JP2014159020A - Washing device, and processing apparatus with washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a washing device not required to rotate a wafer in high speed, and a processing apparatus with the washing device.SOLUTION: A washing device 1 for washing a work piece, includes a washing table 10 holding the work piece on a holding surface 11a, and configured to be inverted upside down by rotation shafts 14, 15 extending parallel to the holding surface 11a and in a diameter direction of the holding surface 11a; and washing means 20 arranged below the washing table 10 to face the work piece held on the holding surface 11a facing downward, and washing the work piece by ejecting washing liquid.

Description

  The present invention relates to a cleaning device that holds and cleans a workpiece on a table, and a processing device that includes the cleaning device.

  A semiconductor wafer (hereinafter simply referred to as “wafer”) in which devices such as IC and LSI are formed in each of the regions partitioned by a plurality of division lines formed in a lattice pattern on the front surface is referred to as a back surface by a grinding device or the like. After being ground to a desired thickness, it is divided into individual devices along the line to be divided by a dicing machine or the like, and the divided devices are widely used in various electric devices such as mobile phones and personal computers. . In order to improve device productivity, the diameter of wafers tends to be increased to 200 mm, 300 mm, and even 450 mm, so processing devices such as dicing machines and grinding machines corresponding to the wafer diameter are required. ing. Further, in such processing, since it is necessary to clean the wafer immediately after processing, a cleaning device for cleaning the wafer has been proposed (for example, see Patent Document 1).

JP 2008-80180 A

  Such a cleaning apparatus performs cleaning while rotating the table at a high speed by a vertical rotation shaft in a state where the table holding the wafer is placed on the holding surface. In this case, the rotational speed of the table is about 1000 to 3000 rpm. When the diameter of the table becomes 450 mm as the diameter of the wafer increases, the table becomes very heavy compared to a table with a diameter of up to 300 mm. Therefore, a high output motor is required to implement the above rotation speed. The cost is very high. In particular, at the outer peripheral portion of the table, the peripheral speed during rotation becomes very high, so that sufficient consideration in terms of safety is required, and the cost for that is also required.

  The present invention has been made in view of the above, and an object of the present invention is to provide a cleaning device that does not require high-speed rotation of a wafer and a processing device including the cleaning device.

  In order to solve the above-described problems and achieve the object, the cleaning device of the present invention is a cleaning device for cleaning a workpiece, which holds the workpiece on a holding surface, is parallel to the holding surface and holds the workpiece. A cleaning table that can be turned upside down by a rotating shaft that extends in the diameter direction of the surface, and a work piece that is disposed below the cleaning table and held on a holding surface facing downward, and jets cleaning liquid And a cleaning means for cleaning the workpiece.

  Further, in the above cleaning apparatus, the cleaning means holds the water curtain nozzle having a spout for ejecting the cleaning liquid in a range exceeding the diameter of the workpiece, and the water curtain nozzle on the holding surface of the cleaning table directed downward. It is preferable to include a moving unit that moves the jet outlet in parallel with the surface of the processed workpiece.

  In order to solve the above-described problems and achieve the object, the processing apparatus of the present invention processes a chuck table that holds a workpiece on a holding surface, and a workpiece that is held on the holding surface of the chuck table. And a cleaning device, and a transport device for transporting a workpiece processed by the processing device from the chuck table to the cleaning device.

  According to the cleaning apparatus of the present invention, since the workpiece is cleaned in a state where the workpiece is held on the holding surface of the cleaning table directed downward, it is not necessary to rotate the workpiece at a high speed. Play. In addition, a high output and expensive motor for rotating the cleaning table, which becomes very heavy when the diameter is large, is not required, so that the cost can be reduced.

