CN108074842A - Substrate wet treater - Google Patents
Substrate wet treater Download PDFInfo
- Publication number
- CN108074842A CN108074842A CN201711089961.4A CN201711089961A CN108074842A CN 108074842 A CN108074842 A CN 108074842A CN 201711089961 A CN201711089961 A CN 201711089961A CN 108074842 A CN108074842 A CN 108074842A
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- Prior art keywords
- substrate
- hydro
- peening
- impregnation
- slot
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Level Indicators Using A Float (AREA)
- Weting (AREA)
Abstract
The present invention discloses a kind of substrate wet treater, to carry out wet process program to substrate.The substrate wet treater includes：One impregnation slot, to carry out the impregnation program to substrate；One hydro-peening treatment trough, it includes a substrate and is inverted microscope carrier, substrate is positioned over substrate and is inverted microscope carrier, to carry out hydro-peening processing routine to substrate, one is cleaned and dried slot, to carry out cleaning-drying program and a processing procedure control unit to substrate, the impregnation slot, the hydro-peening treatment trough and the cleaning-drying slot are electrically connected, which controls the wet process program of the substrate in the substrate wet treater.The present invention, by the way that substrate is inverted in slot progress hydro-peening processing, compares conventional substrate non-inverted state in substrate hydro-peening processing routine during hydro-peening, it is easier to remover or overburden are removed, and the problems such as anti-non-return is stained with.
Description
Technical field
The present invention is on a kind of substrate wet treater, to carry out a wet process program, wet process program to a substrate
Program is cleaned and dried including an impregnation program, a hydro-peening processing routine and one, wherein carrying out hydro-peening processing journey in substrate
Sequence is by substrate in the substrate wet treater of inversion state.
Background technology
In semiconductor processing, multiple tracks cleaning procedure need to be carried out to substrate (such as wafer), to remove the impurity of substrate surface.
And after pattern is formed in substrate with lithography, it is also necessary to by multiple tracks cleaning procedure to remove photoresist (Photo
Resistor, PR) or metal film (Metal Film).A kind of traditional handicraft is with batch processing substrate, by substrate lot simultaneously
Processing, there is the problem for the treatment of effect is inaccurate.Though another traditional handicraft is handled using monobasal horizontal, however in cleaning
Step, when substrate just puts rotary-cleaning to adopt, substrate will with the remover or overburden of cleaning solution institute output in cleaning process
Contamination damage substrate can be returned.In view of Yi Shang traditional handicraft is inaccurate or the problems such as substrate is stained in the effect of processing procedure, existing skill
Art truly has improved necessity.
The content of the invention
The present invention is on a kind of substrate wet treater, to carry out a wet process program, wet process program to a substrate
Program is cleaned and dried including an impregnation program, a hydro-peening processing routine and one, wherein will in substrate hydro-peening processing routine
Substrate is in inversion state.
Such substrate wet treater, to carry out wet process program to substrate, wherein wet process program is included at dipping
It manages program, hydro-peening processing routine and is cleaned and dried program.Substrate wet treater include impregnation slot, hydro-peening treatment trough with
And slot is cleaned and dried, impregnation slot is to substrate progress impregnation program；Hydro-peening treatment trough, to be sprayed to substrate
Processing routine is washed, hydro-peening treatment trough includes substrate and is inverted microscope carrier, and wherein substrate is positioned over substrate and is inverted microscope carrier；It is cleaned and dried slot,
To carry out cleaning-drying program to substrate；And processing procedure control unit, it is electrically connected impregnation slot, hydro-peening treatment trough
And it is cleaned and dried slot, wet process program of the processing procedure control unit control base board in substrate wet treater.
Substrate wet treater of the present invention, in an embodiment, which can house multiple be somebody's turn to do
Substrate, wherein when the impregnation slot carries out the impregnation program, which controls the respectively base respectively
Plate inserts a dipping sequential of the impregnation slot.
Substrate wet treater of the present invention, in an embodiment, which controls respectively
Respectively the substrate passes in and out the sequential of the impregnation slot.
Substrate wet treater of the present invention, in an embodiment, which controls to each
The impregnation time of the substrate is identical, and respectively the substrate is respectively implanted the impregnation slot for scheduling, to carry out the dipping
Processing routine.
Substrate wet treater of the present invention, in an embodiment, which controls respectively
Time of the impregnation program is carried out to the respectively substrate as difference, and respectively the substrate inserts the impregnation slot for scheduling, with into
The row impregnation program.
Substrate wet treater of the present invention, in an embodiment, to the impregnation program institute of the substrate
It takes time the time required to being more than hydro-peening processing, the processing procedure control unit is according to impregnation program required time with being somebody's turn to do
A time difference the time required to hydro-peening processing routine, respectively the substrate inserts the dipping sequential of the impregnation slot for scheduling.
Substrate wet treater of the present invention, in an embodiment, the impregnation slot and the hydro-peening treatment trough
For same groove body, which is located at below the hydro-peening treatment trough, and wherein the processing procedure control unit will complete the leaching
The hydro-peening treatment trough is inserted in the substrate rising of stain processing routine.
Substrate wet treater of the present invention, in an embodiment, using a hydro-peening treatment fluid to the substrate into
Row hydro-peening processing, the hydro-peening treatment fluid recycle the impregnation slot fallen into below the hydro-peening treatment trough.
Substrate wet treater of the present invention, in an embodiment, which includes a recovery unit,
The hydro-peening processing is wherein carried out to the substrate using a hydro-peening treatment fluid, and passes through the recovery unit and recycles the hydro-peening treatment fluid,
The hydro-peening treatment fluid of wherein non-splash to the recovery unit will fall into the impregnation slot being located at below the hydro-peening treatment trough
It is recycled.
Substrate wet treater of the present invention, in an embodiment, which is positioned over the substrate and is inverted microscope carrier,
Wherein the substrate wet treater further includes a microscope carrier drive module, which is inverted microscope carrier decline and inserts the impregnation
Slot, to carry out the impregnation program to the substrate, and after the impregnation program is completed, microscope carrier drive module is by the substrate
It is inverted microscope carrier rising and inserts the hydro-peening treatment trough, the hydro-peening processing routine is carried out to the substrate.
Substrate wet treater of the present invention, in an embodiment, before which further includes a dipping
The substrate is inserted the substrate and is inverted microscope carrier to carry out before the dipping at hydro-peening by hydro-peening processing routine, the processing procedure control unit
After managing program, which is inverted microscope carrier decline by the substrate and inserts the impregnation slot, to be somebody's turn to do to the substrate
Impregnation program.
Substrate wet treater of the present invention, in an embodiment, which includes multiple treatment fluids
Nozzle provides a different hydro-peening treatment fluids with corresponding.
Substrate wet treater of the present invention, in an embodiment, it is single which includes multiple recycling
Member recycles the different hydro-peening treatment fluids with corresponding.
Substrate wet treater of the present invention, in an embodiment, the impregnation slot, the hydro-peening treatment trough with
The cleaning-drying slot is all same groove body, the hydro-peening treatment trough and the different recovery units that the cleaning-drying slot is same groove body.
Substrate wet treater of the present invention, in an embodiment, which is a closed groove body.
Substrate wet treater of the present invention, in an embodiment, which is located at hydro-peening processing
Above slot, wherein the substrate wet treater further includes a microscope carrier drive module, will complete the substrate of hydro-peening processing with being somebody's turn to do
Substrate is inverted microscope carrier rising and inserts the cleaning-drying slot, to carry out the cleaning-drying program.
Substrate wet treater of the present invention, in an embodiment, which will be located at the hydro-peening
The substrate for the treatment of trough is inverted microscope carrier and switchs to just put, and by the substrate just to insert the cleaning-drying slot, is done with carrying out the cleaning
Dry program.
Substrate wet treater of the present invention, in an embodiment, including a groove body control unit, the wherein slot
Body control unit controls the cleaning-drying slot to be separated up and down with the hydro-peening treatment trough, forms substrate output entrance, the wherein base
Plate exports entrance, the import and export substrate wet treater by the substrate.
Substrate wet treater of the present invention in an embodiment, further includes a gas hydro-peening unit, is arranged at
The hydro-peening treatment trough or the impregnation slot at least one of top carry out gas hydro-peening when groove body is removed to the substrate.
Substrate wet treater of the present invention, in an embodiment, which is positioned over the substrate and is inverted microscope carrier,
The wet process program is carried out to the substrate, wherein the substrate wet treater further includes a microscope carrier drive module to drive the base
Plate is inverted microscope carrier and is overturn between a upside down position and a forward position, wherein when the substrate wet treater carries out the substrate
When the impregnation program and the hydro-peening processing routine, which is inverted microscope carrier in the upside down position, when the substrate wet process
When device carries out cleaning-drying program to the substrate, it is in the forward position which, which is inverted microscope carrier,.
The present invention carries out hydro-peening processing in substrate hydro-peening processing routine by the way that substrate is inverted in slot, during hydro-peening
Compare conventional substrate non-inverted state, it is easier to remover or overburden are removed, and the problems such as anti-non-return is stained with.
The present invention also discloses the substrate wet treater that impregnation slot and hydro-peening treatment trough are arranged on to same groove body, to subtract
Few delivery time simultaneously avoids generating liquid cross staining.
The present invention also discloses impregnation slot, hydro-peening treatment trough and cleaning-drying slot is wet arranged on the substrate of same groove body
Processing unit can form a confined space in wet process program process, the delivery time except reducing entire processing routine
And the problem of avoiding generating outside liquid cross staining, more preventing chemical gas loss.
The present invention, which is more disclosed in, to be cleaned and dried program and switchs to just put by substrate and be cleaned and dried, after preventing cleaning-drying
Deionized water fall into the liquid pollution.
Description of the drawings
Figure 1A is the schematic diagram of the substrate wet treater of first embodiment of the invention.
Figure 1B is the schematic diagram that multi-piece substrate vertically impregnates in the impregnation slot of first embodiment of the invention.
Fig. 1 C are the schematic diagrames of multi-piece substrate horizontal immersion in the impregnation slot of first embodiment of the invention.
Fig. 1 D are the schematic diagrames of the hydro-peening treatment trough of first embodiment of the invention.
Fig. 1 E are the schematic diagram that substrate is vertically handled in the cleaning-drying slot of first embodiment of the invention.
Fig. 1 F are the schematic diagrames of substrate level processing in the cleaning-drying slot of first embodiment of the invention.
Fig. 2 is that the substrate of second embodiment of the invention carries out the schematic diagram of impregnating process.
Fig. 3 is that the substrate of second embodiment of the invention carries out the schematic diagram of hydro-peening program.
Fig. 4 is the schematic diagram of third embodiment of the invention.
Fig. 5 is that third embodiment of the invention is cleaned and dried slot with being separated above and below hydro-peening treatment trough, to form substrate import and export
The schematic diagram of mouth.
Fig. 6 is another schematic diagram of third embodiment of the invention.
Fig. 7 is another schematic diagram that the substrate of third embodiment of the invention be cleaned and dried program.
Fig. 8 is the substrate wet treater illustrative view of third embodiment of the invention.
Fig. 9 is the substrate wet treater illustrative view of third embodiment of the invention.
Wherein, reference numeral：
Substrate wet treater 1,1a, 1b, 1c
Impregnation slot 10,10a, 10c
Inside groove area 11
Outer groove area 12
Hydro-peening treatment trough 20
Substrate is inverted microscope carrier 21
It is cleaned and dried slot 30,30a
Processing procedure control unit 40
Transport carriage 41
Microscope carrier drive module 60
Recovery unit 22,22a, 22b, 31
Handle nozzle for liquid 80
Hydro-peening unit 801
Substrate 90
Groove body control unit 901
Substrate exports entrance 902
Upside down position P1
Forward position P2
Impregnate liquid 200
Ionized water 300
Hydro-peening treatment fluid 100
Specific embodiment
For the technology contents of the more detailed description present invention, spy lifts preferred embodiment and is described as follows.It please join below
Examine schematic diagrames of the Fig. 1 on the substrate wet treater of first embodiment of the invention.
As shown in Figure 1A, the present invention discloses a kind of substrate wet treater 1, to carry out a wet process journey to a substrate 90
Sequence, wherein wet process program include an impregnation program, a hydro-peening processing routine and a cleaning-drying program.According to this hair
A bright embodiment, substrate wet treater 1 include impregnation slot 10, hydro-peening treatment trough 20, are cleaned and dried slot 30 and place
Manage process control unit 40, wherein processing procedure control unit 40 be electrically connected impregnation slot 10, hydro-peening treatment trough 20 and
It is cleaned and dried slot 30, and wet process program of 40 control base board 90 of processing procedure control unit in substrate wet treater 1.
As shown in Figure 1A, Figure 1B and Fig. 1 C, in the first embodiment, impregnation slot 10, hydro-peening treatment trough 20 and cleaning
Dry slot 30 is each independent groove body, and processing procedure control unit 40 further comprises a transport carriage 41, substrate 90
Wet process program carries out respectively in impregnation slot 10, hydro-peening treatment trough 20 and cleaning-drying slot 30, and by transport carriage 41
It captures substrate 90 and first inserts the impregnation program that impregnation slot 10 carries out liquid.Herein it is noted that in the present embodiment
In, processing procedure control unit 40 is as the control program performed by a controller or computer, and transport carriage 41 is manipulator
Arm, but the present invention is not limited to this embodiment.
A specific embodiment according to the present invention carries out further including control process liquid temperature degree, control during impregnation program
Treatment fluid flow field and at least one for shaking substrate 90.
