WO2014082402A1

WO2014082402A1 - Cleaning device for preventing liquid from splashing and cleaning system having same

Info

Publication number: WO2014082402A1
Application number: PCT/CN2013/073572
Authority: WO
Inventors: 刘效岩; 吴仪; 冯晓敏
Original assignee: 北京七星华创电子股份有限公司
Priority date: 2012-11-28
Filing date: 2013-04-01
Publication date: 2014-06-05
Also published as: CN102989705A

Abstract

The present invention relates to the technical field of semiconductor cleaning processes, and particularly relates to a cleaning device for preventing liquid from splashing and a cleaning system having the device. The cleaning device for preventing liquid from splashing comprises an upper shell and a lower shell, wherein the upper shell is movable up and down with respect to the lower shell and comprises an upper shell inner wall and an upper shell outer wall, a hollow cavity is provided between the upper shell inner wall and the upper shell outer wall, a plurality of liquid inlet holes are provided in the upper shell inner wall, and the liquid inlet holes are in communication with the hollow cavity. In the cleaning device for preventing liquid from splashing and the cleaning system having the device provided in the present invention, by means of additionally providing liquid inlet holes and a hollow cavity in the upper shell, a chemical reagent and/or particles cleaned out of the semiconductor enter the hollow cavity via the liquid inlet holes and are discharged via a liquid outlet hole during the high speed rotation of an object to be cleaned, and therefore the best cleaning effect of the cleaned object is obtained. Furthermore, the cleaning device and the cleaning system have a simple structure, such that the device and the system are easy to clean, the process is easy to achieve and the waste liquid is convenient to collect.

Description

Cleaning device for preventing liquid splashing and cleaning system having the same

Technical field

The present invention relates to the field of semiconductor cleaning processes, and in particular to a cleaning device for preventing liquid splashing and a cleaning system having the same.

Background technique

As the wafer wafer diameter increases and the feature size decreases, the cleanliness requirements for the silicon wafer surface are also increasing. Current cleaning equipment primarily achieves cleaning by spraying a cleaning fluid on the surface of a wafer that rotates at a high speed. However, during the high-speed rotation process, the cleaning liquid is pulled out by the centrifugal force and hits the side wall of the cleaning chamber. After being rebounded by the side wall of the cleaning chamber, it will splash back onto the surface of the wafer, causing the wafer to be contaminated. Preventing such pollution in time will seriously affect the cleaning effect. At present, the cleaning chamber structure is generally complicated by adding additional components in the cleaning chamber to prevent such contamination, but this will make subsequent cleaning of the cleaning chamber difficult.

Summary of the invention

(1) Technical problems to be solved

The technical problem to be solved by the present invention is to provide a cleaning device for preventing liquid splashing and a cleaning system having the same, which overcomes the inability of the existing wafer cleaning device and the cleaning system to effectively prevent chemical reagents and cleaning during high-speed rotation of the wafer. The particles smashed out on the sidewall of the upper shell and splashed back onto the surface of the wafer to cause contamination of the wafer and the structure of the wafer cleaning device was complicated and uncleanable.

(2) Technical plan

In order to solve the above technical problems, the present invention provides a cleaning device for preventing splashing of liquid, comprising an upper case and a lower case, wherein the upper case is movable up and down relative to the lower case, the upper case including an inner wall of the upper case and an outer wall of the upper case. A hollow cavity is formed between the inner wall of the upper casing and the outer wall of the upper casing, and the inner wall of the upper casing is provided with a plurality of liquid inlet holes, and the liquid inlet holes are all communicated with the hollow cavity.

Further, the upper case is coupled to the driving column for driving the upper case to move up and down relative to the lower case.

Further, when the upper case is in the high position, at least a portion of the bottom portion and the top portion of the lower case overlap.

Further, the hollow cavity has a thickness of 0.3-0.8 cm.

Further, the thickness of the inner wall of the upper case is not greater than the thickness of the outer wall of the upper case.

Further, the inlet hole is circular and has a diameter of 0.5 to 1.5 cm.

Further, the liquid inlet holes are evenly distributed along the circumferential direction of the inner wall of the upper casing.

