CN108074838A - Base plate wet processing unit - Google Patents
Base plate wet processing unit Download PDFInfo
- Publication number
- CN108074838A CN108074838A CN201711049350.7A CN201711049350A CN108074838A CN 108074838 A CN108074838 A CN 108074838A CN 201711049350 A CN201711049350 A CN 201711049350A CN 108074838 A CN108074838 A CN 108074838A
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- Prior art keywords
- hydro
- peening
- substrate
- unit
- base plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Level Indicators Using A Float (AREA)
- Weting (AREA)
Abstract
The present invention discloses a kind of base plate wet processing unit, including a soaking compartment, a hydro-peening treatment trough, a transport carriage and a control unit.Control unit controls the wet processed of multiple substrates.Soaking compartment includes a multiple-piece holding part, and control unit controls each substrate in the immersion treatment sequential of multiple-piece holding part respectively.Hydro-peening treatment trough is adjacent to soaking compartment.Control unit control transport carriage transfers a first substrate to multiple-piece holding part；By an interval time, one second substrate of transfer to multiple-piece holding part；First substrate passes through the immersion treatment time, is transferred to hydro-peening treatment trough；After a hydro-peening processing time, first substrate is removed；And second substrate is transferred to hydro-peening treatment trough by the immersion treatment time.Control unit is according to hydro-peening processing time scheduling interval time.
Description
Technical field
The present disclosure generally relates to a kind of base plate wet processing units.
Background technology
In semiconductor processing, need first to carry out multiple tracks cleaning procedure to substrate (such as wafer), to remove the miscellaneous of substrate surface
Matter.Or it is, with lithography after substrate (such as wafer) forms pattern, it is also necessary to by multiple tracks cleaning procedure to remove photoresist
(Photo Resistor, PR) or metal film (Metal Film).In general, be that substrate is first soaked in chemical liquids, then with
The mode cleaning base plate of hydro-peening, finally dry substrate in rotary manner, and each step system is used at single-wafer horizontal again
Manage unit.Therefore, each plate base is needed to wait for after having impregnated, and the subsequent steps such as could then be cleaned, dried.Due to each
The processing time of step is different, and the time such as impregnated is longer, and then makes the service efficiency of substrate processing apparatus bad.
In order to improve afore-mentioned, occurs a kind of substrate processing apparatus with batch soaking compartment on the market, disposably
Multiple plate bases are placed in soaking compartment, soaking cycle is carried out with batch.By the design of batch soaking compartment, to improve base
Plate processing equipment service efficiency.However as down-stream be still using single-wafer horizontal processing unit carry out, therefore still have to from
Substrate (1 piece/times) is sequentially taken out in batch soaking compartment to be cleaned, drying and other steps.Therefore, the design of batch soaking compartment
The soaking time that can cause must to maintain each plate base of same process conditions instead is different, and (such as a substrate is comparatively fast taken
Go out, then soaking time is shorter；Conversely, another substrate soaking time is then longer), effect after immersion also difference.So, subsequently
It still cleaned, dried with similarity condition, the degree of cleaning for making every plate base is different, yield can be reduced instead, there is improvement in fact
Necessity.
The content of the invention
In view of the above subject, the main object of the present invention, which ties up to, provides a kind of base plate wet processing unit, base plate wet
Processing unit includes the soaking compartment with multiple-piece holding part, and control unit controls the wet processed of multiple substrates, and by
Transport carriage controls each substrate in the immersion treatment sequential (such as first substrate and second substrate) of multiple-piece holding part, control respectively
Unit processed and according to hydro-peening processing time scheduling immersion treatment sequential needed for hydro-peening treatment trough, to solve existing substrate board treatment
Base plate wet processing the problem of.
To reach above-mentioned purpose, the present invention provides a kind of base plate wet processing unit, including a soaking compartment, a hydro-peening
Treatment trough, a transport carriage and a control unit.Control unit controls the wet processed of multiple substrates.Soaking compartment includes more than one
Chip holding part, wherein control unit control each substrate in the immersion treatment sequential of multiple-piece holding part respectively.Hydro-peening processing
Slot is adjacent to soaking compartment, and with an at least one chip hydro-peening unit.Transport carriage is moved between soaking compartment and hydro-peening treatment trough
Send each substrate.The multiple-piece that control unit control transport carriage transfers a first substrate to soaking compartment in those substrates houses
Portion by an interval time, transfers the second substrate in those substrates to the multiple-piece holding part of soaking compartment, first substrate warp
The immersion treatment time is spent, the one chip hydro-peening unit that hydro-peening treatment trough is transferred to from soaking compartment carries out hydro-peening processing, by one
Hydro-peening processing time removes first substrate and second substrate by the immersion treatment time, from immersion from one chip hydro-peening unit
Slot, which continues, is transferred to the one chip hydro-peening unit progress hydro-peening processing of hydro-peening treatment trough, when wherein control unit is handled according to hydro-peening
Between scheduling interval time.
Embodiment, base plate wet processing unit further include a cleaning-drying unit, are adjacent to list one of according to the present invention
Chip hydro-peening unit, wherein transport carriage transfer each of substrate to being cleaned and dried unit from one chip hydro-peening unit.
