KR102430694B1 - 적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법 - Google Patents

적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법 Download PDF

Info

Publication number
KR102430694B1
KR102430694B1 KR1020187009122A KR20187009122A KR102430694B1 KR 102430694 B1 KR102430694 B1 KR 102430694B1 KR 1020187009122 A KR1020187009122 A KR 1020187009122A KR 20187009122 A KR20187009122 A KR 20187009122A KR 102430694 B1 KR102430694 B1 KR 102430694B1
Authority
KR
South Korea
Prior art keywords
layer
copper
blackening
substrate
blackening layer
Prior art date
Application number
KR1020187009122A
Other languages
English (en)
Korean (ko)
Other versions
KR20180066057A (ko
Inventor
히로토 와타나베
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20180066057A publication Critical patent/KR20180066057A/ko
Application granted granted Critical
Publication of KR102430694B1 publication Critical patent/KR102430694B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
KR1020187009122A 2015-10-16 2016-10-12 적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법 KR102430694B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015204642A JP6601137B2 (ja) 2015-10-16 2015-10-16 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法
JPJP-P-2015-204642 2015-10-16
PCT/JP2016/080279 WO2017065184A1 (ja) 2015-10-16 2016-10-12 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法

Publications (2)

Publication Number Publication Date
KR20180066057A KR20180066057A (ko) 2018-06-18
KR102430694B1 true KR102430694B1 (ko) 2022-08-08

Family

ID=58518273

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187009122A KR102430694B1 (ko) 2015-10-16 2016-10-12 적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법

Country Status (5)

Country Link
JP (1) JP6601137B2 (ja)
KR (1) KR102430694B1 (ja)
CN (1) CN108136731A (ja)
TW (1) TWI712506B (ja)
WO (1) WO2017065184A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018221183A1 (ja) * 2017-05-29 2020-03-26 住友金属鉱山株式会社 透明導電性基板の製造方法、透明導電性基板
JP7266955B2 (ja) * 2021-05-20 2023-05-01 Ｎｉｓｓｈａ株式会社 導電シート、タッチセンサ及びタッチセンサの製造方法
WO2024004405A1 (ja) * 2022-07-01 2024-01-04 日東電工株式会社 導電性フィルム
WO2024004404A1 (ja) * 2022-07-01 2024-01-04 日東電工株式会社 導電性フィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268688A (ja) * 2004-03-22 2005-09-29 Bridgestone Corp 光透過性電磁波シールド材及びその製造方法並びにこの電磁波シールド材を有するディスプレイ用前面フィルタ
JP2008300393A (ja) * 2007-05-29 2008-12-11 Dainippon Printing Co Ltd ディスプレイ用電磁波遮蔽フィルタ、複合フィルタ、及びその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127485A (ja) * 1999-10-25 2001-05-11 Nisshinbo Ind Inc 透視性電磁波シールド材及びその製造方法
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP5256880B2 (ja) * 2008-06-24 2013-08-07 凸版印刷株式会社 プラズマディスプレイ前面板用黒色化シールドメッシュおよびその製造方法
JP2010098196A (ja) * 2008-10-17 2010-04-30 Hitachi Cable Ltd 配線構造及び配線構造の製造方法
JP5361579B2 (ja) 2009-07-09 2013-12-04 信越ポリマー株式会社 大型ディスプレイ用のセンサパネル及びその製造方法
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
JP5885993B2 (ja) * 2011-10-17 2016-03-16 関東化學株式会社 エッチング液組成物およびエッチング方法
US20140353140A1 (en) * 2011-11-28 2014-12-04 Nitto Denko Corporation Method for manufacturing transparent electroconductive film
CN103582304B (zh) * 2012-07-30 2016-08-03 富葵精密组件(深圳)有限公司 透明印刷电路板及其制作方法
KR101421702B1 (ko) * 2012-09-27 2014-07-22 엘에스엠트론 주식회사 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법
KR101580372B1 (ko) * 2013-05-10 2015-12-28 삼성전기주식회사 터치센서
JP2015069440A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 タッチパネルセンサおよびタッチパネルモジュール
JP2015103223A (ja) * 2013-11-28 2015-06-04 グンゼ株式会社 導電性基板、タッチパネル及び電磁波シールド
CN104749830A (zh) * 2013-12-27 2015-07-01 介面光电股份有限公司 电极结构及带有该电极结构的触控面板装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268688A (ja) * 2004-03-22 2005-09-29 Bridgestone Corp 光透過性電磁波シールド材及びその製造方法並びにこの電磁波シールド材を有するディスプレイ用前面フィルタ
JP2008300393A (ja) * 2007-05-29 2008-12-11 Dainippon Printing Co Ltd ディスプレイ用電磁波遮蔽フィルタ、複合フィルタ、及びその製造方法

Also Published As

Publication number Publication date
JP6601137B2 (ja) 2019-11-06
KR20180066057A (ko) 2018-06-18
WO2017065184A1 (ja) 2017-04-20
CN108136731A (zh) 2018-06-08
TW201728444A (zh) 2017-08-16
TWI712506B (zh) 2020-12-11
JP2017074749A (ja) 2017-04-20

Similar Documents

Publication Publication Date Title
KR102390079B1 (ko) 도전성 기판
KR102430694B1 (ko) 적층체 기판, 적층체 기판 제조방법, 도전성 기판 및 도전성 기판 제조방법
JP6497391B2 (ja) タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法
KR102533946B1 (ko) 도전성 기판
KR102383919B1 (ko) 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법
JP6823363B2 (ja) 導電性基板、導電性基板の製造方法
JP6983068B2 (ja) 導電性基板
JPWO2016002679A1 (ja) 導電性基板、積層導電性基板、導電性基板の製造方法、積層導電性基板の製造方法
JP6107637B2 (ja) 導電性基板の製造方法
JP6455366B2 (ja) 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
KR102544424B1 (ko) 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법
KR102365980B1 (ko) 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법
JP6417964B2 (ja) 積層体基板、配線基板ならびにそれらの製造方法
JP2016108613A (ja) 導電性基板、導電性基板の製造方法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant