的部件搭载部、将基板2在各部间移送的基板移送机构的装置的内部,设置具备上述说明的基板保持单元、支撑部42、吸引单元以及压接头35的部件压接部(部件安装装置1)。
本公开的部件安装装置以及安装基板的制造方法具有即使是薄型面板也能够适当地将部件压接于基板的效果,在将部件安装于基板的领域有用。

Claims (11)

1.一种部件安装装置,将搭载于基板的多个部件压接于所述基板,所述部件安装装置具备:
基板保持部,保持所述基板,使保持的所述基板升降;
多个支撑部,从所述基板的下方支承搭载于所保持的所述基板的所述多个部件的至少一个,并设置有吸附所述基板的下表面的吸附口;
吸引部,与所述吸附口连接,对被载置于所述多个支撑部上的所述基板进行真空吸引;和
至少一个压接头,将搭载于被吸附的所述基板的所述多个部件压接于所述基板。
2.根据权利要求1所述的部件安装装置,其中,
所述吸附口被设置于与被所述多个支撑部支承的所述多个部件的至少一个不重叠的位置。
3.根据权利要求1所述的部件安装装置,其中,
能够根据搭载于所述基板的所述多个部件的位置,变更所述多个支撑部的设置位置。
4.根据权利要求1所述的部件安装装置,其中,
所述部件安装装置还具备:吸附传感器,对所述吸附口吸附了所述基板的下表面进行检测。
5.根据权利要求1所述的部件安装装置,其中,
所述至少一个压接头包含多个压接头,
所述多个压接头分别对应于所述多个支撑部。
6.一种安装基板的制造方法,包含:
基板保持工序,使用基板保持部来保持基板;
基板下降工序,使所保持的所述基板下降,在从所述基板的下方支承搭载于所述基板的多个部件的至少一个部件的多个支撑部载置所述基板;
基板吸附工序,从设置于所述多个支撑部的吸附口进行真空吸引来吸附所述基板的下表面;和
部件压接工序,使用至少一个压接头,将被搭载于所吸附的所述基板的所述多个部件压接于所述基板。
7.根据权利要求6所述的部件安装方法,其中,
所述吸附口被设置于与被所述多个支撑部支承的所述多个部件的至少一个不重叠的位置。
8.根据权利要求6所述的部件安装方法,其中,
所述多个支撑部的设置位置能够变更,
在所述基板保持工序之前,还包含:支撑部设置工序,将所述多个支撑部设置于与搭载于所述基板的所述多个部件对应的位置。
9.根据权利要求6所述的部件安装方法,其中,
所述至少一个压接头包含设置位置能够变更的多个压接头,
在所述基板保持工序之前,还包含:压接头设置工序,在与所述多个支撑部对应的位置设置所述多个压接头。
10.根据权利要求6所述的部件安装方法,其中,
所述部件安装方法还包含:吸附高度登记工序,从所述吸附口进行真空吸引并且使保持于所述基板保持部的基板下降,测量并登记所述基板被吸附于所述多个支撑部的吸附高度,
在所述基板下降工序中,使保持于所述基板保持部的基板下降到所述吸附高度。
11.根据权利要求10所述的部件安装方法,其中,
在所述基板吸附工序中,判定所述基板的下表面是否被吸附,
在所述基板的下表面未被吸附的情况下,跳过所述部件压接工序。
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