In the present embodiment, impregnation slot 10 can be housed and multiple vertically put impregnation program as shown in Figure 1B
Substrate 90, as shown in Figure 1 C impregnation slot 10a can house the substrate 90 that multiple levels are put, to carry out multi-piece substrate dipping
Processing.
When impregnation slot 10 carries out multi-piece substrate impregnation, processing procedure control unit 40 can control respectively respectively
The dipping sequential that substrate 90 inserts impregnation slot 10 is identical or different.Processing procedure control unit 40 passes through transport carriage 41
Each substrate 90 is controlled respectively in the impregnation program of impregnation slot 10.Wherein, every plate base 90 of same process conditions
Respectively after the identical impregnation time, then sequentially move to hydro-peening treatment trough 20.Due to the impregnation of every plate base 90
Time is identical, therefore can avoid causing the difference of degree of cleaning due to dip time is different, and then can improve yield.In addition, processing
Process control unit 40 according to process requirements, can handle multiple substrates 90 of different technology conditions.Needed for different technology conditions
The impregnation time is different, can control the specific leaching needed for each substrate 90 respectively by processing procedure control unit 40
Stain processing time.
In addition can also control makes the time needed for each 90 impregnation of substrate be more than hydro-peening processing required time, makes each base
Pending object on plate 90 can effectively remove (such as photoresist and metal film can effectively come off).And processing procedure control unit 40
It can be put according to the time difference the time required to impregnation program and the time required to hydro-peening processing routine, each substrate 90 of scheduling
Enter the dipping sequential of impregnation slot 10.It is first by taking first substrate, second substrate as an example with the sequencing that each substrate 90 is handled
Scheduling first substrate, second substrate insert impregnation slot 10 and carry out impregnation program respectively afterwards, when first substrate has impregnated
Cheng Hou is transferred to hydro-peening treatment trough 20, and when second substrate impregnates completion, first substrate also completed and moved to next by hydro-peening
Program (such as being cleaned and dried slot 30).Therefore, processing procedure control unit 40 can capture the second base directly from impregnation slot 10
Plate, and hydro-peening treatment trough 20 is transferred to, without having any obstruction, it can effectively control the impregnation time of each substrate 90.
As shown in Figure 1A, after the completion of impregnation program, transport carriage 41 capture substrate 90 insert hydro-peening treatment trough 20 into
Row hydro-peening processing routine, as shown in figure iD, at this point, the substrate that substrate 90 is positioned over hydro-peening treatment trough 20 is inverted microscope carrier 21.According to
The specific embodiment of the present invention, substrate are inverted microscope carrier 21 and are equipped with substrate holder element (not shown), be inverted with holding substrate 90
Carry out hydro-peening processing routine.Hydro-peening treatment trough 20 is equipped at least a recovery unit 22,22a, wherein processing nozzle for liquid 80 provides spray
Treatment fluid 100 is washed, in the case where substrate is inverted fixing 90 rotation status of substrate of microscope carrier 21, hydro-peening is carried out to substrate 90, and passes through recycling
Unit 22,22a recycling hydro-peenings treatment fluid 100.
As shown in figure iD, multiple recovery units 22,22a are may also set up, wherein processing nozzle for liquid 80, can provide different
Hydro-peening treatment fluid 100, and pass through the corresponding recovery unit 22 of hydro-peening treatment fluid or recovery unit 22a respectively, corresponding recycling is different
Hydro-peening treatment fluid.
An embodiment according to the present invention including a gas hydro-peening unit (not shown), is arranged at hydro-peening treatment trough 20
And at least one of top of impregnation slot 10, gas hydro-peening is carried out when groove body is removed to the substrate 90, can be sprayed except substrate 90
On raffinate, further reduce raffinate residual quantity.Gas hydro-peening unit is arranged above groove body or above cell wall, the present invention
It is not intended to limit.
Substrate 90 is after the processing of liquid hydro-peening, and transport carriage 41, which captures substrate 90 to insert again, is cleaned and dried slot 30, with place
Reason liquid (such as deionized water) carries out cleaning-drying program, with the wet process program of completing substrate 90, as referring to figure 1E, substrate 90
It obtains uprightly to be positioned over and is cleaned and dried in slot 30 to carry out cleaning-drying program.A specific embodiment according to the present invention is such as schemed
Shown in 1F, substrate 90, which must be placed horizontally at, to be cleaned and dried in slot 30a, is cleaned and is rotarily dried, to carry out cleaning-drying journey
Sequence.