One of according to the present invention embodiment is cleaned and dried unit and is arranged in hydro-peening treatment trough, first to each of substrate
It carries out hydro-peening processing and continues to be cleaned and dried.
One of according to the present invention embodiment, is cleaned and dried that unit includes a cleaning solution supply unit and a volatile solvent soln supplies
Unit is answered, unit is cleaned and dried and a cleaning solution and a volatile solvent soln is bestowed to substrate.
One of according to the present invention embodiment, the multiple-piece holding part are a horizontal multiple-piece holding part.
One of according to the present invention embodiment, multiple-piece holding part are a vertical multiple-piece holding part.
One of according to the present invention embodiment, one chip hydro-peening unit are a vertical one chip hydro-peening unit.
One of according to the present invention embodiment, one chip hydro-peening unit include a spray tank and an at least fluid nozzle, fluid
Nozzle is arranged at at least one side wall of spray tank, and is vertically moved by each of substrate in the spray tank, fluid spray
The head each of substrate of hydro-peening.
One of according to the present invention embodiment, substrate when moving vertically upward in spray tank, fluid nozzle hydro-peening substrate.
One of according to the present invention embodiment, soaking compartment includes a flow field control unit, in vertical multiple-piece holding part with one
Drop stream flow field processing substrate.
One of according to the present invention embodiment, transport carriage vertically bearing substrate and be moved to vertical multiple-piece holding part and
Vertical one chip hydro-peening unit.
Embodiment, wherein transport carriage further include a moving track, are arranged at soaking compartment and hydro-peening one of according to the present invention
The top for the treatment of trough.
One of according to the present invention embodiment, vertical multiple-piece holding part include multiple one chip storage tank positions, those monolithics
Formula storage tank position and vertical one chip hydro-peening unit respectively include a processing carrier, and transport carriage bearing substrate is to handling carrying
Frame inserts one of those one chip storage tank positions or vertical one chip hydro-peening unit by the lifting of processing carrier bearing substrate.
One of according to the present invention embodiment, transport carriage include an additional circuit boards, transport carriage movement additional circuit boards
And lifted by additional circuit boards bearing substrate, to insert soaking compartment or hydro-peening treatment trough.
Embodiment, base plate wet processing unit further include hydro-peening unit before an immersion, are adjacent to more one of according to the present invention
Chip holding part, control unit first controls transport carriage transfer substrate to before impregnating after hydro-peening unit progress hydro-peening, then is transferred to
Multiple-piece holding part.
One of according to the present invention embodiment, hydro-peening unit is arranged in soaking compartment before immersion, and substrate is first carried out at hydro-peening
It manages and continues and be transferred to multiple-piece holding part progress immersion treatment.
Embodiment, base plate wet processing unit further include a gas hydro-peening unit, are arranged at leaching one of according to the present invention
Slot or at least one of top of hydro-peening treatment trough are steeped, gas hydro-peening is carried out when groove body is removed to substrate.
One of according to the present invention embodiment, hydro-peening treatment trough are provided with multiple one chip hydro-peening units, control unit according to
According to the hydro-peening processing time scheduling interval time of multiple one chip hydro-peening units.
One of according to the present invention embodiment, the immersion treatment time of substrate are more than hydro-peening processing time, control unit foundation
Immersion treatment time and hydro-peening processing time scheduling interval time.
Embodiment, the immersion treatment time of each of substrate are controlled respectively by control unit one of according to the present invention, are controlled
Unit processed is according to the immersion treatment time of each of substrate and hydro-peening processing time scheduling interval time.
From the above, base plate wet processing unit according to the invention, including a soaking compartment, a hydro-peening treatment trough, one
Transport carriage and a control unit.Soaking compartment includes a multiple-piece holding part, and hydro-peening treatment trough is adjacent to soaking compartment.Control
Unit controls the wet processed of multiple substrates, and controls leaching of each plate base in multiple-piece holding part respectively by transport carriage
Bubble processing sequential.Wherein, multiple substrates are placed in multiple-piece holding part, and every plate base of same process conditions is respectively by identical
After the immersion treatment time, then sequentially move to hydro-peening treatment trough.Since the immersion treatment time of every plate base is identical, thus can avoid because
Soaking time is different and causes the difference of degree of cleaning, and then can improve yield.
Also, the interval time for putting first substrate and second substrate in soaking compartment is more than or equal to hydro-peening processing time, it can be true
It protects after the completion of the first substrate hydro-peening of sequence earlier above, the second substrate after sequence relatively, which begins to impregnate, to be completed.Therefore, the after sequence relatively
Two substrates can swimmingly be moved to hydro-peening treatment trough, will not be subject to hindering for the first substrate to sort earlier above.
Also, the base plate wet processing unit of the present invention, control unit can handle different technology conditions according to process requirements
Multiple substrates.The immersion treatment time needed for different technology conditions is different, can control each base respectively by control unit
The specific immersion treatment time needed for plate；And control unit is according to the immersion treatment time of each substrate and hydro-peening processing time
Scheduling interval time.
