CN109817511A - A kind of silicon wafer batch cleaning and drying method and device - Google Patents
A kind of silicon wafer batch cleaning and drying method and device Download PDFInfo
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- CN109817511A CN109817511A CN201711173913.3A CN201711173913A CN109817511A CN 109817511 A CN109817511 A CN 109817511A CN 201711173913 A CN201711173913 A CN 201711173913A CN 109817511 A CN109817511 A CN 109817511A
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- silicon wafer
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Abstract
The present invention provides a kind of silicon wafer batch cleaning and drying method and device, the silicon wafer batch cleaning and drying method include at least: providing the rinse bath for being loaded with pure water first, multi-disc silicon wafer is uprightly immersed in the pure water using plummer；Then the lifting silicon wafer is moved upwards using the plummer, while is drained using water plug, decline the liquid level of the pure water；Finally when the liquid level of the pure water drops to certain position, the silicon wafer is clamped using manipulator and carries out lifting drying.The present invention declines the position of manipulator clipping silicon chip in such a way that plummer lifts carry out synchronous with the decline of pure water liquid level upwards, can shorten the time of entire lifting process in this way；In addition, filtering pure water using filter device in outer circulation when cleaning every time, particle residue is few in pure water in rinse bath, hence it is evident that promotes cleaning effect.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of silicon wafer batch cleaning and drying method and device.
Background technique
Silicon wafer in semiconductor devices production must be cleaned strictly.Micropollution also results in component failure, the mesh of cleaning
Be remove surface contamination impurity, cleaning method includes physical cleaning and chemical cleaning.These surface impurity some are with atom
State or ionic condition, some is in the form of a film or particle form is present in silicon chip surface, needs thoroughly to be removed, to guarantee half
The quality of production and yield of conductor device.
The committed step that silicon wafer surface cleaning works as entire production process, if cleaning process has flaw, it is pair that spy is standby
In the semiconductor element processing procedure with micro-structure, if particle is attached on silicon wafer, there will be pole to overall process and Si wafer quality
Big influence, and be dried, even more determine the quality of manufacturing process for cleaning.
The drying means of silicon wafer is as follows in existing cleaning machine:
1) as shown in Figure 1, silicon wafer 7 is immersed in pure water 2 using the plummer 3 in rinse bath 1 and is lifted from pure water 2
Rise；
2) as shown in Fig. 2, continuing to lift using 5 clipping silicon chip 7 of manipulator after the plummer 3 reaches upper limit position
Rise, manipulator 5 does not contact liquid level during this.
In existing this Wafer Cleaning drying mode, there are the following problems:
It 1, is entirely to be dried using pure water 2 and the tension of 7 contact surface of silicon wafer during lifting dry, lifting
Speed is slow, and drying time is long, and whole process takes around 8~12 minutes；
2, due to there is certain particle residue in the pure water 2 in slot, a part is that cleaning silicon chip 7 generates in the process, one
Part remain in when cleaning before being in rinse bath 1 (even if pure water 2 always from 1 top overflow of rinse bath, also can not be by particle
Thoroughly remove), there is certain influence to the effect of cleaning.
Therefore it provides a kind of new silicon wafer batch clearing and drying device is the project that those skilled in the art need to solve.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of silicon wafer batch cleaning-drying sides
Method and device, for solving Wafer Cleaning drying means in the prior art, pull rate is slow, drying time is long and cleaning effect not
Good problem.
In order to achieve the above objects and other related objects, the present invention provides a kind of silicon wafer batch cleaning and drying method, described
Silicon wafer batch cleaning and drying method includes at least:
1) rinse bath for being loaded with pure water is provided, multi-disc silicon wafer is uprightly immersed in the pure water using plummer；
2) plummer is moved upwards, to lift the silicon wafer, while is drained using water plug, makes the pure water
Liquid level decline；
3) when the liquid level of the pure water drops to certain position, the silicon wafer is clamped using manipulator and carries out lifting drying.