Further, the lower casing is provided with a liquid discharging hole, and the liquid discharging hole communicates with the bottom of the hollow cavity.

The present invention also provides a cleaning system including the cleaning device for preventing splashing of liquid.

Further, the cleaning device further includes a clamping device disposed inside the cleaning device for preventing liquid splashing, the clamping device including a chuck for supporting, clamping, and driving the wafer The wafer is rotated.

(3) Beneficial effects

The cleaning device for preventing liquid splashing provided by the present invention and the cleaning system having the same can realize chemical reagents and/or cleaning during high-speed rotation of the object to be cleaned by adding a liquid inlet hole and a hollow cavity to the upper casing. The particles pass through the liquid inlet hole into the hollow cavity and are discharged through the liquid discharge hole to obtain the best cleaning effect of the object to be cleaned; and the structure of the cleaning device and the cleaning system is simple and easy to clean, the process is easy to realize, and the waste liquid is also easy to collect. .

DRAWINGS

1 is a schematic structural view of a cleaning device for preventing liquid splashing according to an embodiment of the present invention;

Figure 2 is a longitudinal cross-sectional view of a cleaning system having a cleaning device for preventing liquid splashing in Figure 1 according to a second embodiment of the present invention;

Figure 3 is a cross-sectional view of the upper case of Figure 1;

Figure 4 is a bottom plan view of the upper case of Figure 1;

Among them, 1: upper shell; 2: lower shell; 3: liquid inlet hole; 4: hollow cavity; 5: drive column; 6: wafer; 7: chuck; 8: chuck chucking unit.

detailed description

The specific embodiments of the present invention are further described in detail below with reference to the drawings and embodiments. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In the description of the present invention, it is to be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", " The orientation or positional relationship of the indications of "upright", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, only for convenience of description of the present invention and simplification. It is to be understood that the invention is not to be construed as a limitation Moreover, the terms "first", "second", "third", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components. The specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.

The wafer described in the present invention may be a silicon wafer of a pure silicon substrate or a silicon wafer with a copper interconnection structure. In the present embodiment, the high position refers to a position where the upper case 1 rises, and the low position refers to a position where the upper case 1 is lowered. When the upper casing 1 is in the high position, the top of the upper casing 1 and the top of the lower casing 2 at least partially overlap; when the upper casing 2 is in the low position, the upper casing 1 and the lower casing 2 substantially coincide.

Embodiment 1

As shown in FIG. 1 to FIG. 4, the cleaning device for preventing liquid splashing provided by the present invention comprises: an upper casing 1 and a lower casing 2; the lower casing 2 is located at a lower portion of the cleaning device, and the upper casing 1 is opposite to the lower casing. 2 moving up and down, before the cleaning process begins, the upper casing 1 moves upward relative to the lower casing 2, and the upper casing 1 is raised to protect the inner wafer 6 and prevent the splashed liquid from splashing into the cleaning device during the cleaning process. Outside; after the cleaning process is completed, the upper casing 1 moves downward relative to the lower casing 2, and the upper casing 1 is lowered to facilitate the removal of the wafer 6 therein. Specifically, the upper casing 1 is a non-solid structure, which comprises an inner wall of the upper casing and an outer wall of the upper casing, a hollow cavity is formed between the inner wall of the upper casing and the outer wall of the upper casing, and the inner wall of the upper casing is provided with a plurality of liquid inlet holes 3, each of which enters The liquid holes 3 are all communicated with the hollow cavity 4. Under the premise of ensuring the strength of the upper casing 1, the greater the number of the liquid inlet holes 3, the better, so that all the splashed liquid enters the hollow cavity through the liquid inlet hole 3. Thus, the liquid splashed during the high-speed rotation can enter the hollow cavity 4 through the liquid inlet hole 3, and the upper casing 1 is connected with the driving column 5 for driving the vertical movement of the upper casing 1 relative to the lower casing 2, Connected to the edge of the upper casing 1, the number of the driving columns 5 may be plural, and evenly distributed along the edge of the upper casing 1, preferably three (as shown in FIG. 1); the driving column 5 is a cylinder (not shown) drive.

