CN108136731A - 叠层体基板、叠层体基板的制造方法、导电性基板、及导电性基板的制造方法 - Google Patents
叠层体基板、叠层体基板的制造方法、导电性基板、及导电性基板的制造方法 Download PDFInfo
- Publication number
- CN108136731A CN108136731A CN201680060141.XA CN201680060141A CN108136731A CN 108136731 A CN108136731 A CN 108136731A CN 201680060141 A CN201680060141 A CN 201680060141A CN 108136731 A CN108136731 A CN 108136731A
- Authority
- CN
- China
- Prior art keywords
- copper
- blackening layer
- layer
- lamination structure
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003475 lamination Methods 0.000 title claims abstract description 136
- 238000004519 manufacturing process Methods 0.000 title claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 237
- 239000010949 copper Substances 0.000 claims abstract description 234
- 229910052802 copper Inorganic materials 0.000 claims abstract description 234
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 132
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 47
- 239000001301 oxygen Substances 0.000 claims abstract description 47
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 41
- 125000004429 atom Chemical group 0.000 claims abstract description 19
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 85
- 208000003351 Melanosis Diseases 0.000 claims description 44
- 230000008569 process Effects 0.000 claims description 43
- 230000015572 biosynthetic process Effects 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000004544 sputter deposition Methods 0.000 description 48
- 238000005530 etching Methods 0.000 description 45
- 239000007789 gas Substances 0.000 description 33
- 238000002310 reflectometry Methods 0.000 description 25
- 239000000463 material Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 15
- 239000011261 inert gas Substances 0.000 description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- 230000008859 change Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229910002480 Cu-O Inorganic materials 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000007844 bleaching agent Substances 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- -1 patent document 2 Chemical compound 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 240000001439 Opuntia Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 1
- 229910002064 alloy oxide Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- LDSIKPHVUGHOOI-UHFFFAOYSA-N copper;oxonickel Chemical compound [Ni].[Cu]=O LDSIKPHVUGHOOI-UHFFFAOYSA-N 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229940032296 ferric chloride Drugs 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical compound [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-204642 | 2015-10-16 | ||
| JP2015204642A JP6601137B2 (ja) | 2015-10-16 | 2015-10-16 | 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法 |
| PCT/JP2016/080279 WO2017065184A1 (ja) | 2015-10-16 | 2016-10-12 | 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108136731A true CN108136731A (zh) | 2018-06-08 |
Family
ID=58518273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680060141.XA Pending CN108136731A (zh) | 2015-10-16 | 2016-10-12 | 叠层体基板、叠层体基板的制造方法、导电性基板、及导电性基板的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6601137B2 (ja) |
| KR (1) | KR102430694B1 (ja) |
| CN (1) | CN108136731A (ja) |
| TW (1) | TWI712506B (ja) |
| WO (1) | WO2017065184A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018221183A1 (ja) * | 2017-05-29 | 2020-03-26 | 住友金属鉱山株式会社 | 透明導電性基板の製造方法、透明導電性基板 |
| JP7266955B2 (ja) * | 2021-05-20 | 2023-05-01 | Ｎｉｓｓｈａ株式会社 | 導電シート、タッチセンサ及びタッチセンサの製造方法 |
| WO2024004405A1 (ja) * | 2022-07-01 | 2024-01-04 | 日東電工株式会社 | 導電性フィルム |