The scheme of a kind of optimization as silicon wafer batch cleaning and drying method of the present invention, using filter device to the step
2) pure water that water plug is discharged in is filtered, filtered described pure to filter out the impurity in the pure water
Water is re-injected in the rinse bath and is recycled.
A kind of scheme of optimization as silicon wafer batch cleaning and drying method of the present invention, in the step 2), the carrying
The velocity interval that platform moves upwards is 0.5~1mm/s.
The scheme of a kind of optimization as silicon wafer batch cleaning and drying method of the present invention, in the step 3), using described
It is 0.5~2mm/s that manipulator, which carries out the dry velocity interval of lifting,.
The scheme of a kind of optimization as silicon wafer batch cleaning and drying method of the present invention, in the step 3), when described pure
The liquid level of water drops to when exposing the silicon wafer, clamps the silicon wafer using manipulator and carries out lifting drying.
A kind of scheme of optimization as silicon wafer batch cleaning and drying method of the present invention, the temperature range of the pure water are 23
DEG C~25 DEG C.
The present invention also provides a kind of silicon wafer batch clearing and drying device, the silicon wafer batch clearing and drying device is at least wrapped
It includes: rinse bath, plummer, water plug and manipulator equipped with pure water；
The silicon wafer for being uprightly immersed in the pure water and being moved upwards the lifting silicon wafer by the plummer；
The water plug is connected to the rinse bath, for the pure water to be discharged, declines the pure water liquid level；
To carry out lifting dry for clamping the silicon wafer when the liquid level of the pure water drops to certain position for the manipulator
It is dry.
A kind of scheme of optimization as silicon wafer batch clearing and drying device of the present invention, the silicon wafer batch are cleaned and dried dress
Setting further includes filter device, and described filter device one end is connected with the water plug, the other end is connected with the rinse bath.
A kind of scheme of optimization as silicon wafer batch clearing and drying device of the present invention, the water plug and the cleaning
The bottom of slot is connected to.
A kind of scheme of optimization as silicon wafer batch clearing and drying device of the present invention, the manipulator are used for when described pure
The liquid level of water, which drops to, to be clamped the silicon wafer and carries out lifting drying when exposing the silicon wafer.
As described above, silicon wafer batch cleaning and drying method of the invention and device, have the advantages that
1, in such a way that silicon wafer cushion cap lifts carry out synchronous with the decline of pure water liquid level upwards, the synchronous drop of the liquid level of pure water
It is low, the corresponding decline in the clamping position of manipulator can be made, and then the time of entire lifting process can be shortened；
2, drying process is dried merely with the surface tension of pure water, does not use any chemicals, environmental-friendly.
3, process is lifted every time and the pure water in rinse bath is subjected to outer circulation filtering, it is possible to reduce in rinse bath in pure water
Particle, after particle is reduced in pure water, water quality is improved, and can effectively improve the cleaning effect of silicon wafer.
Detailed description of the invention
Fig. 1 is that silicon wafer is immersed in structural schematic diagram in pure water using plummer.
Fig. 2 is to carry out the dry schematic diagram of lifting using manipulator clipping silicon chip in the prior art.
Fig. 3 is silicon wafer batch clearing and drying device schematic diagram of the present invention.
Component label instructions
1 rinse bath
2 pure water
3 plummers
4 water plugs
5 manipulators
6 filter devices
7 silicon wafers
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Please refer to attached drawing.It should be noted that only the invention is illustrated in a schematic way for diagram provided in the present embodiment
Basic conception, only shown in schema then with related component in the present invention rather than component count, shape when according to actual implementation
Shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its component cloth
Office's kenel may also be increasingly complex.
The present invention provides a kind of silicon wafer batch cleaning and drying method, and the silicon wafer batch cleaning and drying method includes at least such as
Lower step:
Step 1) is first carried out, is loaded with the rinse bath 1 of pure water 2 as shown in Figure 1, providing, using plummer 3 by multi-disc silicon
Piece 7 is uprightly immersed in the pure water 2.