FIG. 1 is a diagram illustrating a schematic configuration example of the cleaning apparatus according to the first embodiment. FIG. 2 is a plan view of the cleaning apparatus shown in FIG. 3 is a cross-sectional view taken along the line AA of the cleaning device shown in FIG. 4 is a cross-sectional view taken along the line BB of the cleaning device shown in FIG. FIG. 5 is an explanatory view showing a state where the cleaning table of the cleaning apparatus shown in FIG. 3 is inverted. FIG. 6 is an explanatory view showing a state where the cleaning table of the cleaning apparatus shown in FIG. 4 is inverted. FIG. 7 is a schematic flow of the cleaning process of the cleaning apparatus according to the first embodiment. FIG. 8 is a diagram illustrating a schematic configuration example of a processing apparatus according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
FIG. 1 is a diagram illustrating a schematic configuration example of the cleaning apparatus according to the first embodiment. FIG. 2 is a plan view of the cleaning apparatus shown in FIG. 3 is a cross-sectional view taken along the line AA of the cleaning device shown in FIG. 4 is a cross-sectional view taken along the line BB of the cleaning device shown in FIG. As shown in FIGS. 1 to 4, the cleaning apparatus 1 according to the first embodiment includes a cleaning table 10, a cleaning unit 20, a moving unit 30, and a reversing unit 40. In the cleaning apparatus 1, the cleaning table 10 and the respective means 20, 30, 40 are arranged in the housing 2. As shown in FIG. 2, the cleaning device 1 is connected to a cleaning liquid supply source 50, an air supply source 60, a driving air supply source 70, and a vacuum suction source 80. The cleaning apparatus 1 cleans the surface of the workpiece W by spraying a cleaning liquid from the cleaning means 20 toward the workpiece W while holding the workpiece W on the cleaning table 10. The housing 2 has a lid 3 that covers the upper portion of the housing 2, and the lid 3 has an opening 3 a having a size that does not interfere with the workpiece W when the workpiece W is attached or detached. Is formed.

Here, the workpiece W is not particularly limited, but for example, a plate-like semiconductor wafer or optical device wafer based on silicon, gallium arsenide (GaAs) or the like, ceramic, glass, sapphire (Al ₂ O _3). ) -Based plate-like inorganic material substrates, plate-like ductile materials such as metals and resins, and other various processing materials. In the present embodiment, the workpiece W has an adhesive tape T (also referred to as a dicing tape) attached to the back surface where devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) are not formed. The adhesive tape T is also fixed to the frame F by being attached to the annular frame F.

  As shown in FIG. 2, the cleaning table 10 has a disk shape in which a portion constituting the holding surface 11a which is the surface of the holding portion 11 is formed of porous ceramic or the like, and the workpiece placed on the holding surface 11a. W is sucked and held by the vacuum suction source 80. For example, the cleaning table 10 can suck and hold a workpiece W having a diameter of 450 mm. In the cleaning table 10, the main body 12 including the outer peripheral portion that is flush with the holding surface 11a is made of stainless steel or the like. The cleaning table 10 includes a plurality of magnets 13 that are magnetically attached to the frame F, and the plurality of magnets 13 are disposed on an outer peripheral portion that is flush with the holding surface 11a. The cleaning table 10 has a first rotating shaft 14 and a second rotating shaft 15 that are parallel to the holding surface 11a and extend in the diameter direction of the holding surface 11a, and can be turned upside down by the rotating shafts 14 and 15. is there. The 1st rotating shaft 14 and the 2nd rotating shaft 15 are opposingly arranged on both sides of the holding surface 11a. As shown in FIG. 3, the first rotating shaft 14 and the second rotating shaft 15 are rotatably supported by the wall portion 4 a of the cleaning chamber 4. The second rotary shaft 15 has a vacuum suction path 15a penetrating in the axial direction, one end communicating with the holding unit 11 side, and the other end communicating with the vacuum suction source 80 side.

  Here, as shown in FIGS. 2 to 4, the cleaning chamber 4 has a rectangular wall portion 4 a surrounding the cleaning table 10, and a funnel shape inclined downward from the lower end side of the wall portion 4 a toward the central portion side. Bottom part 4b. The wall portion 4a is formed with a first flange portion 4c and a second flange portion 4d, and a first slit portion 4e and a second slit portion 4f. The flange portions 4c and 4d are formed so as to protrude from the wall portion 4a facing each other and parallel to the X-axis direction into the cleaning chamber 4, and are disposed to face each other with the cleaning table 10 interposed therebetween. Each flange 4c, 4d is parallel to the X-axis direction and is formed across the entire width of the opposing wall 4a in the X-axis direction. Moreover, each collar part 4c, 4d suppresses that a washing | cleaning liquid leaks from each slit part 4e, 4f. The first slit portion 4e is formed to be opened below the first flange portion 4c, and the second slit portion 4f is formed to be opened below the second flange portion 4d. Each slit part 4e, 4f is parallel to the X-axis direction, and is formed over almost the entire width of the wall part 4a facing each other in the X-axis direction. Further, a water curtain nozzle 21 described later is inserted into each slit portion 4e, 4f so as to be able to reciprocate in the X-axis direction.