Description of the drawings
Fig. 1 is the schematic diagram of one of the present invention base plate wet processing unit of embodiment.
Fig. 2 is soaking compartment shown in FIG. 1, hydro-peening treatment trough and the diagrammatic cross-section for being cleaned and dried unit.
Fig. 3 is the stereoscopic schematic diagram of soaking compartment shown in FIG. 1 and hydro-peening treatment trough.
Fig. 4 is the flow diagram of one of the present invention base plate wet processing method of embodiment.
Fig. 5 is the illustrative view of soaking compartment shown in Fig. 3.
Fig. 6 is the schematic diagram of the soaking compartment of another embodiment of the present invention.
Fig. 7 is the drop stream flow field schematic diagram of soaking compartment shown in Fig. 3.
Fig. 8 is the schematic diagram of the hydro-peening treatment trough of another embodiment of the present invention.
Fig. 9 is the hydro-peening treatment trough of another embodiment of the present invention and the schematic diagram for being cleaned and dried unit.
Figure 10 is the hydro-peening treatment trough of another embodiment of the present invention and the schematic diagram for being cleaned and dried unit.
Figure 11 is the schematic diagram of the base plate wet processing unit of another embodiment of the present invention.
Wherein reference numeral is：
Base plate wet processing unit 1,1d
Soaking compartment 10,10a, 10d
Multiple-piece holding part 11,11a, 11d
One chip storage tank position 111d
The vertical converting unit 12 of substrate level, 12d
Hydro-peening treatment trough 20,20a, 20b, 20c, 20d
One chip hydro-peening unit 21,21a, 21b, 21c, 21d
Spray tank 211
Fluid nozzle 212
Treatment fluid collector unit 22c
Transport carriage 30
Additional circuit boards 31,31d
Moving member 32,32d
Moving track 33,33d
Control unit 40
It is cleaned and dried unit 50,50b, 50c
Cleaning solution supply unit 51,51b, 51c
Cleaning solution collector unit 52c
Gas hydro-peening unit 60
Handle carrier A
Substrate S
First substrate S1
Second substrate S2
Specific embodiment
For that can allow your juror that can know more about the technology contents of the present invention, spy lifts preferred embodiment and is described as follows.
Fig. 1 is the schematic diagram of one of the present invention base plate wet processing unit of embodiment, Fig. 2 is soaking compartment shown in FIG. 1,
Hydro-peening treatment trough and the diagrammatic cross-section for being cleaned and dried unit, Fig. 3 show for the solid of soaking compartment shown in FIG. 1 and hydro-peening treatment trough
It is intended to, please also refer to shown in Fig. 1, Fig. 2 and Fig. 3.The base plate wet processing unit 1 of the present embodiment is used to handle multiple plate bases
S is impregnated, hydro-peening, the programs such as cleaning and drying respectively for multiple plate base S, and the part system on start is with the first base
Illustrate exemplified by plate S1 and second substrate S2.The base plate wet processing unit 1 of the present embodiment includes soaking compartment 10, hydro-peening treatment trough
20th, transport carriage 30, control unit 40 and cleaning-drying unit 50.Wherein, hydro-peening treatment trough 20 is adjacent to soaking compartment 10, defeated
Carrier 30 is sent to be moved between soaking compartment 10 and hydro-peening treatment trough 20, each substrate S is thereby transferred to soaking compartment 10 and hydro-peening
Treatment trough 20.
Also, start of the control unit 40 of the present embodiment by control transport carriage 30, has carried out multiple plate base S wet
Formula processing, and each substrate S (first substrate S1, second substrate S2) is controlled respectively in the multiple-piece holding part 11 of soaking compartment 10
Immersion treatment sequential.Also, control unit 40 stores a base plate wet processing method (program), as shown in figure 4, Fig. 4 is the present invention
An embodiment base plate wet processing method flow diagram.Control unit 40 can control transport carriage 30 to perform following step
Suddenly：The first substrate in multiple substrates is transferred to the multiple-piece holding part (step S10) of soaking compartment；By an interval time, move
The second substrate in multiple substrates is sent to the multiple-piece holding part (step S20) of soaking compartment；First substrate passes through an immersion treatment
Time, the one chip hydro-peening unit that hydro-peening treatment trough is transferred to from soaking compartment carry out hydro-peening processing (step S30)；By a hydro-peening
Processing time removes first substrate (step S40) from one chip hydro-peening unit；And second substrate pass through the immersion treatment when
Between, it continues from soaking compartment and is transferred to the one chip hydro-peening unit progress hydro-peening processing (step S50) of hydro-peening treatment trough.It arranges in pairs or groups below
Each step further illustrates the structure feature of the base plate wet processing unit 1 of the present embodiment.
Step S10：The first substrate S1 in multiple substrate S is transferred to the multiple-piece holding part 11 of soaking compartment 10.