Fig. 2 to Fig. 3 is the leaching of the schematic diagram of second embodiment of the invention, in a second embodiment substrate wet treater 1a
Stain treatment trough 10c is same groove body with hydro-peening treatment trough 20, and impregnation slot 10c is located at below hydro-peening treatment trough 20, and by
Processing procedure control unit 40 is controlled inserts hydro-peening by the substrate 90 for completing impregnation program by impregnation slot 10c risings
Slot 20 is managed, continues and carries out hydro-peening processing routine.
A specific embodiment according to the present invention, as shown in Fig. 2, substrate wet treater 1a is equipped with a microscope carrier drive module
60, microscope carrier drive module 60 is inverted microscope carrier 21 with substrate and is electrically connected, and substrate is inverted the decline of microscope carrier 21 and inserts impregnation slot
10c, to carry out impregnation program to substrate 90, and after impregnation program is completed, microscope carrier drive module 60 falls substrate
It puts the rising of microscope carrier 21 and inserts 20 hydro-peening treatment troughs, hydro-peening processing routine is carried out to substrate 90.In the present embodiment, microscope carrier driving mould
Block 60 is drive motor, but the present invention is not limited, other devices that can be used to drive substrate inversion microscope carrier 21 are all applicable in.
As shown in Fig. 2, when carrying out impregnation program, substrate is inverted the decline of microscope carrier 21 and inserted by microscope carrier drive module 60
Impregnation slot 10c, to carry out impregnation program to substrate 90, the impregnation slot 10c of the present embodiment can be divided into inside groove area
11 with outer groove area 12, when 60 drive substrate of microscope carrier drive module is inverted the immersion that substrate 90 is inverted into inside groove area 11 by microscope carrier 21
In liquid 200, cycling of liquid can be carried out by 11 spill-over of inside groove area to outer groove area 12 by impregnating liquid 200, wherein can also be cycled
Temperature control.According to an embodiment, substrate is inverted microscope carrier 21 and is held under 90 rotation status of substrate, and substrate 90 is rotatable at this time is uniformly subject to
Impregnating liquid 200 influences and is handled by temperature, and after the completion of impregnation program, 60 drive substrate of microscope carrier drive module is inverted microscope carrier 21
It is lifted off impregnating liquid 200.
A specific embodiment according to the present invention, carry out includes control process liquid during impregnation program (impregnates liquid
200) temperature, control process liquid (impregnate liquid 200) flow field and shake the substrate 90 at least first, and in completing at dipping
After managing program, as shown in figure 3, substrate is inverted the rising of microscope carrier 21 by microscope carrier drive module 60 inserts hydro-peening treatment trough 20, with to base
Plate 90 carries out hydro-peening processing routine.
According to Fig. 3, hydro-peening treatment trough 20 is equipped with an at least recovery unit 22,22a recycling hydro-peenings treatment fluid 100, and does not spray
The impregnation slot 10c for being located at 20 downside of hydro-peening treatment trough will be fallen by splashing to the hydro-peening treatment fluid 100 of recovery unit 22,22a.Its
In centrifugal force can be allowed to rotate to being returned in recovery unit 22,22a after 100 hydro-peening of hydro-peening treatment fluid by improving substrate rotating speed
It receives.
A specific embodiment according to the present invention, refering to what is shown in Fig. 3, hydro-peening treatment fluid 100 is identical with impregnating liquid 200
The treatment fluid (such as with batch of same treatment liquid or new and old same treatment liquid) of ingredient, therefore non-splash is to recovery unit
22nd, the hydro-peening treatment fluid 100 of 22a will fall into the impregnation slot 10c for being located at 20 downside of hydro-peening treatment trough, hydro-peening treatment fluid 100
It is mixed into immersion liquid 200 and is continuing with, therefore there is no the problem for the treatment of fluid cross contamination.
A specific embodiment according to the present invention, wet process program further includes hydro-peening processing routine before dipping, in being soaked
Before stain during hydro-peening processing routine, substrate 90 is inserted substrate inversion microscope carrier 21 to carry out impregnating preceding spray by processing procedure control unit 40
After washing processing routine, the decline of substrate 90 is inserted impregnation slot 10c by microscope carrier drive module 60 again.
After hydro-peening processing routine is completed, microscope carrier drive module 60 falls the substrate 90 for completing hydro-peening processing routine with substrate
It puts the rising of microscope carrier 21 and inserts cleaning-drying slot 30, to carry out cleaning-drying program, substrate 90 is being cleaned and dried in slot 30 with processing
Liquid (such as deionized water 300) carries out hydro-peening, after managing the deionized water 300 after discharge cleaning, can carry out nitrogen hydro-peening again and do
Dry high speed is spin-dried for.An embodiment according to the present invention, be cleaned and dried slot 30 in supplied in slot a volatile liquid drying cleaning, example
Such as when substrate 90 for tool surface texture substrate, can have preferable cleaning performance.