  As shown in FIGS. 2 and 3, the cleaning means 20 is disposed below the cleaning table 10. The cleaning means 20 includes a cylindrical water curtain nozzle 21, faces the workpiece W held on the holding surface 11 a directed downward, and jets a cleaning liquid to clean the workpiece W. The water curtain nozzle 21 has an ejection port 22 that ejects the cleaning liquid in a range exceeding the diameter of the workpiece W. One end of the water curtain nozzle 21 is inserted through the first slit 4e, and the other end is inserted through the second slit 4f. The water curtain nozzle 21 is movable in parallel (X-axis direction) in the cleaning chamber 4 by the first support member 21a disposed at one end and the second support member 21b disposed at the other end. It is supported. The water curtain nozzle 21 is connected to a cleaning liquid supply path 23 to which a cleaning liquid is supplied and an air supply path 24 to which a gas is supplied, and the cleaning liquid and the gas are mixed like a so-called two-fluid nozzle. It can also be ejected in a state, and only cleaning liquid can be ejected or only gas can be ejected. The jet port 22 is, for example, a slit-like hole opened in the axial direction of the water curtain nozzle 21 and is a hole opened over a range exceeding the diameter of the workpiece W. The cleaning liquid ejected from the ejection port 22 is ejected from the ejection port 22, and after the surface of the workpiece W is cleaned, it is discharged from the drain 5 provided in the bottom portion 4 b of the cleaning chamber 4.

  2 and 3, the moving means 30 includes a first moving block 31 that supports the first supporting member 21a, a second moving block 32 that supports the second supporting member 21b, and a first moving block 31. A first guide pipe 33 that guides the second moving block 32 in the X-axis direction, and a first guide pipe 33 that guides the second moving block 32 in the X-axis direction. The moving means 30 makes the water curtain nozzle 21 parallel to the surface of the workpiece W held on the holding surface 11a of the cleaning table 10 facing downward (in the X-axis direction) with the jet port 22 facing. Move. The first moving block 31 has an insertion hole through which the first guide pipe 33 is inserted, and the second moving block 32 has an insertion hole through which the second guide pipe 34 is inserted. , 32 are magnetic bodies. The first moving block 31 is inserted through the first guide pipe 33, and the second moving block 32 is inserted through the second guide pipe 34. Each guide pipe 33, 34 has a hollow cylindrical shape. The first guide pipe 33 is provided with a first bracket 35 at one end and a second bracket 36 at the other end. The second guide pipe 34 is provided with a third bracket 37 at one end and a fourth bracket 38 at the other end. The brackets 35 and 36 of the first guide pipe 33 are abutting members that abut against the first moving block 31. The brackets 37 and 38 of the second guide pipe 34 are abutting members that abut against the second moving block 32. The first guide pipe 33 is inserted with a magnet (not shown) that can be reciprocated by driving air, and magnetizes the magnet and the first moving block 31. A first communication path 39 a is connected to the first bracket 35, and the first guide pipe 33 and the first communication path 39 a communicate with each other via the first bracket 35. A second communication path 39b is connected to the second bracket 36, and the first guide pipe 33 and the second communication path 39b communicate with each other via the second bracket 36. That is, the first guide pipe 33 is a so-called rodless air cylinder. Similarly, the second guide pipe 34 may be a so-called rodless air cylinder. In this case, the water curtain nozzle 21 can be moved more smoothly.