In the soaking compartment 10 of the present embodiment there is soak, and including a multiple-piece holding part 11, multiple can be housed
Substrate S.Wherein, multiple-piece holding part 11 can be horizontal or rectilinear, preferably can be rectilinear, the multi-disc of the present embodiment
Formula holding part 11 is a vertical multiple-piece holding part.Rectilinear design more makes conveying except can reach section space-efficient effect
Carrier 30 can clamp from the limitation in space and transfer the substrate S of the specified clamping of control unit 40.The conveying of the present embodiment carries
Tool 30 is movably arranged at soaking compartment 10 and hydro-peening treatment trough 20, and the vertically bearing substrate S of transport carriage 30.In detail and
Speech, transport carriage 30 include additional circuit boards 31, moving member 32 and moving track 33.Additional circuit boards 31 to accept substrate S,
So that substrate S is lifted and can be inserted soaking compartment 10 and hydro-peening treatment trough 20.Moving track 33 is arranged at soaking compartment 10 and spray
Wash the top for the treatment of trough 20.Moving member 32 is arranged at two sides of additional circuit boards 31, and part is placed in moving track 33, makes shifting
Moving part 32 can move along track 33 and move, to drive additional circuit boards 31 that substrate S is transferred designated position.Wherein in each processing
Step is all the one chip processing of substrate out of the ordinary, therefore soaking compartment 10 and hydro-peening processing can be travelled to and fro between by single moving member 32
Slot 20 clamps and transfers the substrate S of the specified clamping of control unit 40.In other embodiments, according to process requirements, can also set
Multiple moving members 32 are put, the present invention is not intended to limit.
In general, substrate S is sent into base plate wet processing unit 1 with horizontal state by mechanisms such as mechanical arms,
Therefore the space of substrate S of horizontality and the vertical converting unit 12 of a substrate level can be put by still having in front of soaking compartment 10.Compared with
Good, the soaking compartment 10 of the present embodiment has the vertical converting unit 12 of substrate level, after the substrate S for receiving horizontality, then
Plumbness is converted into, and is received by the additional circuit boards 31 of transport carriage 30.It please arrange in pairs or groups shown in Fig. 5, Fig. 5 is shown in Fig. 3
Soaking compartment illustrative view.After the drive additional circuit boards 31 of moving member 32 and substrate S are moved to designated position, such as multi-disc
The position of substrate S is not yet put in formula holding part 11, then substrate S is vertically disposed to multiple-piece appearance (by taking first substrate S1 as an example)
Portion 11 is put, meanwhile, control unit 40 notes down it and puts the time.
In other embodiments, shown in please referring to Fig.1, the vertical converting unit 12 of substrate level is arranged at hydro-peening treatment trough 20
And be cleaned and dried between unit 50, by the substrate S of plumbness, reconvert is into horizontality.
In other embodiments, multiple-piece holding part 11a also can be with horizontal, as shown in fig. 6, Fig. 6 is the another of the present invention
The schematic diagram of the soaking compartment of one embodiment.The soaking compartment 10a of this embodiment has the multiple-piece holding part 11a of horizontal, it is only necessary to
It arranges in pairs or groups other mechanisms, makes transport carriage 30 that can once take out a plate base.Also, the design of horizontal can make substrate S enter immersion
It can not have to be converted to plumbness during slot 10a.
Step S20：By an interval time, the second substrate S2 in multiple substrate S is transferred, is placed in the more of soaking compartment 10
Chip holding part 11.
In other words, transport carriage 30 first transfers first substrate S1 to the progress soaking cycle (step of multiple-piece holding part 11
S10), after an interval time, then transfer second substrate S2 to multiple-piece holding part 11 carry out soaking cycle (step S20),
After repeatedly, you can the substrate S of multiple is placed in multiple-piece holding part 11 and carries out soaking cycle.It is it is noted that every
The all independent disengaging soaking compartments 10 of one plate base S (by taking first substrate S1 and second substrate S2 as an example), and it puts the time of time
Difference is foregoing interval time.In other words, between the difference of the storing time of first substrate S1 and second substrate S2 is foregoing
Every the time.Therefore, after first substrate S1 and second substrate S2 (multiple plate base S) being sequentially placed in soaking compartment 10, can simultaneously in
Soaking compartment 10 carries out soaking cycle respectively, puts second substrate S2 after having been impregnated without waiting for first substrate S1 again, thereby improves
The service efficiency of base plate wet processing unit 1.
Preferably, soaking compartment 10 further includes temperature control unit, flow field control unit or concussion unit, wherein, temperature control
Soak in soaking compartment 10 can be maintained an assigned temperature section by unit processed, and flow field control unit can control soak
Flow field with the photoresist on equably maceration substrate S, may be, for example, drop stream flow field, as shown in the arrow of Fig. 7, Fig. 7 Fig. 3
The drop stream flow field schematic diagram of shown soaking compartment.Specifically, flow field control unit is formed in vertical multiple-piece holding part 11 and dropped
Flow field is flowed to be further processed substrate S, if substrate S has overburden, using drop stream by overburden toward lower band.Also, concussion unit
Multiple-piece holding part 11 is connected to, to shake the first substrate S1 and second substrate S2 (multiple for being placed in multiple-piece holding part 11
Substrate S), and then accelerate to remove the photoresist or metal film on substrate S.