It is provided with water filling port on the rinse bath 1, for injecting required pure water 2 into the rinse bath 1.It is described clear
The depth of infused pure water 2 is greater than the diameter of silicon wafer 7 to be cleaned in washing trough 1, it is preferable that fills pure water in the rinse bath 1.
The plummer 3 has multiple inserted slots, places multi-disc silicon wafer 7 convenient for upright simultaneously, carries out batch cleaning-drying.
As an example, the temperature range of the pure water 2 is arranged within the scope of 23 DEG C~25 DEG C.It is described to state in the present embodiment
The temperature of pure water 2 is preferably provided at 25 DEG C of room temperature.
Then step 2) is executed, as shown in figure 3, the plummer 3 is moved upwards, to lift the silicon wafer 7, while benefit
It is drained with water plug 4, declines the liquid level of the pure water 2.
The plummer 3 can be with external lifting motor (not illustrated), under the driving of the motor, the carrying
Platform 3 moves upwards, so that the silicon wafer 7 be driven to lift upwards.While lifting silicon wafer 7 upwards, the liquid of the pure water 2
The past decline in face position.
As an example, the velocity interval that the plummer 3 moves upwards is 0.5~1mm/s, for example, it may be 0.5mm/
S, 0.6mm/s, 0.8mm/s, 1mm/s etc..In the present embodiment, the speed that the plummer 3 moves upwards is 0.8mm/s.
As an example, the water plug 4 is suction pump, the pure water 2 is extracted out from rinse bath 1 using suction pump,
Realize the purpose of 2 liquid level of the pure water decline.
Further, the water plug 4 is connected by a pipeline with the water outlet of 1 bottom of rinse bath, to take out
Pure water 2 in the rinse bath 1 out.
In this step, for the pure water 2 that the water plug 4 is released, it can use 6 pairs of filter device pumpings
The pure water 2 out is filtered, and to filter out the impurity in the pure water 2, the filtered pure water 2 can be re-injected
It is recycled in the rinse bath 1.In this way, it is possible to reduce the impurity particle in the rinse bath 1 in pure water 2 improves water quality, from
And effectively improve the cleaning effect of silicon wafer 7.
As shown in figure 3, described 6 one end of filter device is connected with the water plug 4, the other end and 1 phase of rinse bath
Even, the purpose of filtering pure water 2 may be implemented.
Step 3) is finally executed, as shown in figure 3, the liquid level when the pure water 2 drops to certain position, utilizes manipulator 5
It clamps the silicon wafer 7 and carries out lifting drying.
As an example, clamping institute using manipulator 5 when the liquid level of the pure water 2 drops to and exposes the silicon wafer 7
It states silicon 7 and carries out lifting drying.
Manipulator 5 is required to be not exposed to pure water 2 when clamping the silicon wafer 7 in principle, it is preferable that when silicon wafer 7 is completely de-
It is clamped when from pure water 2, it is contemplated that liquid level decline is synchronous progress with the clamping of manipulator 5, in fact, manipulator 5 presss from both sides
Taking movement should be that silicon wafer 7 will go out the progress of water surface when completely.
The pull rate of the manipulator 5 should be slightly larger than the upward movement velocity of the plummer 3.As an example, sharp
Carrying out the dry velocity interval of lifting with the manipulator 5 is 0.5~2mm/s, for example, it may be 0.5mm/s, 0.8mm/s,
1mm/s, 1.2mm/s, 1.5mm/s, 1.8mm/s, 2mm/s etc..In the present embodiment, it is dry that lifting is carried out using the manipulator 5
Dry velocity interval is 1mm/s.
When silicon wafer 7 is completely exposed the water surface, and is lifted upwards at the appropriate speed by the manipulator 5 clamping, Ke Yili
7 surface of silicon wafer is dried with the interaction on the tension on 2 surface of pure water and 7 surface of silicon wafer, do not need using it is any its
His chemicals, does not impact environment.
Silicon wafer batch cleaning and drying method of the invention include but is not limited to be useful in the silicon wafer of 300mm batch cleaning it is dry
It is dry.