  As shown in FIG. 4, the reversing unit 40 includes a motor 41 and a belt 42 that is wound around the drive shaft 41 a of the motor 41 and the second rotating shaft 15. The reversing unit 40 rotates the second rotating shaft 15 by the driving force of the motor 41 to invert the cleaning table 10 upside down. Further, the reversing means 40 has a rotation angle detecting means (not shown) for detecting the rotation angle of the cleaning table 10, and can, for example, reverse the cleaning table 10 at any desired angle. Any motor 41 may be used as long as the cleaning table 10 can be turned upside down, that is, can rotate about 180 degrees (including 180 degrees) around the rotation shafts 14 and 15. Relative to a high output large motor for rotating the large washing table 10 capable of sucking and holding the object W around the Z axis (1000 to 3000 rpm), a relatively low output, small size and low cost Can be used.

  As shown in FIG. 2, the cleaning liquid supply source 50 supplies a cleaning liquid such as pure water to the water curtain nozzle 21 via the cleaning liquid supply path 51. The cleaning liquid supply path 51 has one end connected to the cleaning liquid supply source 50 and the other end connected to the cleaning liquid supply path 23. The cleaning liquid supply path 51 has an open / close valve 52. The on-off valve 52 is, for example, a spring return normally closed type (open type when energized) having a single-acting solenoid.

  The air supply source 60 supplies a gas such as air to the water curtain nozzle 21 via the air supply path 61. The air supply path 61 has one end connected to the air supply source 60 and the other end connected to the air supply path 24. The air supply path 61 has an open / close valve 62. The on-off valve 62 is, for example, a spring return normally closed type (open type when energized) having a single-acting solenoid.

  The driving air supply source 70 supplies driving air to the first guide pipe 33 via the driving air supply path 71, the switching valve 72, the first communication path 73a, or the second communication path 73b. One end of the driving air supply path 71 is connected to the driving air supply source 70, and the other end is connected to the switching valve 72. The first communication path 73 a has one end connected to the switching valve 72 and the other end connected to the first bracket 35. The second communication path 73 b has one end connected to the switching valve 72 and the other end connected to the second bracket 36. The switching valve 72 is, for example, a spring-centered normal all-port block type (open when energized) directional control valve (4 ports, 3 positions) having single-acting solenoids on both sides. When one solenoid is energized, the switching valve 72 causes the driving air supply path 71 and the first communication path 73a to communicate with each other, the second communication path 73b to communicate with the outside, and driving air is supplied from the first communication path 73a. The first guide pipe 33 is supplied. Further, when the other solenoid is energized, the switching valve 72 causes the driving air supply path 71 and the second communication path 73b to communicate with each other, the first communication path 73a to communicate with the outside, and the driving from the second communication path 73b. Air is supplied into the first guide pipe 33.

  The vacuum suction source 80 is connected to the vacuum suction path 15 a of the second rotating shaft 15 through the vacuum suction path 81. The vacuum suction path 81 has an open / close valve 82. The on-off valve 82 is, for example, a spring return normally closed type (open type when energized) having a single-acting solenoid.

  The cleaning device 1 according to the first embodiment has the above-described configuration. Hereinafter, the cleaning process of the cleaning device 1 according to the first embodiment will be described with reference to FIGS. 3 to 7. FIG. 5 is an explanatory view showing a state where the cleaning table of the cleaning apparatus shown in FIG. 3 is inverted. FIG. 6 is an explanatory view showing a state where the cleaning table of the cleaning apparatus shown in FIG. 4 is inverted. FIG. 7 is a schematic flow of the cleaning process of the cleaning apparatus according to the first embodiment.

  First, the cleaning apparatus 1 flips the cleaning table 10 upside down as shown in FIGS. 3, 4, and 7 based on a cleaning instruction by a worker such as an operator (step ST <b> 1). Specifically, the cleaning apparatus 1 drives the motor 41 based on the rotation angle of the cleaning table 10 detected by a rotation angle detection unit (not shown) of the reversing unit 40, and rotates the second rotation shaft 15 by this motor 41. By driving, the cleaning table 10 is rotated around the rotary shafts 14 and 15 to be turned upside down. Note that the cleaning apparatus 1 energizes the solenoid of the on-off valve 82 of the vacuum suction path 81 before executing the above-described step ST1, that is, when the workpiece W is placed on the cleaning table 10, and turns on the on-off valve 82. The workpiece W is attracted and held on the holding surface 11a by the vacuum suction source 80, and the workpiece W is cleaned by magnetizing the frame F on the outer peripheral portion flush with the holding surface 11a. It is fixed to the table 10.

