CN108369928B - 半导体用密封材料 - Google Patents

半导体用密封材料 Download PDF

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Publication number
CN108369928B
CN108369928B CN201680073780.XA CN201680073780A CN108369928B CN 108369928 B CN108369928 B CN 108369928B CN 201680073780 A CN201680073780 A CN 201680073780A CN 108369928 B CN108369928 B CN 108369928B
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CN
China
Prior art keywords
semiconductor
sealing material
resin
component
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680073780.XA
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English (en)
Chinese (zh)
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CN108369928A (zh
Inventor
二田完
佐藤和也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN108369928A publication Critical patent/CN108369928A/zh
Application granted granted Critical
Publication of CN108369928B publication Critical patent/CN108369928B/zh
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201680073780.XA 2015-12-25 2016-12-22 半导体用密封材料 Active CN108369928B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015254480A JP5978380B1 (ja) 2015-12-25 2015-12-25 半導体用封止材
JP2015-254480 2015-12-25
PCT/JP2016/088444 WO2017111057A1 (ja) 2015-12-25 2016-12-22 半導体用封止材

Publications (2)

Publication Number Publication Date
CN108369928A CN108369928A (zh) 2018-08-03
CN108369928B true CN108369928B (zh) 2022-01-18

Family

ID=56760075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680073780.XA Active CN108369928B (zh) 2015-12-25 2016-12-22 半导体用密封材料

Country Status (7)

Country Link
JP (1) JP5978380B1 (ko)
KR (1) KR102384582B1 (ko)
CN (1) CN108369928B (ko)
MY (1) MY196462A (ko)
PH (1) PH12018501308A1 (ko)
TW (1) TWI750145B (ko)
WO (1) WO2017111057A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7025879B2 (ja) * 2017-09-29 2022-02-25 リンテック株式会社 樹脂シート
TWI791716B (zh) 2017-12-18 2023-02-11 南韓商Ｌｇ化學股份有限公司 封裝組成物
JP2019196475A (ja) * 2018-05-11 2019-11-14 サムスン エレクトロニクス カンパニー リミテッド 低損失絶縁樹脂組成物、及びこれを用いた絶縁フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109543A (ja) * 1998-10-07 2000-04-18 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
WO2015037458A1 (ja) * 2013-09-12 2015-03-19 日東電工株式会社 半導体装置の製造方法
WO2015098842A1 (ja) * 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2558293B2 (ja) * 1987-09-14 1996-11-27 日東電工株式会社 半導体装置
JP3128291B2 (ja) * 1990-10-31 2001-01-29 株式会社東芝 マレイミド樹脂組成物およびこれを用いた樹脂封止型半導体装置
JP2000036552A (ja) * 1998-07-17 2000-02-02 Fujitsu Ltd 半導体装置、及び半導体装置で用いる封止材中の金属分の分取方法
US20060009547A1 (en) * 2002-09-05 2006-01-12 Hisashi Maeshima Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation
JP3998564B2 (ja) * 2002-11-13 2007-10-31 株式会社巴川製紙所 半導体封止用硬化性接着剤組成物および接着シート
JP6019550B2 (ja) 2011-08-09 2016-11-02 富士通株式会社 電子装置の製造方法
KR101393700B1 (ko) * 2012-11-29 2014-05-13 서울과학기술대학교 산학협력단 웨이퍼의 휨 발생 방지 기능을 강화시킨 팬 아웃 웨이퍼 레벨 패키징 공정
JP2015041663A (ja) * 2013-08-21 2015-03-02 日東電工株式会社 封止用シート、及び、半導体装置の製造方法
JP2015056458A (ja) * 2013-09-10 2015-03-23 株式会社東芝 半導体装置
JP6546378B2 (ja) * 2013-11-19 2019-07-17 日東電工株式会社 樹脂シート
JP2015126124A (ja) * 2013-12-26 2015-07-06 日東電工株式会社 半導体パッケージの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109543A (ja) * 1998-10-07 2000-04-18 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
WO2015037458A1 (ja) * 2013-09-12 2015-03-19 日東電工株式会社 半導体装置の製造方法
WO2015098842A1 (ja) * 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
KR20180098558A (ko) 2018-09-04
TWI750145B (zh) 2021-12-21
WO2017111057A1 (ja) 2017-06-29
MY196462A (en) 2023-04-12
CN108369928A (zh) 2018-08-03
TW201737429A (zh) 2017-10-16
JP2017118045A (ja) 2017-06-29
PH12018501308A1 (en) 2019-02-11
KR102384582B1 (ko) 2022-04-08
JP5978380B1 (ja) 2016-08-24

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Effective date of registration: 20230607

Address after: Saitama Prefecture, Japan

Patentee after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Patentee before: TAIYO INK MFG. Co.,Ltd.