Fig. 4 to Fig. 9 is the schematic diagram of third embodiment of the invention, impregnation slot 10c, the hydro-peening of substrate wet treater
Treatment trough 20 is with being cleaned and dried slot 30 all in same groove body, and hydro-peening treatment trough 20 is with being cleaned and dried the difference that slot 30 is same groove body
Recovery unit can form a confined space in wet process program process.
As shown in figure 4, after hydro-peening processing routine is completed, microscope carrier drive module 60 will complete the substrate of hydro-peening processing routine
90 are inverted the rising of microscope carrier 21 with substrate inserts cleaning-drying slot 30, to the 90 hydro-peening deionized water 300 of substrate, and by recovery unit
22b is recycled.An embodiment according to the present invention, and substrate 90 is switched to just put, to carry out cleaning-drying program, can prevent
Deionized water 300 after cleaning-drying falls into hydro-peening treatment trough 20 and pollutes.In this step, substrate is inverted microscope carrier 21 and is switched to just
The sequential put can be to insert before or after being cleaned and dried slot 30.
It is separated as shown in figure 5, being cleaned and dried slot 30 with hydro-peening treatment trough about 20, showing for entrance is exported to form substrate 90
It is intended to.Such as after EP (end of program) is cleaned and dried, it is cleaned and dried slot 30 and rises, completing substrate wet process program.
A specific embodiment according to the present invention, substrate wet treater 1b as shown in Figure 6 are cleaned and dried returning for slot 30
Receipts unit 31 is disposed proximate to recovery unit 22,22a in hydro-peening treatment trough 20, when carrying out hydro-peening processing routine, treatment fluid spray
Mouth 80 carries out hydro-peening using hydro-peening treatment fluid 100 to substrate 90, and passes through an at least recovery unit 22,22a recycling hydro-peening processing
Liquid 100.After hydro-peening processing routine, as shown in fig. 7, microscope carrier drive module 60 by complete hydro-peening processing routine substrate 90 with
And substrate is inverted microscope carrier 21 and rises to the position that deionized water 300 can be recycled by the recovery unit 31 of cleaning-drying slot 30, carries out
The cleaning-drying program of next stage, and by the dried deionized water 300 of 31 recovery and rinsing of recovery unit.The present embodiment is said
Though it is bright and diagram be by substrate be inverted microscope carrier 21 lift by carry out hydro-peening processing routine and be cleaned and dried program exemplified by, not with
This embodiment is limited, such as can be by way of lifting each recovery unit 22,22a, 31 etc., to complete in same slot
It carries out hydro-peening processing routine and is cleaned and dried program.The weight improved by the form and driving method non-invention of recovery unit
Point, therefore no longer this repeats its details.
A specific embodiment according to the present invention, as shown in Figure 8, Figure 9, the impregnation slot of substrate wet treater 1c
10th, for hydro-peening treatment trough 20 with being cleaned and dried slot 30 all in same groove body, hydro-peening treatment trough 20 is same slot with being cleaned and dried slot 30
The different recovery units (signal of each recovery unit can refer to exemplified by Fig. 4, Fig. 5) of body, can be with shape in wet process program process
Into a confined space, substrate wet treater 1c includes a groove body control unit 901, the controllable cleaning of groove body control unit 901
Dry slot 30 forms closed (Fig. 9) with hydro-peening treatment trough 20 or separates (Fig. 8), close in cleaning-drying slot 30 and hydro-peening treatment trough 20
When closing, substrate 90 can be cleaned and dried being cleaned and dried slot 30, prevent outside cleaning solution splash to device and prevent chemistry
The problem of gas escape；And when cleaning-drying slot 30 is separated with hydro-peening treatment trough 20, substrate output entrance 902 can be formed,
Wherein substrate 90 exports entrance 902, import and export substrate wet treater 1c by substrate.A specific implementation according to the present invention
Example, groove body control unit 901 can be drive motor or mechanical arm, but the present invention is not limited with these embodiments.
