MY196462A - Semiconductor Encapsulant - Google Patents

Semiconductor Encapsulant

Info

Publication number
MY196462A
MY196462A MYPI2018000991A MYPI2018000991A MY196462A MY 196462 A MY196462 A MY 196462A MY PI2018000991 A MYPI2018000991 A MY PI2018000991A MY PI2018000991 A MYPI2018000991 A MY PI2018000991A MY 196462 A MY196462 A MY 196462A
Authority
MY
Malaysia
Prior art keywords
semiconductor
semiconductor encapsulant
encapsulant
oxidizing
gap
Prior art date
Application number
MYPI2018000991A
Inventor
Yutaka Nita
Kazuya Sato
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of MY196462A publication Critical patent/MY196462A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A semiconductor encapsulant, which can suppress formation of a gap between a semiconductor chip and a semiconductor encapsulant, is provided. The semiconductor encapsulant of the invention is characterized by containing an oxidizing agent capable of oxidizing a semiconductor.
MYPI2018000991A 2015-12-25 2016-12-22 Semiconductor Encapsulant MY196462A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015254480A JP5978380B1 (en) 2015-12-25 2015-12-25 Sealant for semiconductor
PCT/JP2016/088444 WO2017111057A1 (en) 2015-12-25 2016-12-22 Sealant for semiconductor

Publications (1)

Publication Number Publication Date
MY196462A true MY196462A (en) 2023-04-12

Family

ID=56760075

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018000991A MY196462A (en) 2015-12-25 2016-12-22 Semiconductor Encapsulant

Country Status (7)

Country Link
JP (1) JP5978380B1 (en)
KR (1) KR102384582B1 (en)
CN (1) CN108369928B (en)
MY (1) MY196462A (en)
PH (1) PH12018501308A1 (en)
TW (1) TWI750145B (en)
WO (1) WO2017111057A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7025879B2 (en) * 2017-09-29 2022-02-25 リンテック株式会社 Resin sheet
US11479664B2 (en) 2017-12-18 2022-10-25 Lg Chem, Ltd. Encapsulating composition
JP2019196475A (en) * 2018-05-11 2019-11-14 サムスン エレクトロニクス カンパニー リミテッド Low-loss insulating resin composition and insulating film using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2558293B2 (en) * 1987-09-14 1996-11-27 日東電工株式会社 Semiconductor device
JP3128291B2 (en) * 1990-10-31 2001-01-29 株式会社東芝 Maleimide resin composition and resin-sealed semiconductor device using the same
JP2000036552A (en) * 1998-07-17 2000-02-02 Fujitsu Ltd Semiconductor device and separately taking out method of metal component in sealing material used therein
JP2000109543A (en) * 1998-10-07 2000-04-18 Hitachi Chem Co Ltd Epoxy resin composition for semiconductor sealing use and semiconductor device using the same
KR101005948B1 (en) * 2002-09-05 2011-01-05 다이셀 가가꾸 고교 가부시끼가이샤 Process for preparation of alicyclic diepoxy compounds, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation
JP3998564B2 (en) * 2002-11-13 2007-10-31 株式会社巴川製紙所 Curable adhesive composition for semiconductor encapsulation and adhesive sheet
JP6019550B2 (en) 2011-08-09 2016-11-02 富士通株式会社 Manufacturing method of electronic device
KR101393700B1 (en) * 2012-11-29 2014-05-13 서울과학기술대학교 산학협력단 Manufacturing of fan-out wafer level packaging fortified preventing warpage of wafer
JP2015041663A (en) * 2013-08-21 2015-03-02 日東電工株式会社 Sealing sheet, and method of manufacturing semiconductor device
JP2015056458A (en) * 2013-09-10 2015-03-23 株式会社東芝 Semiconductor device
JP2015056511A (en) * 2013-09-12 2015-03-23 日東電工株式会社 Semiconductor device manufacturing method
JP6546378B2 (en) * 2013-11-19 2019-07-17 日東電工株式会社 Resin sheet
WO2015098842A1 (en) * 2013-12-26 2015-07-02 日東電工株式会社 Method for manufacturing semiconductor device
JP2015126124A (en) * 2013-12-26 2015-07-06 日東電工株式会社 Semiconductor package manufacturing method

Also Published As

Publication number Publication date
TW201737429A (en) 2017-10-16
CN108369928B (en) 2022-01-18
JP2017118045A (en) 2017-06-29
KR102384582B1 (en) 2022-04-08
TWI750145B (en) 2021-12-21
WO2017111057A1 (en) 2017-06-29
PH12018501308A1 (en) 2019-02-11
JP5978380B1 (en) 2016-08-24
CN108369928A (en) 2018-08-03
KR20180098558A (en) 2018-09-04

Similar Documents

Publication Publication Date Title
SG10201801141TA (en) Selective deposition of silicon oxide
HUE046136T2 (en) Method for the production of 1,2-propane diol from propene and hydrogen peroxide
MX2018006148A (en) Inhibitors of cxcr2.
SG10201905158TA (en) Semiconductor package
MX2019011496A (en) Niraparib compositions.
MX2022000053A (en) Modulators of sestrin-gator2 interaction and uses thereof.
IL288075A (en) Mitigation of ransomware in integrated, isolated applications
SG10201905587SA (en) Semiconductor package
EP3130009A4 (en) Dc-dc converter having terminals of semiconductor chips
SG11201805242QA (en) Silicon Wafer with Homogeneous Radial Oxygen Variation
SG10201907662SA (en) Semiconductor package
EP3442038A4 (en) Semiconductor wafer
SG10201907297YA (en) Semiconductor Package
EP3304659A4 (en) Emitter semiconductor laser type of device
SG10201907599PA (en) Semiconductor package
SG10201906230PA (en) Semiconductor Package
PH12017500426A1 (en) Use of elsiglutide to treat gastrointestinal mucositis including chemotherapy-induced diarrhea
SG10201902032WA (en) Semiconductor Package
MY196462A (en) Semiconductor Encapsulant
MX2023009432A (en) Method of making a mercury based compound, mercury based compound, methods of using the mercury based compound and uses of the mercury based compound.
MX2019005557A (en) Oral Care Composition.
KR102153413B9 (en) Semiconductor package
MA39877A (en) Solid forms of a pharmaceutically active compound
PH12019501451A1 (en) Combination of a mcl-1 inhibitor and a taxane compound, uses and pharmaceuitcal compositions thereof
KR102240408B9 (en) Semiconductor package