  Next, the cleaning apparatus 1 ejects the cleaning liquid L from the water curtain nozzle 21 as shown in FIGS. 5, 6, and 7 (step ST2). Specifically, the cleaning apparatus 1 energizes the solenoid of the on-off valve 52 of the cleaning liquid supply path 51 to open the on-off valve 52, and the cleaning liquid L such as pure water is supplied from the cleaning liquid supply source 50 with a pump (not shown). By supplying the cleaning liquid L to the supply path 23 and supplying the cleaning liquid L to the water curtain nozzle 21, the cleaning liquid L is ejected from the ejection port 22 in a range exceeding the diameter of the workpiece W. In addition, the cleaning apparatus 1 cleans the workpiece W by causing the cleaning liquid L to be ejected from the ejection port 22 of the water curtain nozzle 21 facing the workpiece W held on the holding surface 11a directed downward.

  Next, the cleaning apparatus 1 moves the water curtain nozzle 21 (step ST3). Specifically, the cleaning device 1 ejects the cleaning liquid L from the ejection port 22 and causes the ejection port 22 to be directed to the surface of the workpiece W held on the holding surface 11a of the cleaning table 10 directed downward. The water curtain nozzle 21 is moved in parallel (X-axis direction) while facing each other. More specifically, the cleaning device 1 drives compressed air or the like from the driving air supply source 70 by energizing one solenoid of the switching valve 72 of the driving air supply path 71 to open the switching valve 72. Supply air is supplied to the first communication path 73a. The driving air supplied to the first communication path 73 a is supplied from one end side of the first guide pipe 33 via the first bracket 35. On the other hand, driving air is discharged from the other end of the first guide pipe 33 via the second bracket 36, and driving air is discharged to the outside from the second communication path 73b. For this reason, the magnet inserted in the 1st guide pipe 33 is moved from the 1st bracket 35 side to the 2nd bracket 36 side, and the water curtain nozzle 21 moves with the movement of a magnet. That is, the magnet inserted in the first guide pipe 33, the first moving block 31 magnetically attached to the magnet, and the first support member 21 a supported by the first moving block 31 include the first bracket 35. The water curtain nozzle 21 moves from the first bracket 35 side to the second bracket 36 side. The cleaning device 1 moves the water curtain nozzle 21 until the first moving block 31 hits the second bracket 36.

  Next, the cleaning apparatus 1 moves the water curtain nozzle 21 from the second bracket 36 side to the first bracket side 35 while ejecting the cleaning liquid L from the ejection port 22. Specifically, the cleaning device 1 detects one of the switching valves 72 of the driving air supply path 71 based on a detection signal of a detection unit (not shown) that detects that the first moving block 31 has hit the second bracket 36. The current to the solenoid is shut off and the other solenoid is energized to switch the flow of driving air. Accordingly, driving air is supplied from the driving air supply source 70 to the second communication path 73 b, and driving air is supplied from the other end side of the first guide pipe 33 via the second bracket 36. On the other hand, driving air is discharged from one end side of the first guide pipe 33 through the first bracket 35, and driving air is discharged to the outside from the first communication path 73a. For this reason, the magnet inserted in the 1st guide pipe 33 is moved from the 2nd bracket 36 side to the 1st bracket 35 side, and the water curtain nozzle 21 moves with a movement of a magnet. That is, the magnet inserted into the first guide pipe 33, the first moving block 31, and the first support member 21a move from the second bracket 36 side to the first bracket 35 side, and the water curtain nozzle 21 moves to the first position. 2 Move from the bracket 36 side to the first bracket 35 side. The cleaning apparatus 1 moves the water curtain nozzle 21 until the first cleaning block 31 hits the first bracket 35.

