584915 五、發明說明（1) ~~~—-—____ "" —------- 1 ·發明所屬之技術領域 本發明係關於一種流體收集裝 晶圓旋轉蝕刻清洗機台之流體收集裝置t h 一種適用於單 2.先前技術 蝕刻為製造半導體元件 然而蝕刻過程產生的廢液多 因此，如何收集甚至回收再 題0 =程中不可或缺的程序之一， 二有毒液體，必須謹慎處理。 用不同之廢液為一重要課584915 V. Description of the invention (1) ~~~ —-____ " " --------- 1 · TECHNICAL FIELD OF THE INVENTION The present invention relates to a rotary etching cleaning machine for fluid collection and mounting wafers. The fluid collection device is a type suitable for single 2. The prior art etching is used to manufacture semiconductor components. However, the waste liquid generated during the etching process is much. Therefore, how to collect or even recycle. 0 = One of the indispensable procedures in the process. Two toxic liquids must be used. Be careful. Using different waste fluids as an important lesson
第1圖為傳統早晶圓旋轉钱判 别面圖。圖中姓刻槽91中設有一^曰機圓\的广流體收集裝置之 定晶圓99,台座92下方之轉以承載及固 ，丄平』回逮旋轉及上下移動。 蝕刻液則由上方的供給系統94流下。於蝕刻槽91的壁面# 有液體泡出口，當轉轴93高速旋轉時，可將廢液離心拋$ 收集管951〜953’隔離板961〜9 63則可使欲收集的廢液集中Figure 1 is a discriminative view of traditional early wafer spinning money. In the figure, the nicked groove 91 is provided with a fixed wafer 99 of a wide-fluid collection device, and the rotation under the pedestal 92 is used for carrying and fixing. The etchant flows down from the supply system 94 above. In the wall surface of the etching tank 91 # There is a liquid bubble outlet. When the rotating shaft 93 rotates at a high speed, the waste liquid can be centrifuged and thrown. Collecting tubes 951 ~ 953 ’Isolating plates 961 ~ 9 63 can concentrate the waste liquid to be collected.
流入特定之收集管。藉由調整台座92高度，可將不同^液 經由不同高度之液體洩出口送出。此一設計之缺點在於需 上下移動台座9 2，其操控較複雜，且增加化學品滲漏的機 ^ °隔離板9 6 1〜9 6 3亦無法完全阻止廢液流向其他收集 二’容易造成交叉污染。此外，蝕刻必須在高轉速下進 行 否則無法藉由離心力將廢液拋入管中。Flow into specific collection tubes. By adjusting the height of the pedestal 92, different liquids can be sent through the liquid discharge outlets of different heights. The disadvantage of this design is that the pedestal 9 2 needs to be moved up and down, its control is more complicated, and the machine that increases the leakage of chemicals ^ ° Isolating plate 9 6 1 ~ 9 6 3 can not completely prevent the waste liquid from flowing to other collection II 'easy to cause Cross-contamination. In addition, the etching must be performed at a high speed, otherwise the waste liquid cannot be thrown into the tube by centrifugal force.
584915 五、發明說明（2) 基於上述理由，本發明人根據多年相關經驗，以積極 創新的精神，終於研發出本單晶圓旋轉蝕刻清洗機台之流 體收集裝置，以解決傳統收集裝置的問題。 3.發明内容 本發明之目的在於提供一種單晶圓旋轉蝕刻清洗機台 之流體收集裝置，可收集旋轉蝕刻槽中不同種類之流體。 為達成上述目的，本發明單晶圓旋轉蝕刻清洗機台之 流體收集裝置主要包括一旋轉蝕刻槽、一第一收集單元及 一升降機制。旋轉蝕刻槽可固定及旋轉一晶圓，使該晶圓 可於蝕刻液中進行蝕刻，該旋轉蝕刻槽之周緣並設有一流 體洩出口。第一收集單元設於該旋轉蝕刻槽壁之外緣，並 具有一徑向開口，可與旋轉蝕刻槽之流體洩出口相通，以 收集由洩出口流出之流體。升降機制連設於第一收集單 元，使第一收集單元之徑向開口之頂部可下降至洩出口之 底部。 上述之裝置可更包括一第二收集單元，設於第一收集 單元之外緣，其亦具有一徑向開口，第二收集單元亦連設 於一升降機制，使第二收集單元之徑向開口之頂部可下降 至洩出口之底部，且當第一收集單元之徑向開口之頂部下584915 V. Description of the invention (2) Based on the above reasons, the inventor finally developed a single-wafer rotary etching cleaning machine fluid collection device based on years of relevant experience and a spirit of positive innovation to solve the problem of traditional collection devices . 