CN1089490C - 密封半导体的树脂料片 - Google Patents

密封半导体的树脂料片 Download PDF

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Publication number
CN1089490C
CN1089490C CN94104325A CN94104325A CN1089490C CN 1089490 C CN1089490 C CN 1089490C CN 94104325 A CN94104325 A CN 94104325A CN 94104325 A CN94104325 A CN 94104325A CN 1089490 C CN1089490 C CN 1089490C
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CN
China
Prior art keywords
tablet
resin
content
web
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94104325A
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English (en)
Chinese (zh)
Other versions
CN1107612A (zh
Inventor
樽野友浩
丰田良雄
大野博文
木村祥一
韩尾浩幸
金井真一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN1107612A publication Critical patent/CN1107612A/zh
Application granted granted Critical
Publication of CN1089490C publication Critical patent/CN1089490C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/06—Making preforms by moulding the material
    • B29B11/12—Compression moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B29B13/02—Conditioning or physical treatment of the material to be shaped by heating
    • B29B13/022—Melting the material to be shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/8305—Miscellaneous [e.g., treated surfaces, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN94104325A 1994-02-23 1994-03-15 密封半导体的树脂料片 Expired - Fee Related CN1089490C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP51307/94 1994-02-23
JP5130794A JP3037552B2 (ja) 1994-02-23 1994-02-23 半導体封止用樹脂タブレット及び半導体封止装置とその製造方法

Publications (2)

Publication Number Publication Date
CN1107612A CN1107612A (zh) 1995-08-30
CN1089490C true CN1089490C (zh) 2002-08-21

Family

ID=12883270

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94104325A Expired - Fee Related CN1089490C (zh) 1994-02-23 1994-03-15 密封半导体的树脂料片

Country Status (8)

Country Link
US (1) US5698152A (enExample)
EP (1) EP0669649B1 (enExample)
JP (1) JP3037552B2 (enExample)
KR (1) KR100287491B1 (enExample)
CN (1) CN1089490C (enExample)
DE (1) DE69428676T2 (enExample)
SG (1) SG47837A1 (enExample)
TW (1) TW259798B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
JP4295869B2 (ja) * 1999-09-14 2009-07-15 日東電工株式会社 半導体封止用エポキシ樹脂組成物の製法
US20030141609A1 (en) * 2000-01-13 2003-07-31 Jia Yim Sook Method for momentarily heating the surface of a mold and system thereof
KR100611548B1 (ko) * 2000-03-29 2006-08-10 닛토덴코 가부시키가이샤 반도체 장치, 그 제조 공정 및 에폭시 수지 조성물을포함하는 태블릿
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
WO2004009319A1 (en) * 2002-07-19 2004-01-29 Smi Incorporated Method and apparatus for making miniature tablets
US20040023025A1 (en) * 2002-07-30 2004-02-05 Christophe Magnin Water redispersible adhesives and binders and tablets thereof
JP4569296B2 (ja) * 2004-12-28 2010-10-27 住友ベークライト株式会社 半導体封止用樹脂タブレットの製造方法および樹脂成形体の製造方法
US7536233B1 (en) * 2006-01-30 2009-05-19 Advanced Micro Devices, Inc. Method and apparatus for adjusting processing speeds based on work-in-process levels
JP5086945B2 (ja) * 2008-09-05 2012-11-28 株式会社東芝 半導体装置の製造方法
TWI416674B (zh) * 2008-11-05 2013-11-21 日月光半導體製造股份有限公司 封膠模具與封膠方法
JP5586313B2 (ja) * 2010-04-23 2014-09-10 京セラケミカル株式会社 接着剤層の形成方法、及び接着剤組成物
JP6092651B2 (ja) * 2013-02-19 2017-03-08 株式会社日中製作所 カーテンランナーのユニットベース及び先導カーテンランナー
JP2015000490A (ja) * 2013-06-13 2015-01-05 株式会社カネカ 生産性を向上させる半導体パッケージの製造方法
US10344160B1 (en) * 2015-08-10 2019-07-09 The United States Of America As Represented By The Secretary Of The Navy Super-hydrophobic epoxy resin compositions
KR101922295B1 (ko) * 2016-06-17 2018-11-26 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
JP6989044B1 (ja) * 2021-03-31 2022-01-05 住友ベークライト株式会社 封止構造体の製造方法およびタブレット

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0530377A1 (en) * 1991-03-20 1993-03-10 Nitto Denko Corporation Semiconductor sealing resin tablet and its manufacture

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293519A (en) * 1978-03-27 1981-10-06 Motorola Inc. Method for potting and encapsulating electronic circuits
JPS597008A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
JP2592753B2 (ja) * 1992-09-18 1997-03-19 日東電工株式会社 半導体封止用樹脂タブレット

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0530377A1 (en) * 1991-03-20 1993-03-10 Nitto Denko Corporation Semiconductor sealing resin tablet and its manufacture

Also Published As

Publication number Publication date
SG47837A1 (en) 1998-04-17
DE69428676D1 (de) 2001-11-22
KR100287491B1 (ko) 2001-04-16
KR950025964A (ko) 1995-09-18
EP0669649A1 (en) 1995-08-30
JP3037552B2 (ja) 2000-04-24
EP0669649B1 (en) 2001-10-17
TW259798B (enExample) 1995-10-11
JPH07232323A (ja) 1995-09-05
US5698152A (en) 1997-12-16
DE69428676T2 (de) 2002-05-08
CN1107612A (zh) 1995-08-30

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Granted publication date: 20020821

Termination date: 20100315