Specifically, the inner wall of the upper shell and the outer wall of the upper shell may be a cylindrical structure or an annular structure, and the sum of the wall thicknesses of the inner wall of the upper shell and the outer wall of the upper shell may be 1.2-2 cm, and the wall thickness may be increased or decreased according to actual needs. The liquid inlet holes 3 disposed on the inner wall of the upper casing are evenly distributed according to a certain rule, such as uniformly distributed along the circumferential direction of the inner wall of the upper casing, and the inlet hole 3 is preferably circular, and the diameter thereof is 0.5-1.5 cm, of course, the liquid inlet hole The shape of 3 may also be a triangle, a square, a pentagonal star or the like; the inner wall of the upper casing is thinner to facilitate the liquid to enter the hollow cavity 4 from the liquid inlet hole 3, and the thickness of the outer wall of the upper casing may be set as the case may be, but To ensure the overall strength of the upper casing 1, the wall thickness of the inner wall of the upper casing may be set to be less than or equal to the wall thickness of the outer wall of the upper casing; the thickness of the hollow cavity 4 is 0.3-0.8 cm; the thickness of the hollow cavity 4 may also be according to the inner wall of the upper casing. The specific wall thickness of the outer wall of the upper casing is set, and on the premise of ensuring the overall strength of the upper casing 1, it is preferable to facilitate the smooth flow of the splashed liquid in the hollow cavity 4.

Further, the lower casing 2 is provided with a liquid discharging hole (not shown), and the liquid discharging hole communicates with the bottom of the hollow cavity 4. The drain hole is for discharging the liquid flowing into the bottom portion of the hollow chamber 4. The cleaning device concentrates the waste liquid generated in the cleaning process into the hollow cavity 4 and discharges through the liquid discharge hole, so that the collection of the waste liquid is simple and easy to operate.

The device for preventing liquid splashing can be used in the cleaning process of the wafer 6, and the process is as follows:

Step S1, before the start of the process, the cylinder drives the upper casing 1 to rise by the driving column 5, but it is ensured that at least a part of the bottom of the upper casing 1 and the top of the lower casing 2 overlap; the wafer 6 is placed on the chuck 7, on the chuck 7. A chuck chucking unit 8 is provided, and the chuck chucking unit 8 chucks the wafer 6.

Step S2, after the start of the process, the liquid drawn from the wafer 6 rotating at a high speed enters the hollow cavity 4 through the liquid inlet hole 3, and the liquid reflected by the hollow cavity 4 hits the liquid inlet hole 3, and then splits and breaks, preventing it from splashing again. On the surface of the wafer 6, the liquid in the hollow cavity 4 flows from the cavity 4 in the bottom of the upper casing 1 into the liquid discharge hole in the lower casing 2. And discharged through the drain hole. Throughout the entire step, the chuck 7 is rotated at a high speed, and the upper case 1 and the lower case 2 of the washing operation unit are in a stationary state.

Step S3, at the end of the process, the cylinder drives the lower casing 2 to descend through the driving column 5, and the chuck 7 is in a loose state, and the wafer 6 is released.

It should be noted that, in step S1, the upper casing 1 is raised to a high position, and at this time, the lower portion of the upper casing 1 and the upper portion of the lower casing 2 are at least partially overlapped to ensure the liquid entering the hollow cavity 4 through the liquid inlet hole 3. After flowing out from the bottom of the hollow cavity 4, it can flow into the liquid discharge hole on the lower casing 2 and be discharged through the liquid discharge hole; in step S3, the upper casing 1 is lowered to be in a low position, and the upper casing 1 and the lower casing 2 are substantially coincident. .

The cleaning device for preventing liquid splashing provided by the invention can realize that during the high-speed rotation of the wafer, the chemical reagent and/or the cleaned particles enter the hollow cavity through the liquid inlet hole by adding the liquid inlet hole and the hollow cavity on the upper shell. The liquid is discharged through the liquid discharge hole, and a small amount of liquid reflected by the hollow cavity is further split and broken after hitting the liquid inlet hole, and can not be splashed back to the surface of the wafer, thereby avoiding the splashing liquid in the cleaning process of the ordinary cleaning device. After the sidewall of the cavity rebounds to the surface of the wafer and causes contamination to the wafer, and the structure of the cleaning device is simple and easy to clean, the process is easy to implement, the waste liquid is easy to collect, and the cleaning degree of the wafer is ensured to the greatest extent.