3. SUMMARY OF THE INVENTION The object of the present invention is to provide a fluid collection device for a single wafer rotary etching cleaning machine, which can collect different types of fluids in a rotary etching tank. To achieve the above object, the fluid collection device of the single-wafer rotary etching cleaning machine of the present invention mainly includes a rotary etching tank, a first collection unit, and a lifting mechanism. A rotary etching tank can fix and rotate a wafer, so that the wafer can be etched in an etching solution. The peripheral edge of the rotary etching tank is provided with a first-class body vent. The first collecting unit is disposed at the outer edge of the wall of the rotary etching tank and has a radial opening, which can communicate with the fluid outlet of the rotary etching tank to collect the fluid flowing out of the outlet. The lifting mechanism is connected to the first collecting unit so that the top of the radial opening of the first collecting unit can be lowered to the bottom of the drain outlet. The above device may further include a second collection unit, which is disposed on the outer edge of the first collection unit, and also has a radial opening, and the second collection unit is also connected to a lifting mechanism to make the second collection unit radial. The top of the opening can be lowered to the bottom of the drain outlet, and when the top of the radial opening of the first collection unit is below
第7頁 584915 五、發明說明（3) 降至洩出口之底部時，可使第二收集單元之徑向開口與旋 轉蝕刻槽之流體洩出口相通，以收集由洩出口流出之流 體。 上述之第二收集單元之徑向開口之頂部可延伸設置於 第一收集單元之徑向開口之頂部上方，並與第一收集單元 之徑向開口之頂部及/或旋轉蝕刻槽的外緣緊密接觸，以 防止欲收集之流體滲漏。 上述之第一收集單元及第二收集單元可為環狀，以方 便架設於圓形蝕刻槽壁外緣。 4.實施方式 本發明之内容可經由下述實施例與其相關圖式之闡述 而予揭示。 第2圖為本發明單晶圓旋轉蝕刻清洗機台的流體收集 裝置之剖面圖，主要包括圓形的旋轉蝕刻槽1 0、第一收集 槽4 0及第二收集槽5 0。旋轉蝕刻槽1 0設有一晶圓台座2 1， 晶圓台座盤2 1下方則連設一轉軸2 2，可承載及旋轉晶圓 9 9。旋轉蝕刻槽1 0上方則連接一流體供應系統3 0，可供應 去離子水及蝕刻液等，以清洗及蝕刻晶圓9 9。旋轉蝕刻槽 1 0之周緣槽壁設有流體洩出口 11，洩出口 11的底部不高於Page 7 584915 V. Description of the invention (3) When lowered to the bottom of the drain outlet, the radial opening of the second collection unit can be communicated with the fluid drain outlet of the rotary etching tank to collect the fluid flowing out of the drain outlet. The top of the radial opening of the second collecting unit may be extended above the top of the radial opening of the first collecting unit, and is close to the top of the radial opening of the first collecting unit and / or the outer edge of the rotary etching tank. Contact to prevent leakage of fluid to be collected. The above-mentioned first collection unit and second collection unit may be ring-shaped, so as to be conveniently mounted on the outer edge of the circular etching tank wall. 4. Embodiment The content of the present invention can be disclosed through the following embodiments and related drawings. FIG. 2 is a cross-sectional view of a fluid collection device of a single wafer rotary etching cleaning machine according to the present invention, which mainly includes a circular rotary etching tank 10, a first collection tank 40, and a second collection tank 50. A rotary etch bath 10 is provided with a wafer pedestal 21, and a rotary shaft 2 2 is connected below the wafer pedestal tray 2 1 to carry and rotate the wafer 9 9. Above the rotary etching bath 10, a fluid supply system 30 is connected, which can supply deionized water and etching solution to clean and etch the wafer 9 9. A fluid vent 11 is provided on the peripheral groove wall of the rotary etching tank 10, and the bottom of the vent 11 is not higher than
第8頁 584915— 五、發明說明（4) 載盤2 1 ’並與載盤2 1間以導流板2 3銜接，使流體可沿著導 流板2 3直接由'Λ出口 11流出。第一收集槽4 〇及第二收集槽 5 0並分別連設至各自的升降機（未示於圖）。 本實施例之流體洩出口 11均勻環設於旋轉蝕刻槽1 〇之 槽壁，而第一收集槽40及第二收集槽5〇亦為同心環狀。第 一收集槽4 0設於旋轉蝕刻槽1 〇的槽壁外側，並具有一徑向 開口，可與旋轉蝕刻槽1 0的流體洩出口丨丨相通，以收集由 洩出口 11流出之流體。收集槽4 0的徑向開口的頂部41及底 部4 2皆緊貼著旋轉蝕刻槽1 〇的槽壁，開口則至少可涵蓋旋 轉钱刻槽1 0的洩出口 11，使流體如钱刻廢液可完全流入第 一收集槽40中’再由管路4 5送至回收或處理設施。第二收 集槽5 0没於第一收集槽4 0之外緣，其亦具有一徑向開口， 本圖中之流體僅由第一收集槽4 〇收集，故第二收隼槽5 〇 徑向開口呈封閉狀態。 ^ 第2Α圖為第2圖中第一及第二收集槽4〇，5〇之徑向開 口之頂部4 2 ’ 5 2放大圖。為方便說明，原係緊密接合之頂 部41，51於圖中略為分離。第二收集槽5〇之徑向開口之頂 部5 1延伸至第一收集槽4 〇之徑向開口之頂部4丨上方，並與 第一收集槽40之徑向開口之頂部41及旋轉蝕刻槽丨〇的外壁 緊密接觸。