JP2005045005A - Wet processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing method for processing the substrate wafer by wafer, by rotating the surface of substrate by inserting it with the upside down into the chemical processing vessel. <P>SOLUTION: A wafer 101 is fixed with the front surface located in the lower side, with a clamp PIN 107 with a clamp 106 for expanding and compressing the width of the wafer 101. Moreover, the clamp 106 is connected to a wafer clamp control spring 108 and a clamp control magnet 104 housed within an expansion and compression function unit 105, and is then driven with the repulsive effect of a clamp control electromagnet 103 and clamp control magnet 104. The expansion and compression function unit is connected to a spindle motor 102, and the wafer 101 is rotated when the spindle motor 102 is rotated. The wafer 101 fixed and rotated is soaked into the chemical (processing solution) 116 which is supplied from a chemical supplying port 114 to fill a chemical processing vessel 113 with the chemical 116, and overflows therefrom. As a result, the wafer 101 can be wet processed wafer by wafer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate wet etching method or a wet processing method.

  An electronic component, specifically, a semiconductor device or a substrate or wafer wet processing apparatus is an apparatus used for wet etching processing and cleaning processing of a substrate.

  As a conventional substrate wet processing apparatus, there is an apparatus that performs wet etching by bringing a substrate surface into contact with a liquid surface of a chemical processing tank (see, for example, Patent Document 1).

  FIG. 8 shows a conventional substrate wet processing apparatus described in Patent Document 1. In FIG.

In FIG. 8, a wafer 801 is adsorbed by a wafer fixing vacuum chuck 806 and fixed and wet-processed so as to be in contact with the liquid surface of a chemical processing tank 813 filled with a chemical 816 (processing liquid). Also, a function of supplying a chemical liquid (processing liquid) 816 from the chemical liquid supply port 814 and causing the chemical liquid processing tank 813 to overflow, while rotating the stirring spring 815 to uniformly spread the fresh chemical liquid (processing liquid) 816 to the surface of the wafer 801. Had.
JP-A-4-17334

  However, the conventional configuration requires a stirring spring for performing a uniform wet treatment on the substrate surface.

  Moreover, it was necessary to arrange | position so that a board | substrate might contact the wet process liquid surface. Further, due to the above-described problem, there is a possibility that the chemical solution overflowed from the chemical solution treatment tank will flow to the back surface of the substrate, and the chemical solution may be sucked from the substrate fixing vacuum chuck and the substrate cannot be fixed.

  Moreover, when the substrate is lifted from the liquid surface after the wet processing is completed, there is a problem that contaminants in the chemical processing tank may adhere to the substrate surface.

  The wet processing method according to the present invention is characterized in that the substrate is wet-processed in a single wafer by rotating the substrate surface in a chemical solution processing tank downward.

  In addition, the wet processing method of the present invention may have a function of pulling up the substrate while discharging the chemical solution from the nozzle provided on the side of the chemical solution treatment tank to the central portion of the upper surface of the substrate after the wet treatment in the chemical solution treatment tank is completed. preferable.

  In the wet processing method of the present invention, the unit having the function of rotating the clamp is turned upside down to perform the processing in the chemical processing tank with the substrate surface facing downward, and the substrate is dried upward. Is more preferable.

  In addition, it is more preferable that the wet processing method of this invention is equipped with the mechanism in which a continuous part process can be carried out until another processing tank and drying by moving the unit which has the function to rotate a clamp.

  As described above, the front and back surfaces of the substrate can be wet-processed simultaneously in a single-wafer type chemical bath by rotating the wafer surface fixed with a clamp that can expand and contract the width downward into the chemical treatment bath. It is.

  Further, the substrate can be processed while the processing solution is kept at various temperatures.

  Further, by rotating the substrate during the chemical treatment, the substrate surface can be uniformly wet-treated without using a stirring spring in the chemical treatment tank.

  Further, when the substrate is lifted from the processing tank, the substrate is lifted while keeping the back and front surfaces of the wafer clean by applying a processing liquid or a rinsing liquid from the side of the processing tank, and the next processing can be performed.

  In addition, by moving the unit with the function of rotating the clamp upside down, wet processing is performed in the chemical processing tank with the substrate surface facing downward, and the wafer is switched by the function of performing drying processing with the substrate facing upward. It can be performed from wet processing to drying of the substrate.

  Moreover, by moving the unit having the function of rotating the clamp, it is possible to move and perform continuous partial processing without changing the substrate until another processing tank and drying.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic view of an apparatus used for a substrate wet processing method according to a first embodiment of the present invention. In FIG. 1, the same components as those in FIG.