Embodiment 2

As shown in FIG. 2, a cleaning system includes the above-mentioned cleaning device for preventing liquid splashing, the cleaning system further comprising a clamping device for holding the object to be cleaned, the clamping device being arranged to prevent liquid splashing The inside of the cleaning device and the object to be cleaned are described by taking the wafer 6 as an example. Specifically, the clamping device includes a chuck 7 for supporting, clamping, and rotating the wafer 6. The chuck 7 is provided with a chuck chucking unit 8 for chucking and releasing the wafer 6. At the beginning of the process, the upper casing 1 is at a high position, the wafer 6 is rotated at a high speed, and the chuck 7 is in a chucked state; while the process is stopped, the upper casing 1 is at a low position, the wafer 6 stops rotating, and the chuck 7 is in a loose state. In order to facilitate the release of the wafer.

The cleaning system can effectively prevent the chemical reagents and the cleaned particles from being thrown on the sidewalls of the upper shell and then splashed back onto the surface of the wafer to re-contaminate the surface of the wafer during the high-speed rotation of the wafer. The velocity of the enthalpy in the tangential direction of the rotating wafer enters the hollow cavity through the liquid inlet hole on the upper casing, and flows into the lower casing through the liquid discharge hole, and a small amount of liquid reflected by the hollow cavity penetrates the liquid inlet hole and further splits. It is broken and cannot be splashed back to the surface of the wafer, thus achieving the purpose of preventing the liquid from splashing back onto the surface of the wafer and causing contamination of the wafer. In addition, the cleaning system has a simple structure and is easy to clean, the process is easy to implement, the waste liquid is easy to collect, and the cleaning degree of the wafer is ensured to the maximum extent.

It should be noted that the cleaning device for preventing liquid splash provided by the present invention and the cleaning system having the same can be used not only for cleaning the disk and the like, but also for cleaning any object which causes liquid splash during the cleaning process. The operation process and method are the same as those of the wafer, and the same effect can be achieved.

The above is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention. It should also be considered as the scope of protection of the present invention.

Industrial applicability

Claims

Claims

What is claimed is: 1. A cleaning device for preventing splashing of liquid, comprising: an upper casing and a lower casing, wherein the upper casing is movable up and down with respect to a lower casing, the upper casing comprising an inner wall of the upper casing and an outer wall of the upper casing, the upper casing A hollow cavity is formed between the inner wall and the outer wall of the upper casing, and the inner wall of the upper casing is provided with a plurality of liquid inlet holes, and the liquid inlet holes are all communicated with the hollow cavity.

2. The apparatus for preventing splashing of liquid according to claim 1, wherein said upper casing is coupled to a driving column for driving the upper casing to move up and down relative to the lower casing.

3. A liquid splash prevention cleaning apparatus according to claim 1, wherein at least a portion of the bottom portion of the bottom case and the lower case overlap when the upper case is in the high position.

A cleaning device for preventing splashing of liquid according to claim 1, wherein said hollow cavity has a thickness of 0.3 to 0.8 cm.

A cleaning device for preventing splashing of liquid according to claim 1, wherein the thickness of the inner wall of the upper casing is not greater than the thickness of the outer wall of the upper casing.

A cleaning device for preventing splashing of liquid according to claim 1, wherein said liquid inlet hole has a circular shape and a diameter of 0.5 to 1.5 cm.

A cleaning device for preventing splashing of liquid according to claim 1, wherein said liquid inlet holes are uniformly distributed circumferentially along the inner wall of the upper casing.

The cleaning device for preventing splashing of liquid according to claim 1, wherein the lower casing is provided with a liquid discharging hole, and the liquid discharging hole communicates with the bottom of the hollow cavity.

A cleaning system comprising the liquid splash preventing cleaning device according to any one of claims 1-8.

10. The cleaning system of claim 9 further comprising a clamping device disposed within said cleaning device for preventing splashing of liquid, said clamping device comprising a chuck, Used to support, clamp the wafer and drive the wafer to rotate.