TW259798B - - Google Patents
Info
- Publication number
- TW259798B TW259798B TW83102836A TW83102836A TW259798B TW 259798 B TW259798 B TW 259798B TW 83102836 A TW83102836 A TW 83102836A TW 83102836 A TW83102836 A TW 83102836A TW 259798 B TW259798 B TW 259798B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/06—Making preforms by moulding the material
- B29B11/12—Compression moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/02—Conditioning or physical treatment of the material to be shaped by heating
- B29B13/022—Melting the material to be shaped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/8305—Miscellaneous [e.g., treated surfaces, etc.]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5130794A JP3037552B2 (ja) | 1994-02-23 | 1994-02-23 | 半導体封止用樹脂タブレット及び半導体封止装置とその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW259798B true TW259798B (zh) | 1995-10-11 |
Family
ID=12883270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW83102836A TW259798B (zh) | 1994-02-23 | 1994-03-31 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5698152A (zh) |
| EP (1) | EP0669649B1 (zh) |
| JP (1) | JP3037552B2 (zh) |
| KR (1) | KR100287491B1 (zh) |
| CN (1) | CN1089490C (zh) |
| DE (1) | DE69428676T2 (zh) |
| SG (1) | SG47837A1 (zh) |
| TW (1) | TW259798B (zh) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001672A (en) | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
| US5925384A (en) * | 1997-04-25 | 1999-07-20 | Micron Technology, Inc. | Manual pellet loader for Boschman automolds |
| JP4295869B2 (ja) * | 1999-09-14 | 2009-07-15 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物の製法 |
| US20030141609A1 (en) * | 2000-01-13 | 2003-07-31 | Jia Yim Sook | Method for momentarily heating the surface of a mold and system thereof |
| KR100611548B1 (ko) * | 2000-03-29 | 2006-08-10 | 닛토덴코 가부시키가이샤 | 반도체 장치, 그 제조 공정 및 에폭시 수지 조성물을포함하는 태블릿 |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
| IL166360A0 (en) * | 2002-07-19 | 2006-01-16 | Smi Inc | Method and apparatus for making miniature tablets |
| US20040023025A1 (en) * | 2002-07-30 | 2004-02-05 | Christophe Magnin | Water redispersible adhesives and binders and tablets thereof |
| JP4569296B2 (ja) * | 2004-12-28 | 2010-10-27 | 住友ベークライト株式会社 | 半導体封止用樹脂タブレットの製造方法および樹脂成形体の製造方法 |
| US7536233B1 (en) * | 2006-01-30 | 2009-05-19 | Advanced Micro Devices, Inc. | Method and apparatus for adjusting processing speeds based on work-in-process levels |
| JP5086945B2 (ja) * | 2008-09-05 | 2012-11-28 | 株式会社東芝 | 半導体装置の製造方法 |
| TWI416674B (zh) * | 2008-11-05 | 2013-11-21 | Advanced Semiconductor Eng | 封膠模具與封膠方法 |
| JP5586313B2 (ja) * | 2010-04-23 | 2014-09-10 | 京セラケミカル株式会社 | 接着剤層の形成方法、及び接着剤組成物 |
| JP6092651B2 (ja) * | 2013-02-19 | 2017-03-08 | 株式会社日中製作所 | カーテンランナーのユニットベース及び先導カーテンランナー |
| JP2015000490A (ja) * | 2013-06-13 | 2015-01-05 | 株式会社カネカ | 生産性を向上させる半導体パッケージの製造方法 |
| US10344160B1 (en) * | 2015-08-10 | 2019-07-09 | The United States Of America As Represented By The Secretary Of The Navy | Super-hydrophobic epoxy resin compositions |
| KR101922295B1 (ko) * | 2016-06-17 | 2018-11-26 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4293519A (en) * | 1978-03-27 | 1981-10-06 | Motorola Inc. | Method for potting and encapsulating electronic circuits |
| JPS597008A (ja) * | 1982-07-03 | 1984-01-14 | Toshiba Corp | 高密度タブレツトおよびそれを使用した半導体樹脂封止方法 |
| MY109641A (en) * | 1991-03-20 | 1997-03-31 | Nitto Denko Corp | Resin tablet for semiconductor sealing,process for producing the same, and process for producing semiconductor devices using the same |
| JP2592753B2 (ja) * | 1992-09-18 | 1997-03-19 | 日東電工株式会社 | 半導体封止用樹脂タブレット |
-
1994
- 1994-02-23 JP JP5130794A patent/JP3037552B2/ja not_active Expired - Lifetime
- 1994-03-14 KR KR1019940004978A patent/KR100287491B1/ko not_active IP Right Cessation
- 1994-03-15 DE DE1994628676 patent/DE69428676T2/de not_active Expired - Fee Related
- 1994-03-15 CN CN94104325A patent/CN1089490C/zh not_active Expired - Fee Related
- 1994-03-15 EP EP19940104016 patent/EP0669649B1/en not_active Expired - Lifetime
- 1994-03-15 SG SG1996004625A patent/SG47837A1/en unknown
- 1994-03-31 TW TW83102836A patent/TW259798B/zh active
-
1996
- 1996-10-25 US US08/736,782 patent/US5698152A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0669649A1 (en) | 1995-08-30 |
| CN1107612A (zh) | 1995-08-30 |
| CN1089490C (zh) | 2002-08-21 |
| JP3037552B2 (ja) | 2000-04-24 |
| JPH07232323A (ja) | 1995-09-05 |
| DE69428676T2 (de) | 2002-05-08 |
| SG47837A1 (en) | 1998-04-17 |
| KR950025964A (ko) | 1995-09-18 |
| US5698152A (en) | 1997-12-16 |
| EP0669649B1 (en) | 2001-10-17 |
| DE69428676D1 (de) | 2001-11-22 |
| KR100287491B1 (ko) | 2001-04-16 |