Since 2 liquid level of pure water declines, compared with the prior art, silicon wafer 7 exposes the time advance of liquid level, in this way, mechanical
The clamping position of hand 5 can correspond to decline, and then can shorten the time of entire lifting process.
In addition, the present invention also provides a kind of silicon wafer batch clearing and drying device, the method that above-mentioned cleaning-drying may be implemented,
As shown in figure 3, described device includes at least: rinse bath 1, plummer 3, water plug 4 and manipulator 5 equipped with pure water 2.
The silicon wafer 7 for being uprightly immersed in the pure water 2 and being moved upwards the lifting silicon wafer by the plummer 3
7；
The water plug 4 is connected to the rinse bath 1, for the pure water 2 to be discharged, is made under 2 liquid level of pure water
Drop；
The manipulator 5 is lifted for clamping the silicon wafer 7 when the liquid level of the pure water 2 drops to certain position
It is dry.
As an example, the silicon wafer batch clearing and drying device further includes filter device 6, described 6 one end of filter device with
The water plug 4 is connected, the other end is connected with the rinse bath 1.It can be to the locating pure water 2 of extraction using filter device 6
It is filtered, to filter out the impurity in the pure water 2, the filtered pure water 2 can be re-injected in the rinse bath 1
It recycles.In this way, it is possible to reduce the impurity particle in the rinse bath 1 in pure water 2 improves water quality, to effectively improve silicon
The cleaning effect of piece 7.
As an example, the water plug 4 is connected to the bottom of the rinse bath 1, convenient for extracting pure water 2, make described pure
The liquid level of water 2 declines.
As an example, the manipulator 5 is used for the clamping when the liquid level of the pure water 2 drops to the silicon wafer 7 exposure
The silicon wafer 7 carries out lifting drying.The manipulator requires not being stained with pure water 2, and the manipulator 5 lifts silicon wafer 7 upwards
Speed should be slightly bigger than the upward speed of the plummer 3, in this way, manipulator 5 can be smoothly from clipping silicon chip 7 on plummer 3
And it lifts upwards.
In conclusion the present invention provides a kind of silicon wafer batch cleaning and drying method and device, the silicon wafer batch cleans dry
Drying method includes at least: providing be loaded with the rinse bath of pure water first, be uprightly immersed in multi-disc silicon wafer using plummer described
In pure water；Then the plummer moves upwards the lifting silicon wafer, while being drained using water plug, makes the liquid of the pure water
Face decline；Finally when the liquid level of the pure water drops to certain position, the silicon wafer is clamped using manipulator and carries out lifting drying.
The present invention is in such a way that plummer lifts carry out synchronous with the decline of pure water liquid level upwards, under the position for making manipulator clipping silicon chip
Drop can shorten the time of entire lifting process in this way；In addition, utilizing filter device filtered pure in outer circulation when cleaning every time
Water, particle residue is few in pure water in rinse bath, hence it is evident that promotes cleaning effect.
So the present invention effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of silicon wafer batch cleaning and drying method, which is characterized in that the silicon wafer batch cleaning and drying method includes at least:
1) rinse bath for being loaded with pure water is provided, multi-disc silicon wafer is uprightly immersed in the pure water using plummer；
2) plummer is moved upwards, to lift the silicon wafer, while is drained using water plug, makes the liquid of the pure water
Face decline；
3) when the liquid level of the pure water drops to certain position, the silicon wafer is clamped using manipulator and carries out lifting drying.
2. silicon wafer batch cleaning and drying method according to claim 1, it is characterised in that: using filter device to the step
It is rapid 2) in the pure water that is discharged of water plug be filtered, it is filtered described to filter out the impurity in the pure water
Pure water is re-injected in the rinse bath and is recycled.
3. silicon wafer batch cleaning and drying method according to claim 1, it is characterised in that: described to hold in the step 2)
The velocity interval that microscope carrier moves upwards is 0.5~1mm/s.