In other embodiments, base plate wet processing unit 1 more may include hydro-peening unit before an immersion, be adjacent to multi-disc
Formula holding part 11.Before step S10, control unit 40 can first control transport carriage 30 to transfer first substrate S1 (single substrates
S) the hydro-peening unit to before impregnating after the hydro-peening processing before being impregnated, then performs step S10, first substrate S1 is transferred to
Multiple-piece holding part 11.Then, clamp second substrate S2 and be transferred to after hydro-peening unit before immersion carries out hydro-peening processing, then perform
Second substrate S2 (is transferred to multiple-piece holding part 11 by step S20.
Also, hydro-peening unit may be disposed in soaking compartment 10 or be adjacent to soaking compartment 10 before impregnating.To be arranged at soaking compartment 10
Exemplified by interior, soaking compartment 10 can divide into two spaces, and one has nozzle using as hydro-peening unit before immersion, another storing multi-disc
Formula holding part 11, and can first to substrate S carry out hydro-peening processing after, continue and be transferred to multiple-piece holding part 11 and carry out at immersion
Reason.
Step S30：First substrate S1 passes through the immersion treatment time, and the list of hydro-peening treatment trough 20 is transferred to from soaking compartment 10
Chip hydro-peening unit 21 carries out hydro-peening processing.
In other words, first substrate S1 is placed in soaking compartment 10, and is taken out after soaking processing time.It should be noted that often
One plate base S all after the immersion treatment time, i.e., takes out from soaking compartment 10.Also, the immersion treatment time needed for different process
It is different, it also can be by the immersion treatment time appropriate according to technique scheduling of control unit 40.
In the present embodiment, due to multiple-piece holding part 11 and for rectilinear design, therefore transport carriage 30 is equally to hang down
Straight mode takes out substrate S (first substrate S1), and compared to the design of horizontal, the soak on substrate S can be greatly reduced
Residual quantity.Preferably, base plate wet processing unit 1 can more have a gas hydro-peening unit 60 (as shown in Figure 2), and it is arranged at leaching
The top of slot 10 is steeped, when taking out substrate S (first substrate S1), can spray simultaneously except the soak on substrate S, further reduce leaching
Steep the residual quantity of liquid.Gas hydro-peening unit 60 is arranged above the top of soaking compartment 10 or the cell wall of soaking compartment 10, and the present invention is simultaneously
It does not limit.
Hydro-peening treatment trough 20 has an at least one chip hydro-peening unit 21, the monolithic that the present embodiment system is disposed adjacent with two
Exemplified by formula hydro-peening unit 21, therefore hydro-peening processing can be carried out using different chemical liquids according to demand, also can be identical chemical liquids
Two one chip hydro-peening units 21, to increase the quantity of processing substrate S.Also, 21 system of one chip hydro-peening unit for single substrate S into
Row hydro-peening program, to ensure that each plate base S can be cleaned under similarity condition.One chip hydro-peening unit 21 can also be level
Formula is rectilinear, preferably can be rectilinear, and the one chip hydro-peening unit 21 of the present embodiment is a vertical one chip hydro-peening list
Member, therefore the plumbness of the soaking compartment 10 at a station can be accepted, without the state of reconvert substrate S.For example, first substrate
After the completion of S1 impregnates, the moving member 32 of transport carriage 30 drives additional circuit boards 31 to the position of first substrate S1, adjunct circuit
Plate 31 moves down to accept the first substrate S1 of plumbness.Then, additional circuit boards 31 are moved upward to original position (moving member
32 apical margin), moving member 32 drives additional circuit boards 31 and first substrate S1 to be moved to one chip hydro-peening unit 21, and with similary
Mode first substrate S1 is vertically placed in one chip hydro-peening unit 21.In short, transport carriage 30 vertically carries
Substrate S is simultaneously moved to vertical multiple-piece holding part 11 and vertical one chip hydro-peening unit 21.
Also, the one chip hydro-peening unit 21 of the present embodiment includes a spray tank 211 and an at least fluid nozzle 212, and flow
Body nozzle 212 is arranged at at least one side wall of spray tank 211, and is vertically moved by each plate base S in spray tank 211,
The each plate base S of 212 hydro-peening of fluid nozzle.In other words, when first substrate S1 (or other substrate S) is vertically movable to spray tank
In 211, the fluid nozzle 212 positioned at side wall can directly hydro-peening first substrate S1.
In other embodiments, one chip hydro-peening unit 21a also can be with horizontal, as shown in figure 8, Fig. 8 is of the invention
The schematic diagram of the hydro-peening treatment trough of another embodiment.The hydro-peening treatment trough 20a of this embodiment has the one chip hydro-peening of horizontal
Unit 21a.
Step S40：By a hydro-peening processing time, first substrate S1 is removed from one chip hydro-peening unit 21.
After hydro-peening program is carried out in spray tank 211, and continues a hydro-peening processing time, moving member 32 moves first substrate S1
It moves to spray tank 211, additional circuit boards 31 move down and accept first substrate S1, then move up, to remove first
Substrate S1.Preferably, fluid nozzle 212 may be disposed at the top of side wall, when first substrate S1 is in one chip hydro-peening unit 21
When moving vertically upward, fluid nozzle 212 more can remove overburden (such as photoresist and metal film) by first substrate S1 up to lower spray.