| WO2024004404A1 (ja) * | 2022-07-01 | 2024-01-04 | 日東電工株式会社 | 導電性フィルム |
Citations (8)
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| JP2005268688A (ja) * | 2004-03-22 | 2005-09-29 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法並びにこの電磁波シールド材を有するディスプレイ用前面フィルタ |
| JP2008300393A (ja) * | 2007-05-29 | 2008-12-11 | Dainippon Printing Co Ltd | ディスプレイ用電磁波遮蔽フィルタ、複合フィルタ、及びその製造方法 |
| JP2010010179A (ja) * | 2008-06-24 | 2010-01-14 | Toppan Printing Co Ltd | プラズマディスプレイ前面板用黒色化シールドメッシュおよびその製造方法 |
| CN101728358A (zh) * | 2008-10-17 | 2010-06-09 | 日立电线株式会社 | 配线结构及配线结构的制造方法 |
| CN103582304A (zh) * | 2012-07-30 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | 透明印刷电路板及其制作方法 |
| KR20140041080A (ko) * | 2012-09-27 | 2014-04-04 | 엘에스엠트론 주식회사 | 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법 |
| JP2015069440A (ja) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | タッチパネルセンサおよびタッチパネルモジュール |
| CN104749830A (zh) * | 2013-12-27 | 2015-07-01 | 介面光电股份有限公司 | 电极结构及带有该电极结构的触控面板装置 |
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| JP2001127485A (ja) * | 1999-10-25 | 2001-05-11 | Nisshinbo Ind Inc | 透視性電磁波シールド材及びその製造方法 |
| JP4086132B2 (ja) | 2001-11-16 | 2008-05-14 | 株式会社ブリヂストン | 透明導電性フィルムおよびタッチパネル |
| JP5361579B2 (ja) | 2009-07-09 | 2013-12-04 | 信越ポリマー株式会社 | 大型ディスプレイ用のセンサパネル及びその製造方法 |
| JP2013069261A (ja) | 2011-09-08 | 2013-04-18 | Dainippon Printing Co Ltd | タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置 |
| JP5885993B2 (ja) * | 2011-10-17 | 2016-03-16 | 関東化學株式会社 | エッチング液組成物およびエッチング方法 |
| US20140353140A1 (en) * | 2011-11-28 | 2014-12-04 | Nitto Denko Corporation | Method for manufacturing transparent electroconductive film |
| KR101580372B1 (ko) * | 2013-05-10 | 2015-12-28 | 삼성전기주식회사 | 터치센서 |
| JP2015103223A (ja) * | 2013-11-28 | 2015-06-04 | グンゼ株式会社 | 導電性基板、タッチパネル及び電磁波シールド |
-
2015
- 2015-10-16 JP JP2015204642A patent/JP6601137B2/ja active Active
-
2016
- 2016-10-12 WO PCT/JP2016/080279 patent/WO2017065184A1/ja active Application Filing
- 2016-10-12 KR KR1020187009122A patent/KR102430694B1/ko active IP Right Grant
- 2016-10-12 CN CN201680060141.XA patent/CN108136731A/zh active Pending
- 2016-10-13 TW TW105133020A patent/TWI712506B/zh active
Patent Citations (8)
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|---|---|---|---|---|
| JP2005268688A (ja) * | 2004-03-22 | 2005-09-29 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法並びにこの電磁波シールド材を有するディスプレイ用前面フィルタ |
| JP2008300393A (ja) * | 2007-05-29 | 2008-12-11 | Dainippon Printing Co Ltd | ディスプレイ用電磁波遮蔽フィルタ、複合フィルタ、及びその製造方法 |
| JP2010010179A (ja) * | 2008-06-24 | 2010-01-14 | Toppan Printing Co Ltd | プラズマディスプレイ前面板用黒色化シールドメッシュおよびその製造方法 |
| CN101728358A (zh) * | 2008-10-17 | 2010-06-09 | 日立电线株式会社 | 配线结构及配线结构的制造方法 |
| CN103582304A (zh) * | 2012-07-30 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | 透明印刷电路板及其制作方法 |
| KR20140041080A (ko) * | 2012-09-27 | 2014-04-04 | 엘에스엠트론 주식회사 | 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법 |
| JP2015069440A (ja) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | タッチパネルセンサおよびタッチパネルモジュール |
| CN104749830A (zh) * | 2013-12-27 | 2015-07-01 | 介面光电股份有限公司 | 电极结构及带有该电极结构的触控面板装置 |
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| Publication number | Publication date |
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| JP6601137B2 (ja) | 2019-11-06 |
| KR20180066057A (ko) | 2018-06-18 |
| WO2017065184A1 (ja) | 2017-04-20 |
| TW201728444A (zh) | 2017-08-16 |
| KR102430694B1 (ko) | 2022-08-08 |
| TWI712506B (zh) | 2020-12-11 |
| JP2017074749A (ja) | 2017-04-20 |
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