As shown in Fig. 8 and Fig. 9, substrate, which is inverted microscope carrier 21, includes an a upside down position P1 and forward position P2, wherein base
Plate is inverted microscope carrier 21 and is inverted microscope carrier 21 between upside down position P1 and forward position P2 by 60 drive substrate of microscope carrier drive module
Overturning.When substrate wet treater 1c carries out impregnation program and hydro-peening processing routine to substrate 90, substrate, which is inverted, to be carried
Platform 21 is in upside down position P1, and when substrate wet treater 1c carries out cleaning-drying program to substrate 90, substrate is inverted microscope carrier 21
In forward position P2.The present embodiment carries out substrate wet process integration procedure in same slot, except shortening wet process program
Processing time, reduce substrate 90 when being converted between several slots, caused by hydro-peening treatment fluid 100 or impregnate liquid 200 and leak feelings
The problems such as condition, and solving in wet process Program transformation, treatment fluid cross staining and chemical gas loss.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and deformation, but these corresponding changes and deformation can be made according to the present invention by knowing those skilled in the art
The protection domain of the claims in the present invention should all be belonged to.
Claims (20)
1. a kind of substrate wet treater, to carry out a wet process program to a substrate, which is characterized in that the wet process program
Program is cleaned and dried including an impregnation program, a hydro-peening processing routine and one, which includes：
One impregnation slot, to carry out the impregnation program to the substrate；
One hydro-peening treatment trough, the hydro-peening treatment trough include a substrate and are inverted microscope carrier, and the wherein substrate is positioned over the substrate and is inverted load
Platform, to carry out the hydro-peening processing routine to the substrate；
One is cleaned and dried slot, to carry out the cleaning-drying program to the substrate；And
One processing procedure control unit is electrically connected the impregnation slot, the hydro-peening treatment trough and the cleaning-drying slot, at this
Reason process control unit controls the wet process program of the substrate in the substrate wet treater.
2. substrate wet treater as described in claim 1, which is characterized in that the impregnation slot can house multiple bases
Plate, wherein when the impregnation slot carries out the impregnation program, which controls the respectively substrate respectively
Insert a dipping sequential of the impregnation slot.
3. substrate wet treater as claimed in claim 2, which is characterized in that the processing procedure control unit controls respectively respectively
The substrate passes in and out the sequential of the impregnation slot.
4. substrate wet treater as claimed in claim 3, which is characterized in that processing procedure control unit control was to respectively should
The impregnation time of substrate is identical, and respectively the substrate is respectively implanted the impregnation slot for scheduling, to carry out at the dipping
Manage program.
5. substrate wet treater as claimed in claim 3, which is characterized in that the processing procedure control unit controls pair respectively
Respectively the substrate carries out the time of the impregnation program as difference, and respectively the substrate inserts the impregnation slot for scheduling, to carry out
The impregnation program.
6. substrate wet treater as claimed in claim 2, which is characterized in that needed for the impregnation program of the substrate
The time required to time is more than hydro-peening processing, the processing procedure control unit is according to impregnation program required time and the spray
Wash the time difference the time required to processing routine, respectively the substrate inserts the dipping sequential of the impregnation slot for scheduling.
7. substrate wet treater as described in claim 1, which is characterized in that the impregnation slot is with the hydro-peening treatment trough
Same groove body, the impregnation slot are located at below the hydro-peening treatment trough, and wherein the processing procedure control unit will complete the dipping
The hydro-peening treatment trough is inserted in the substrate rising of processing routine.
8. substrate wet treater as claimed in claim 7, which is characterized in that carried out using a hydro-peening treatment fluid to the substrate
Hydro-peening processing, the hydro-peening treatment fluid recycle the impregnation slot fallen into below the hydro-peening treatment trough.
9. substrate wet treater as claimed in claim 7, which is characterized in that the hydro-peening treatment trough includes a recovery unit,
The hydro-peening processing is wherein carried out to the substrate using a hydro-peening treatment fluid, and passes through the recovery unit and recycles the hydro-peening treatment fluid,
The hydro-peening treatment fluid of wherein non-splash to the recovery unit will fall into the impregnation slot being located at below the hydro-peening treatment trough
It is recycled.
10. substrate wet treater as claimed in claim 7, which is characterized in that the substrate is positioned over the substrate and is inverted microscope carrier,
Wherein the substrate wet treater further includes a microscope carrier drive module, which is inverted microscope carrier decline and inserts the impregnation
Slot, to carry out the impregnation program to the substrate, and after the impregnation program is completed, microscope carrier drive module is by the substrate
It is inverted microscope carrier rising and inserts the hydro-peening treatment trough, the hydro-peening processing routine is carried out to the substrate.
11. substrate wet treater as claimed in claim 10, which is characterized in that before the wet process program further includes a dipping
The substrate is inserted the substrate and is inverted microscope carrier to carry out before the dipping at hydro-peening by hydro-peening processing routine, the processing procedure control unit
After managing program, which is inverted microscope carrier decline by the substrate and inserts the impregnation slot, to be somebody's turn to do to the substrate
Impregnation program.