其中第一收集槽4 〇之徑向開口之頂部4丨與第二 收集槽5 0之徑向開口之頂部5丨尖端接觸面呈現一角度，可 使收集槽4 0 ’ 5 0容易扣合定位及防止流體由其間之縫隙滲Page 8 584915— V. Description of the invention (4) The carrier plate 2 1 ′ is connected with the carrier plate 21 by a deflector plate 23 so that the fluid can flow out from the Λ outlet 11 directly along the deflector plate 23. The first collecting tank 40 and the second collecting tank 50 are respectively connected to respective elevators (not shown in the figure). The fluid leakage outlet 11 of this embodiment is evenly arranged on the groove wall of the rotary etching groove 10, and the first collection groove 40 and the second collection groove 50 are also concentric rings. The first collecting tank 40 is disposed outside the groove wall of the rotary etching tank 10 and has a radial opening, which can communicate with the fluid drain outlet 丨 丨 of the rotary etching tank 10 to collect the fluid flowing out of the drain outlet 11. The top 41 and bottom 42 of the radial opening of the collecting tank 40 are closely attached to the groove wall of the rotary etching tank 10, and the opening can at least cover the vent 11 of the rotary money engraving groove 10, so that the fluid is engraved as money. The liquid can flow completely into the first collection tank 40 'and then be sent to the recovery or treatment facility via line 45. The second collecting tank 50 is not outside the first collecting tank 40, and it also has a radial opening. The fluid in this figure is collected only by the first collecting tank 40, so the diameter of the second collecting tank 50 is Closed to the opening. ^ Figure 2A is an enlarged view of the top 4 2 ′ 5 2 of the radial openings of the first and second collection grooves 40, 50 in FIG. 2. For the convenience of explanation, the top portions 41, 51 of the original tight connection are slightly separated in the figure. The top 51 of the radial opening of the second collecting tank 50 extends to the top 4 丨 of the radial opening of the first collecting tank 40, and the top 41 of the radial opening of the first collecting tank 40 and the rotary etching tank The outer wall of 丨 〇 is in close contact. The top 4 of the radial opening of the first collecting groove 4 〇 and the top 5 of the radial opening of the second collecting groove 50 0 present an angle, so that the collecting groove 4 0 '50 can be easily snapped and positioned. And prevent fluid from seeping through the gap between them
第9頁 584915 五、發明說明（5) 一—-— 入〇 第3及4圖為本發明裝置於收集不同流體時之操示意 圖。第3圖中，第一收集槽4〇藉由連設之升降機降下，致 使其徑向開口之頂部41到達流體洩出口丨丨之底部。此時， 第二收集槽5 0之徑向開口與旋轉蝕刻槽丨〇之流 u 相通，則不同流體如不同的蝕刻廢液可由導流板23、洩出 二11及第一收集槽40之頂部41流入第二收集槽5〇中，再由 管路5 5送至回收或處理設施。 第4圖中’第一收集槽40及第二收集槽5〇皆藉由連設 之升降機降下，致使其第二收集槽5〇之頂部51到達流體沒 出口 11之底部。此時，流體可直接由導流板23、洩出口 i i 及第一收集槽5 0之頂部51流出。此一操作通常用於收集清 洗晶圓後的去離子水。 ，集 點收 特狀 之環 置將 裝： MK.tj 收例 體。 流元 明單 發集 本收 據之 根式 形 同 體 外流 此的 。類 U&ul il種 相同 口不 出多 洩更 與集 接收 直以 D ， 管設 其增 ，外 管向 不集要 種收需 各個視 成數町 計成元 設隔單 可分集 尚槽收 ♦ 括 包 點 優 之 明 發座 本座 現Μ 圓 發m 晶 彳之 日槽 可$。 丨刻t 施畠機 實Μ的 移之Tfsf 述t滲 上U品 需t 由卩學沐化 C少 其 化 簡 可 減 並 ft 設Page 9 584915 V. Description of the invention (5) I — — — Enter 0 Figures 3 and 4 are schematic diagrams of the operation of the device of the present invention when collecting different fluids. In Fig. 3, the first collecting tank 40 is lowered by a connected elevator so that the top 41 of the radial opening reaches the bottom of the fluid drain outlet 丨. At this time, the radial opening of the second collection tank 50 is in communication with the flow u of the rotary etching tank 丨, and different fluids such as different etching waste liquid can be discharged from the deflector 23, the second