  Next, the cleaning apparatus 1 determines whether or not the cleaning time has passed a predetermined time (step ST4). Here, the cleaning device 1 compares the time required for cleaning (required cleaning time) stored in a storage means (not shown) with the time elapsed since the start of the ejection of the cleaning liquid L (elapsed time), and the elapsed time is required. By determining that the cleaning time has elapsed, it is determined that the predetermined time has elapsed. In addition, the said required cleaning time is set based on the cleaning test by an actual machine, for example.

  The cleaning apparatus 1 causes the cleaning liquid L to be ejected from the water curtain nozzle 21 until the predetermined cleaning time has elapsed (No in step ST4). The cleaning apparatus 1 moves the water curtain nozzle 21 toward the first bracket 35 while ejecting the cleaning liquid L from the water curtain nozzle 21 from step ST4 to step ST5 described later, and the water curtain nozzle 21. The movement to the second bracket 36 side is repeated alternately.

  Further, when the cleaning device 1 determines that the cleaning time has passed the predetermined time (Yes in step ST4), the cleaning device 1 stops the injection of the cleaning liquid L (step ST5) and jets the gas from the water curtain nozzle 21 (step ST6). . Specifically, the cleaning device 1 determines that the cleaning time has passed a predetermined time, cuts off the energization to the solenoid of the on-off valve 52 of the cleaning liquid supply path 51, closes the on-off valve 52, and supplies the cleaning liquid L. Stop supplying. In addition, the cleaning device 1 energizes the solenoid of the opening / closing valve 62 of the air supply path 61 to open the opening / closing valve 62, supplies a gas such as air from the air supply source 60 to the air supply path 24, and the water curtain By supplying the gas to the nozzle 21, the gas is ejected from the ejection port 22 in a range exceeding the diameter of the workpiece W. The cleaning device 1 moves the water curtain nozzle 21 toward the first bracket 35 while ejecting gas from the water curtain nozzle 21 from step ST6 to step ST8 described later, 2 The movement to the bracket 36 side is repeated alternately.

  Next, the cleaning apparatus 1 determines whether or not the drying time has passed a predetermined time (step ST7). Here, the cleaning device 1 compares the time necessary for drying (necessary drying time) stored in a storage means (not shown) with the time elapsed since the start of gas ejection (elapsed time), and the elapsed time requires drying. By elapse of time, it is determined that the drying time has passed a predetermined time. In addition, the said required drying time is set based on the drying test by an actual machine, for example.

  Cleaning device 1 ejects gas from water curtain nozzle 21 until the drying time passes a predetermined time (No in step ST7).

  Next, when it is determined that the drying time has passed the predetermined time (Yes in Step ST7), the cleaning device 1 stops the gas ejection (Step ST8), and moves the water curtain nozzle 21 to the predetermined position (Step ST9). ), The cleaning table 10 is turned upside down (step ST10). Specifically, the cleaning device 1 determines that the drying time has passed a predetermined time, cuts off the energization to the solenoid of the on-off valve 62 of the air supply path 61, and closes the on-off valve 62 to supply gas. Stop. Further, the cleaning apparatus 1 energizes the other solenoid of the switching valve 72 of the driving air supply path 71 so that the cleaning table 10 and the water curtain nozzle 21 do not interfere when the cleaning table 10 is turned upside down again. Is switched off and one solenoid is energized to switch the flow of driving air. Further, the cleaning apparatus 1 moves the water curtain nozzle 21 toward the first bracket 35 until the first moving block 31 hits the first bracket 35, and then shuts off the energization to one solenoid of the switching valve 72. Then, the switching valve 72 is set to an all-port block to stop the supply of driving air. In addition, the cleaning device 1 determines that the water curtain nozzle 21 has moved to a predetermined position based on a detection signal from a detection unit (not shown) that detects that the first moving block 31 has hit the first bracket 35. Then, the cleaning apparatus 1 drives the motor 41 of the reversing means 40, rotates the second rotating shaft 15 by the motor 41, rotates the cleaning table 10 around each rotating shaft 14, 15, and reverses it upside down. Further, the cleaning apparatus 1 makes the holding surface 11a parallel to the XY plane based on the rotation angle of the cleaning table 10 detected by a rotation angle detection unit (not shown), and ends the cleaning process.