  In FIG. 1, the surface of the wafer 101 is fixed downward with a clamp PIN 107 by a clamp 106 that can expand and contract its width. The clamp 106 is connected to a wafer clamp control spring 108 and a clamp control magnet 104 housed in the expansion / contraction function unit 105, and is driven by the repulsive action of the clamp control electromagnet 103 and the clamp control magnet 104. The telescopic function unit is connected to the spindle motor 102 and rotates the wafer 101 by rotating the spindle motor 102.

  The wafer 101 fixed and rotated by this configuration is supplied with a chemical liquid (processing liquid) 116 from the chemical liquid supply port 114 to fill the chemical liquid processing tank 113 and into the overflowed chemical liquid (processing liquid) 116. The wafer 101 can be wet processed in a single wafer mode.

  In the present embodiment, the ultrasonic transducer 117 is provided to perform ultrasonic processing, but may be omitted if not used.

  The spindle motor 102 is preferably fixed by a robot or a rail and pulley or a linear motor.

  Next, a first processing means using the substrate wet processing apparatus in the first embodiment will be described with reference to FIG.

  In FIG. 2, the same components as those in FIG.

  In FIG. 2A, after the wet process in the chemical solution processing tank 213 is completed, the wafer 201 is discharged from the wafer lifting rinse nozzle 209 provided beside the chemical solution processing tank 213 to the center of the upper surface of the wafer 201. By pulling up while rotating at a slow speed, it prevents the reattachment of contaminants to the upper surface (back surface) of the wafer as shown in FIG. 2 (a) and the lower surface (front surface) as shown in FIG. 2 (b), Further, it is possible to prevent the wafer front and back surfaces from being dried.

  Next, FIG. 3 shows a diagram of a second processing means using the substrate wet processing apparatus in the first embodiment.

  3, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 3A, after the processing in the chemical solution processing tank is completed, the wafer 301 is moved onto the spin drying cup 318 and moved upside down together with the wafer 301 and the clamp 306, and then the spin drying cup 318 is moved. Let

  In FIG. 3B, the wafer 301 can be rotated with the surface thereof facing upward by rotating the wafer 301 while exhausting and draining from the exhaust / drain groove 310.

  In the present embodiment, the chemical treatment of the wafer can also be performed by applying a rinse liquid to the surface of the wafer 301 from the wafer surface rinse nozzle 311 before the wafer 301 is spin-dried.

  In the present embodiment, in order to rinse the back surface of the wafer 301, a rinse is sprayed from the inside of the spin drying cup 318 to the center of the wafer, or the spindle motor 302, the clamp control electromagnet 303, the clamp control magnet 304, and the telescopic function unit. The inside of the part 305 may have a hollow structure, and a structure in which rinsing is sprayed on the center of the wafer.

  Next, a third processing unit using the substrate wet processing apparatus in the first embodiment will be described with reference to FIGS.

  4 and 5, the same components as those in FIGS. 1, 2, and 3 are denoted by the same reference numerals and description thereof is omitted.

  In FIG. 4A, the wafer 401 is received and the wafer 401 is fixed.

  In FIG. 4B, the unit of the wafer 401 and the clamp 406 is integrally turned upside down so that the wafer surface faces downward.

  In FIG. 4C, the unit of the wafer 401 and the clamp 406 is moved integrally to the upper part of the chemical solution processing tank 413.

  In FIG. 4D, the unit of the wafer 401 and the clamp 406 is lowered integrally, and the wafer 401 is immersed in the chemical solution (treatment liquid) 416 in the chemical treatment tank 413. At this time, the spindle motor 402 is slowly rotated to perform wet processing on the wafer 401.

  In FIG. 4 (e), after the wet processing in the chemical solution processing tank 413 is completed, the wafer 401 is discharged from the wafer lifting rinse nozzle 409 provided on the side of the chemical solution processing tank 413 to the center of the upper surface of the wafer 401. By pulling up while rotating at a very low speed, re-adhesion of contaminants to the upper surface (back surface) and lower surface (front surface) of the wafer is prevented, and drying of the wafer surface and back surface is prevented.

  4F, after the wet process in the chemical solution processing tank 413 in FIG. 4E is completed, the wafer 401 is moved onto the spin drying cup 418 and moved upside down together with the wafer 401 and the clamp 406.

  4 (f) and 4 (g), the spin drying cup 418 is moved, and the wafer 401 is rotated while exhausting and draining from the exhaust / drain groove 410, so that the surface of the wafer 401 faces upward. Dry.