Meanwhile substrate S positions that hydro-peening is crossed move up, and then the effect that avoids back being stained with and scratch.
Preferably, in addition to the top of soaking compartment 10, base plate wet processing unit 1 can more have another gas hydro-peening list
Member 60 is arranged above the top of hydro-peening treatment trough 20 or the cell wall of hydro-peening treatment trough 20.In the same of taking-up first substrate S1
When spray except the chemical liquids on substrate S, further reduce the residual quantity of chemical liquids.Then, transport carriage 30 is by first substrate S1
Next program is moved to, the present embodiment system, which is moved to, is cleaned and dried unit 50.Also, control unit 40 can be according to multiple one chip hydro-peenings
When the hydro-peening processing time of unit 21 is with scheduling interval time or according to immersion treatment time and hydro-peening processing time scheduling interval
Between.Such as make and (put first substrate S1's and second substrate S2) interval time to be more than or equal to hydro-peening processing time, before ensuring
The substrate S (such as first substrate S1) in face can be completed hydro-peening in real time, and subsequent substrate S (such as second substrate S2) will not be hindered to be moved to
The sequential of hydro-peening treatment trough 20.Preferably, interval time is more than hydro-peening processing time, if but transport carriage 30 have it is multiple additional
When circuit board 31 and moving member 32 or with multiple 21 parallel processings of one chip hydro-peening unit, then interval time be smaller than being equal to spray
It washes processing time, the present invention is not intended to limit.
Step S50：Second substrate S2 passes through the immersion treatment time, continues from soaking compartment 10 and is transferred to hydro-peening treatment trough 20
One chip hydro-peening unit 21 carry out hydro-peening processing.
First, the immersion treatment time of first substrate S1 and second substrate S2 is all identical.Also, due to putting first substrate S1
And second substrate S2 is more than or equal to hydro-peening processing time in the interval time of soaking compartment 10, therefore completed when second substrate S2 impregnates
When, first substrate S1 also completed and moved to next program (being cleaned and dried unit 50) by hydro-peening.Therefore, transport carriage 30 can be direct
Second substrate S2 is clamped from soaking compartment 10, and is transferred to one chip hydro-peening unit 21, without having any obstruction.
In addition, the immersion treatment time is more than the hydro-peening time, be for make photoresist on first substrate S1 and second substrate S2 and
The design that metal film can effectively come off.After the completion of second substrate S2 hydro-peenings, also the clear of next program is moved to by transport carriage 30
Wash drying unit 50.
It is cleaned and dried unit 50 and is adjacent to one chip hydro-peening unit 21, and be cleaned and dried the cleaning that unit 50 is one chip and revolve
Turn platform, and with cleaning solution supply unit 51, a plate base S (such as first substrate S1 or second substrate S2) can be directed to every time
After bestowing cleaning solution, then in rotary manner dry substrate S.Cleaning solution can be deionized water, thereby institute on cleaning base plate S
Remaining chemical liquids.Preferably, being cleaned and dried unit 50 more may include a volatile solvent soln supply unit, to be bestowed to substrate S
One volatile solvent soln, such as isopropanol.When substrate S be tool surface texture wafer when, after bestowing deionized water, further by
Fraction of isopropanol is sprayed by volatile solvent soln supply unit, effectively to remove the moisture remained on substrate S.
Also, it can be that horizontally or vertically formula, the present embodiment system are dry with the cleaning of independently arranged horizontal to be cleaned and dried unit 50
Exemplified by dry unit 50.Fig. 9 is the hydro-peening treatment trough of another embodiment of the present invention and the schematic diagram for being cleaned and dried unit, be refer to
Shown in Fig. 9.It also can be rectilinear to be cleaned and dried unit 50b, and also may be disposed at hydro-peening treatment trough 20b, that is, it is cleaned and dried single
First 50b and one chip hydro-peening unit 21 can be the different processing units for being arranged at same groove body (hydro-peening treatment trough 20b), such as
Left side shown in Fig. 9 is the one chip hydro-peening unit 21b of hydro-peening treatment fluid, the cleaning solution supply unit that right side is hydro-peening cleaning solution
51b.Figure 10 is the hydro-peening treatment trough of another embodiment of the present invention and the schematic diagram for being cleaned and dried unit, please refers to Fig.1 0 institute
Show.One chip hydro-peening unit 21c is all horizontal with being cleaned and dried unit 50c, is arranged at same groove body (hydro-peening treatment trough
20c), and same nozzle can be used in different time course hydro-peening treatment fluid or cleaning solution or use different nozzles, to spray respectively
Wash treatment fluid, cleaning solution.And treatment fluid collector unit 22c and cleaning solution receipts are provided in the hydro-peening treatment trough 20c of the present embodiment
Collect two different units of unit 52c, receive treatment fluid, cleaning solution respectively.
Figure 11 is the schematic diagram of the base plate wet processing unit of another embodiment of the present invention, is please referred to Fig.1 shown in 1.