12. substrate wet treater as claimed in claim 7, which is characterized in that the hydro-peening treatment trough includes multiple treatment fluids
Nozzle provides a different hydro-peening treatment fluids with corresponding.
13. substrate wet treater as claimed in claim 12, which is characterized in that it is single that the hydro-peening treatment trough includes multiple recycling
Member recycles the different hydro-peening treatment fluids with corresponding.
14. substrate wet treater as claimed in claim 7, which is characterized in that the impregnation slot, the hydro-peening treatment trough with
The cleaning-drying slot is all same groove body, the hydro-peening treatment trough and the different recovery units that the cleaning-drying slot is same groove body.
15. substrate wet treater as claimed in claim 14, which is characterized in that the groove body is a closed groove body.
16. the substrate wet treater as described in claim 14, which is characterized in that the cleaning-drying slot is located at the hydro-peening
Manage slot above, wherein the substrate wet treater further includes a microscope carrier drive module, by complete the hydro-peening processing the substrate with
The substrate is inverted microscope carrier rising and inserts the cleaning-drying slot, to carry out the cleaning-drying program.
17. substrate wet treater as claimed in claim 16, which is characterized in that the microscope carrier drive module will be located at the hydro-peening
The substrate for the treatment of trough is inverted microscope carrier and switchs to just put, and by the substrate just to insert the cleaning-drying slot, is done with carrying out the cleaning
Dry program.
18. substrate wet treater as claimed in claim 14, which is characterized in that including a groove body control unit, wherein should
Groove body control unit controls the cleaning-drying slot to be separated up and down with the hydro-peening treatment trough, forms substrate output entrance, wherein should
Substrate exports entrance, the import and export substrate wet treater by the substrate.
19. substrate wet treater as described in claim 1, which is characterized in that further include a gas hydro-peening unit, be arranged at
The hydro-peening treatment trough or the impregnation slot at least one of top carry out gas hydro-peening when groove body is removed to the substrate.
20. substrate wet treater as described in claim 1, which is characterized in that the substrate is positioned over the substrate and is inverted microscope carrier,
The wet process program is carried out to the substrate, wherein the substrate wet treater further includes a microscope carrier drive module to drive the base
Plate is inverted microscope carrier and is overturn between a upside down position and a forward position, wherein when the substrate wet treater carries out the substrate
When the impregnation program and the hydro-peening processing routine, which is inverted microscope carrier in the upside down position, when the substrate wet process
When device carries out cleaning-drying program to the substrate, it is in the forward position which, which is inverted microscope carrier,.
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| US201662420107P | 2016-11-10 | 2016-11-10 | |
| US62/420,107 | 2016-11-10 |
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| CN201721149835.9U Active CN207183227U (en) | 2016-11-10 | 2017-09-08 | Cleaning device |
| CN201710966459.0A Active CN108091591B (en) | 2016-11-10 | 2017-10-17 | Liquid processing device |
| CN201711049350.7A Withdrawn CN108074838A (en) | 2016-11-10 | 2017-10-31 | Base plate wet processing unit |
| CN201711068508.5A Active CN108074856B (en) | 2016-11-10 | 2017-11-03 | Single substrate processing apparatus |
| CN201711089961.4A Active CN108074842B (en) | 2016-11-10 | 2017-11-08 | Substrate wet processing device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710696433.9A Active CN108074858B (en) | 2016-11-10 | 2017-08-15 | Substrate wet processing device |
| CN201721149835.9U Active CN207183227U (en) | 2016-11-10 | 2017-09-08 | Cleaning device |
| CN201710966459.0A Active CN108091591B (en) | 2016-11-10 | 2017-10-17 | Liquid processing device |
| CN201711049350.7A Withdrawn CN108074838A (en) | 2016-11-10 | 2017-10-31 | Base plate wet processing unit |
| CN201711068508.5A Active CN108074856B (en) | 2016-11-10 | 2017-11-03 | Single substrate processing apparatus |
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| CN (6) | CN108074858B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1542907A (en) * | 2003-02-26 | 2004-11-03 | �ձ�������ʽ���� | Substrate processing apparatus |
| US20060162745A1 (en) * | 2003-07-02 | 2006-07-27 | Katsuyoshi Nakatsukasa | Substrate processing method and substrate processing device |
| CN1946486A (en) * | 2004-04-28 | 2007-04-11 | 株式会社荏原制作所 | Substrate processing unit and substrate processing apparatus |
| CN101047116A (en) * | 2006-03-31 | 2007-10-03 | 大日本网目版制造株式会社 | Substrate processing apparatus |
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