  In the present embodiment, the chemical treatment of the wafer can be performed by applying a rinse liquid to the surface of the wafer 401 from the wafer surface rinse nozzle 411 before the wafer 401 is spin-dried.

  FIG. 5 shows a substrate wet processing apparatus arranged to perform a series of operations from FIG. 4 (a) to FIG. 4 (g).

  The wafer 501 is delivered to the clamp 506 by the wafer delivery unit 519. The clamp 506 to which the wafer is fixed moves to the wafer inversion unit 520 and performs upside down while the wafer 501 and the clamp 506 are integrated.

  Thereafter, the wafer moves to the wafer processing tank A521, wafer processing tank B522, and wafer processing tank C523 while moving to the wafer inversion and spin drying unit 524. The wafer 501 and the clamp 506 are integrally turned upside down, and spin drying is performed.

  Thereafter, the wafer is transferred to the wafer delivery unit 519 and the wafer 501 is transferred to the outside of the apparatus.

  By moving the unit having the function of fixing and rotating the wafer 501 in this way, it is possible to provide a mechanism capable of moving and continuously processing parts without changing the wafer 501 until another processing tank and drying. . The number of units equipped with the wafer clamps 506 can be increased to an arbitrary number, and a plurality of wafers 501 can be processed simultaneously.

(Second Embodiment)
FIG. 6 is a side view of the wafer clamp unit of the substrate wet processing apparatus according to the second embodiment of the present invention.

  FIG. 7 is a bird's-eye view of the substrate wet processing apparatus according to the second embodiment of the present invention.

  6 and 7, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  6A and 7A, the clamp control magnet 604 coupled to the wafer clamp control spring 608 is driven by the repulsive action of the clamp control electromagnet 603, and the motion is transmitted to the pantograph-like clamp 606. Accordingly, the distance between the clamp 606 and the clamp PIN 607 can be expanded and contracted, and the spindle motor 602 provided with the expansion / contraction function unit 605 capable of fixing the wafer 601 is rotated, thereby securely fixing the wafer 601. Rotation processing can be performed.

  In FIG. 6B and FIG. 7B, a repulsive action is generated between the clamp control magnet by the magnetic force generated by passing a current through the clamp control electromagnet 603 and the wafer clamp control spring 608 is pressed and shrunk. The width between 606 can be widened to open the wafer 601.

Schematic of the substrate wet processing apparatus in the first embodiment of the present invention The figure of the 1st process means using the wet processing apparatus of the board | substrate as described in the 1st Embodiment of this invention The figure of the 2nd process means using the wet processing apparatus of the board | substrate as described in the 1st Embodiment of this invention The figure of the 3rd process means using the wet processing apparatus of the board | substrate as described in the 1st Embodiment of this invention The figure of the 3rd process means using the wet processing apparatus of the board | substrate described in the 1st Embodiment of this invention. The figure of the processing means using the wet processing apparatus in the 2nd Embodiment of this invention The figure of the processing apparatus using the substrate wet processing apparatus of Claim 1 in the 2nd Embodiment of this invention Overall schematic diagram of conventional substrate wet processing equipment

Explanation of symbols

101 Wafer 102 Spindle Motor 103 Clamp Control Electromagnet 104 Clamp Control Magnet 105 Telescopic Function Unit Unit 106 Clamp 107 Clamp PIN
108 Wafer clamp control spring 113 Chemical solution treatment tank 114 Chemical solution supply port 116 Chemical solution (treatment solution)
117 Ultrasonic vibrator 209 Rinsing nozzle for raising wafer 210 Exhaust / drain groove 211 Wafer surface rinsing 318 Spin drying cup 519 Wafer delivery unit 520 Wafer reversing unit 521 Wafer processing tank 1
522 Wafer processing tank 2
523 Wafer Processing Tank 3
524 Wafer Inversion and Spin Drying Unit

Claims (4)

A wet processing method characterized in that the substrate is wet processed in a single-wafer type by turning the substrate surface downward into a chemical processing tank and rotating it. The wet processing apparatus according to claim 1,
A wet processing method comprising a function of pulling up the substrate while discharging the chemical solution to a central portion of the upper surface of the substrate from a nozzle provided on the side of the chemical solution treatment vessel after the wet treatment in the chemical solution treatment tank is completed. The wet processing method according to claim 1,
A wet process characterized in that a unit having a function of rotating a clamp is turned upside down to perform processing in the chemical processing tank with the substrate surface facing downward, and the substrate is dried upward. Method. The wet processing method according to claim 1,
A wet processing method characterized by comprising a mechanism capable of continuous continuous processing until another processing tank and drying by moving a unit having a function of rotating the clamp.

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