In the present embodiment, vertical multiple-piece holding part 11d includes multiple one chip storage tank position 111d, and one chip storage tank position 111d
And vertical one chip hydro-peening unit 21d has processing carrier A.Transport carriage 30d equally includes additional circuit boards 31d, movement
Part 32d and moving track 33d, and moving track 33d is arranged at the side wall of base plate wet processing unit 1d.Transport carriage 30d's
Additional circuit boards 31d bearing substrates S inserts one chip to carrier A is handled, by processing carrier A bearing substrates S liftings and houses
One of slot position 111d inserts vertical one chip hydro-peening unit 21d.Immersion wherein can be travelled to and fro between by single moving member 32d
Slot 10d and hydro-peening treatment trough 20d is clamped and is transferred the substrate S of the specified clamping of control unit 40.
In other embodiments, according to process requirements, multiple moving member 32d can be also set, and the present invention is not intended to limit.
In conclusion base plate wet processing unit according to the invention, including a soaking compartment, a hydro-peening treatment trough, one
Transport carriage and a control unit.Soaking compartment includes a multiple-piece holding part, and hydro-peening treatment trough is adjacent to soaking compartment.Control
Unit controls the wet processed of multiple substrates, and controls immersion of each substrate in multiple-piece holding part respectively by transport carriage
Handle sequential.Wherein, multiple substrates are placed in multiple-piece holding part, and every plate base of same process conditions passes through identical leaching respectively
After steeping processing time, then sequentially move to hydro-peening treatment trough.Since the immersion treatment time of every plate base is identical, therefore can avoid because of leaching
The bubble time is different and causes the difference of degree of cleaning, and then can improve yield.
Also, the interval time for putting first substrate and second substrate in soaking compartment is more than or equal to hydro-peening processing time, it can be true
It protects after the completion of the first substrate hydro-peening of sequence earlier above, the second substrate after sequence relatively, which begins to impregnate, to be completed.Therefore, the after sequence relatively
Two substrates can swimmingly be moved to hydro-peening treatment trough, will not be subject to hindering for the first substrate to sort earlier above.
Also, the base plate wet processing unit of the present invention, control unit can handle different technology conditions according to process requirements
Multiple substrates.The immersion treatment time needed for different technology conditions is different, can control each base respectively by control unit
The specific immersion treatment time needed for plate；And control unit is according to the immersion treatment time of each substrate and hydro-peening processing time
Scheduling interval time.
No matter the present invention shows its totally different feature in the prior art with regard to purpose, means and effect.Only it should be noted that
It is that above-mentioned many embodiment systems illustrate for convenience of description, the protection domain that the present invention is advocated certainly should be with claim institute
Subject to stating, not just the above examples.
Claims (20)
1. a kind of base plate wet processing unit, which is characterized in that including：
One control unit controls the wet processed of multiple substrates；
One soaking compartment, including a multiple-piece holding part, the wherein control unit controls each of substrate in the multiple-piece respectively
The immersion treatment sequential of holding part；
One hydro-peening treatment trough is adjacent to the soaking compartment, and with an at least one chip hydro-peening unit；And
One transport carriage transfers each of substrate between the soaking compartment and the hydro-peening treatment trough；
The wherein control unit controls the transport carriage to transfer one of those substrates first substrate to the multi-disc of the soaking compartment
Formula holding part by an interval time, transfers the second substrate in those substrates and is placed in the multiple-piece of the soaking compartment and house
Portion, the first substrate pass through the immersion treatment time, and the one chip hydro-peening list of the hydro-peening treatment trough is transferred to from the soaking compartment
Member carries out hydro-peening processing,
By a hydro-peening processing time, remove the first substrate from the one chip hydro-peening unit and the second substrate passes through the leaching
Processing time is steeped, continues from the soaking compartment and is transferred to the one chip hydro-peening unit progress hydro-peening processing of the hydro-peening treatment trough,
In the control unit according to the hydro-peening processing time scheduling interval time.
2. base plate wet processing unit as described in claim 1, which is characterized in that further include：
One is cleaned and dried unit, is adjacent to the one chip hydro-peening unit, and the wherein transport carriage is moved from the one chip hydro-peening unit
Each of substrate is sent to the cleaning-drying unit.
3. base plate wet processing unit as claimed in claim 2, which is characterized in that the cleaning-drying unit is arranged at the hydro-peening
In treatment trough, hydro-peening processing is first carried out to each of substrate and is continued to be cleaned and dried.
4. base plate wet processing unit as claimed in claim 2, which is characterized in that the cleaning-drying unit includes a cleaning solution
Supply unit and a volatile solvent soln supply unit, the cleaning-drying unit are bestowed each of substrate one cleaning solution and are waved
Hair property solution.
5. base plate wet processing unit as claimed in claim 2, which is characterized in that the multiple-piece holding part is a horizontal multi-disc
Formula holding part.
6. base plate wet processing unit as claimed in claim 2, which is characterized in that the multiple-piece holding part is a vertical multi-disc
Formula holding part.