drain 11 and the first collection tank 40. The top 41 flows into the second collection tank 50 and is sent to the recovery or treatment facility through a pipeline 55. In Fig. 4, 'the first collection tank 40 and the second collection tank 50 are lowered by a connected elevator, so that the top 51 of the second collection tank 50 reaches the bottom of the fluid outlet 11. At this time, the fluid can directly flow out from the deflector 23, the drain outlet i i and the top 51 of the first collection tank 50. This operation is usually used to collect deionized water after wafer cleaning. , The collection of special features will be installed: MK.tj example. Liu Yuan Ming single issued the root of this receipt is similar to the outflow. Similar to U & ul, the same mouth does not leak more than the same mouth, and it is directly related to the collection of D, and the increase is set, and the external tube is not required to be collected. Each depends on the number of counts. Set up a separate order to collect the trough. ♦ Including the spot of the excellent hair seat of the Ming Dynasty, the current slot of the M round hair m crystal can be $.丨 Carrying out the application machine Tfsf of the transfer of the M, and t to see the U product, the t needs to be reduced by the learner C, the simplification can be reduced and the ft set
m it— —ihvm it—ihv
第ΙΟ頁 584915 五、發明說明（6) (2 )各個收集槽之間及收集槽與蝕刻槽的壁面之間可緊密 接觸，使化學品不易滲漏至其他收集槽，避免交叉污染。 (3 )即使於低速下旋轉蝕刻，亦不影響流體收集。 惟應注意的是，上述之實施例僅係本發明之較佳實施 例，其他由本發明之精神及申請專利範圍衍生之裝置亦應 屬本發明之範圍。 584915 圖式簡單說明 5.圖式簡單說明 第1圖為傳統單晶圓旋轉蝕刻機台的流體收集裝置之剖面 圖。 第2圖為本發明單晶圓旋轉蝕刻機台的流體收集裝置之剖 面圖。 第2A圖為第2圖之部分放大圖。 第3圖 為本發明裝置於收集不同流體時之操作示意圖。 第4圖 為本發明裝置於收集不同流體時之操作示意圖。 圖號說明： 10 旋轉蝕刻槽 11 流體洩出口 21 晶圓台座2 2轉轴 23 導流板 30 流體供應系統 40 第一收集槽 50 第二收集槽 41， 51 徑向開口 的頂部 42， 5 2 徑向開口的底部 45， 55 管路 91 傳統蝕刻槽 92 晶圓台座 93 轉軸 94 蝕刻液供給系 統 951 99 〜9 5 3 收集管 晶圓 961 〜9 6 3 隔離板Page 110 584915 V. Description of the invention (6) (2) Each collection tank can be in close contact with each other and between the collection tank and the wall surface of the etching tank, so that chemicals cannot easily leak to other collection tanks and avoid cross-contamination. (3) Even if the etching is performed at a low speed, the fluid collection is not affected. It should be noted that the above-mentioned embodiments are merely preferred embodiments of the present invention, and other devices derived from the spirit of the present invention and the scope of patent application should also fall within the scope of the present invention. 584915 Simple illustration of the drawing 5. Simple illustration of the drawing Figure 1 is a sectional view of a fluid collection device of a conventional single-wafer rotary etching machine. Fig. 2 is a sectional view of a fluid collection device of a single-wafer rotary etching machine according to the present invention. Figure 2A is an enlarged view of a portion of Figure 2. Figure 3 is a schematic diagram of the operation of the device of the present invention when collecting different fluids. Figure 4 is a schematic diagram of the operation of the device of the present invention when collecting different fluids. Description of drawing number: 10 Rotary etching tank 11 Fluid outlet 21 Wafer pedestal 2 2 Rotary shaft 23 Baffle 30 Fluid supply system 40 First collection tank 50 Second collection tank 41, 51 Radial opening top 42, 5 2 Radially open bottom 45, 55 Tube 91 Traditional etching tank 92 Wafer pedestal 93 Rotary shaft 94 Etching solution supply system 951 99 to 9 5 3 Collector tube wafer 961 to 9 6 3 Isolation plate
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