4. silicon wafer batch cleaning and drying method according to claim 1, it is characterised in that: in the step 3), utilize institute
Stating manipulator and carrying out the dry velocity interval of lifting is 0.5~2mm/s.
5. silicon wafer batch cleaning and drying method according to claim 1, it is characterised in that: in the step 3), when described
When the liquid level of pure water is dropped to silicon wafer exposure, the silicon wafer is clamped using manipulator and carries out lifting drying.
6. silicon wafer batch cleaning and drying method according to claim 1, it is characterised in that: the temperature range of the pure water is
23 DEG C~25 DEG C.
7. a kind of silicon wafer batch clearing and drying device, which is characterized in that the silicon wafer batch clearing and drying device includes at least: dress
There are rinse bath, plummer, water plug and the manipulator of pure water；
The silicon wafer for being uprightly immersed in the pure water and being moved upwards the lifting silicon wafer by the plummer；
The water plug is connected to the rinse bath, for the pure water to be discharged, declines the pure water liquid level；
The manipulator carries out lifting drying for clamping the silicon wafer when the liquid level of the pure water drops to certain position.
8. silicon wafer batch clearing and drying device according to claim 7, it is characterised in that: the silicon wafer batch is cleaned and dried
Device further includes filter device, and described filter device one end is connected with the water plug, the other end is connected with the rinse bath.
9. silicon wafer batch clearing and drying device according to claim 7, it is characterised in that: the water plug and described clear
The bottom of washing trough is connected to.
10. silicon wafer batch clearing and drying device according to claim 7, it is characterised in that: the manipulator is for working as institute
It states when the liquid level of pure water drops to silicon wafer exposure and clamps the silicon wafer and carry out lifting drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711173913.3A CN109817511A (en) | 2017-11-22 | 2017-11-22 | A kind of silicon wafer batch cleaning and drying method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711173913.3A CN109817511A (en) | 2017-11-22 | 2017-11-22 | A kind of silicon wafer batch cleaning and drying method and device |
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| CN109817511A true CN109817511A (en) | 2019-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711173913.3A Pending CN109817511A (en) | 2017-11-22 | 2017-11-22 | A kind of silicon wafer batch cleaning and drying method and device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN113714187A (en) * | 2021-08-31 | 2021-11-30 | 通威太阳能（安徽）有限公司 | Method and device for controlling cleaning quality of silicon wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1434490A (en) * | 2002-01-22 | 2003-08-06 | 东邦化成株式会社 | Substrate drying method and device thereof |
| CN201543634U (en) * | 2009-09-11 | 2010-08-11 | 常州捷佳创精密机械有限公司 | Dehydrating and lifting device of workpiece cleaning device |
| CN202438485U (en) * | 2011-12-31 | 2012-09-19 | 英利能源（中国）有限公司 | Silicon wafer cleaning system capable of reusing water resource and cleaning slot of same |
| CN105195465A (en) * | 2015-09-21 | 2015-12-30 | 同济大学 | Fully-automatic optical element cleaning device with ultrasonic-megasonic composite frequency |
-
2017
- 2017-11-22 CN CN201711173913.3A patent/CN109817511A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1434490A (en) * | 2002-01-22 | 2003-08-06 | 东邦化成株式会社 | Substrate drying method and device thereof |
| CN201543634U (en) * | 2009-09-11 | 2010-08-11 | 常州捷佳创精密机械有限公司 | Dehydrating and lifting device of workpiece cleaning device |
| CN202438485U (en) * | 2011-12-31 | 2012-09-19 | 英利能源（中国）有限公司 | Silicon wafer cleaning system capable of reusing water resource and cleaning slot of same |
| CN105195465A (en) * | 2015-09-21 | 2015-12-30 | 同济大学 | Fully-automatic optical element cleaning device with ultrasonic-megasonic composite frequency |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN113714187A (en) * | 2021-08-31 | 2021-11-30 | 通威太阳能（安徽）有限公司 | Method and device for controlling cleaning quality of silicon wafer |
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Application publication date: 20190528 |