7. base plate wet processing unit as claimed in claim 6, which is characterized in that the one chip hydro-peening unit is vertical single for one
Chip hydro-peening unit.
8. base plate wet processing unit as claimed in claim 7, which is characterized in that the one chip hydro-peening unit includes a hydro-peening
Slot and at least a fluid nozzle, the fluid nozzle are arranged at at least one side wall of the spray tank, and by each of substrate in
It is vertically moved in the spray tank, each of substrate of fluid nozzle hydro-peening.
9. base plate wet processing unit as claimed in claim 8, which is characterized in that each of substrate is in vertical in the spray tank
When directly moving up, each of substrate of fluid nozzle hydro-peening.
10. base plate wet processing unit as claimed in claim 9, which is characterized in that the soaking compartment includes a flow field control list
Member flows flow field with a drop in the vertical multiple-piece holding part and handles those substrates.
11. base plate wet processing unit as claimed in claim 7, which is characterized in that the transport carriage vertically carries each
Those substrates are simultaneously moved to the vertical multiple-piece holding part and the vertical one chip hydro-peening unit.
12. base plate wet processing unit as claimed in claim 11, which is characterized in that the transport carriage further includes a moving rail
Road is arranged at the top of the soaking compartment and the hydro-peening treatment trough.
13. base plate wet processing unit as claimed in claim 12, which is characterized in that the vertical multiple-piece holding part includes more
A one chip storage tank position, those one chip storage tank positions and the vertical one chip hydro-peening unit respectively include a processing carrier,
The transport carriage carries each of substrate to the processing carrier, carries each of substrate elevating by the processing carrier and puts
Enter one of those one chip storage tank positions or the vertical one chip hydro-peening unit.
14. base plate wet processing unit as claimed in claim 12, which is characterized in that the transport carriage includes an adjunct circuit
Plate, which moves the additional circuit boards and carries each of substrate elevating by the additional circuit boards, to insert the leaching
Steep slot or the hydro-peening treatment trough.
15. base plate wet processing unit as described in claim 1, which is characterized in that further include：
Hydro-peening unit before one immersion, is adjacent to the multiple-piece holding part, which first controls transport carriage transfer each
After hydro-peening unit carries out hydro-peening before those substrates to the immersion, then it is transferred to the multiple-piece holding part.
16. base plate wet processing unit as claimed in claim 15, which is characterized in that hydro-peening unit is arranged at this before the immersion
In soaking compartment, hydro-peening processing is first carried out to each of substrate and is continued to be transferred to multiple-piece holding part progress immersion treatment.
17. base plate wet processing unit as described in claim 1, which is characterized in that further include：
One gas hydro-peening unit is arranged at the soaking compartment or at least one of top of hydro-peening treatment trough, to each of substrate
Gas hydro-peening is carried out when removing groove body.
18. base plate wet processing unit as described in claim 1, which is characterized in that the hydro-peening treatment trough is provided with multiple be somebody's turn to do
One chip hydro-peening unit, during the hydro-peening processing time scheduling interval according to multiple one chip hydro-peening units of the control unit
Between.
19. base plate wet processing unit as described in claim 1, which is characterized in that the immersion treatment of each of substrate
Time is more than the hydro-peening processing time, and the control unit is according to the immersion treatment time and the hydro-peening processing time scheduling interval
Time.
20. base plate wet processing unit as described in claim 1, which is characterized in that the immersion treatment of each of substrate
Time is controlled respectively by the control unit, the control unit according to the immersion treatment time of each of substrate and the hydro-peening at
Manage the time scheduling interval time.
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|---|---|---|---|
| US201662420107P | 2016-11-10 | 2016-11-10 | |
| US62/420,107 | 2016-11-10 |
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| CN201721149835.9U Active CN207183227U (en) | 2016-11-10 | 2017-09-08 | Cleaning device |
| CN201710966459.0A Active CN108091591B (en) | 2016-11-10 | 2017-10-17 | Liquid processing device |
| CN201711049350.7A Withdrawn CN108074838A (en) | 2016-11-10 | 2017-10-31 | Base plate wet processing unit |
| CN201711068508.5A Active CN108074856B (en) | 2016-11-10 | 2017-11-03 | Single substrate processing apparatus |
| CN201711089961.4A Active CN108074842B (en) | 2016-11-10 | 2017-11-08 | Substrate wet processing device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710696433.9A Active CN108074858B (en) | 2016-11-10 | 2017-08-15 | Substrate wet processing device |
| CN201721149835.9U Active CN207183227U (en) | 2016-11-10 | 2017-09-08 | Cleaning device |
| CN201710966459.0A Active CN108091591B (en) | 2016-11-10 | 2017-10-17 | Liquid processing device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711068508.5A Active CN108074856B (en) | 2016-11-10 | 2017-11-03 | Single substrate processing apparatus |
| CN201711089961.4A Active CN108074842B (en) | 2016-11-10 | 2017-11-08 | Substrate wet processing device |
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| Country | Link |
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| KR (5) | KR20180052511A (en) |
| CN (6) | CN108074858B (en) |
| TW (9) | TWI645913B (en) |
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