  As described above, according to the cleaning apparatus 1 according to the first embodiment, the cleaning unit 20 disposed below the cleaning table 10 is provided by inverting the cleaning table 10 holding the workpiece W up and down around the X axis. Since the workpiece W facing the cleaning means 20 can be cleaned by the cleaning means 20. Accordingly, since the workpiece W can be cleaned without rotating around the Z axis, the cleaning table 10 holding the workpiece W need not be rotated around the Z axis.

  Further, since the cleaning apparatus 1 does not need to rotate the workpiece W around the Z axis, the cleaning table 10 having a large diameter and capable of sucking and holding the 450 mm workpiece W is arranged around the Z axis. A high output and expensive motor for high speed rotation is not required. That is, the cleaning apparatus 1 can use a relatively small and inexpensive motor 41 that can turn the cleaning table 10 up and down around each of the rotary shafts 14 and 15 (around the X axis), thereby reducing costs. Can do.

  Further, the cleaning apparatus 1 can reduce the weight of the motor 41 by using a relatively small and inexpensive motor 41, and can reduce the area occupied by the motor 41.

  In addition, the cleaning apparatus 1 cleans the workpiece W while holding the workpiece W on the holding surface 11a of the cleaning table 10 directed downward, so that the cleaning liquid L on the surface of the workpiece W is removed. It can be dropped toward the bottom 4b of the cleaning chamber 4 and drainage is good.

  In addition, since the cleaning apparatus 1 ejects the cleaning liquid L in a range exceeding the diameter of the workpiece W, the workpiece W can be cleaned with a relatively large amount of cleaning liquid, so that the cleaning effect is enhanced. it can.

  In the cleaning apparatus 1, the cleaning table 10 can serve as a lid of the cleaning chamber 4 during the cleaning of the workpiece W. Therefore, it is possible to suppress the scattering of the cleaning liquid L during the cleaning of the workpiece W.

  Moreover, the cleaning apparatus 1 can blow and dry the cleaning liquid L on the surface of the workpiece W by ejecting gas from the water curtain nozzle 21. Therefore, the drying time of the workpiece W after cleaning can be shortened.

[Embodiment 2]
Next, the processing apparatus 100 according to the second embodiment will be described. FIG. 8 is a diagram illustrating a schematic configuration example of a processing apparatus according to the second embodiment. The processing apparatus 100 according to the second embodiment is a processing apparatus including the cleaning apparatus 1 according to the first embodiment, and the basic configuration of the cleaning apparatus 1 is the same as that of the cleaning apparatus 1 according to the first embodiment. Description of the structure of the part is omitted.

  The processing apparatus 100 according to the second embodiment shown in FIG. 8 includes a cassette elevator 110, a cassette 120, a temporary placing means 130, a chuck table 140, two processing means 150 and 160, an imaging means 170, and a conveying means. 180 and the washing | cleaning apparatus 1 are comprised. That is, the processing apparatus 100 includes a chuck table 140 that holds the workpiece W on the holding surface 141, processing means 150 and 160 that process the workpiece W held on the holding surface 141 of the chuck table 140, and the embodiment. 1 and at least a transport unit 180 that transports the workpiece W processed by the processing units 150 and 160 from the chuck table 140 to the cleaning device 1. In the present embodiment, the processing apparatus 100 is a facing dual type processing apparatus in which two processing means 150 and 160 are arranged to face each other in the Y-axis direction. The processing apparatus 100 performs processing on the workpiece W by relatively moving the chuck table 140 that holds the workpiece W and the two processing means 150 and 160. The processing apparatus 100 can drive the two processing means 150 and 160 in synchronization, and can drive the two processing means 150 and 160 asynchronously.

  The cassette elevator 110 is movable up and down in the Z-axis direction with respect to the apparatus main body 101. The cassette 120 is moved up and down by the cassette elevator 110 and stores the workpieces W one by one. The temporary placement means 130 temporarily places the workpiece W before and after processing on the pair of rails 131 and 132 temporarily. The chuck table 140 sucks and holds the workpiece W placed on the holding surface 141 by a suction source (not shown), and the X-axis direction with respect to the apparatus main body 101 by an X-axis moving means (corresponding to a processing feed means) (not shown). Move relative to. Further, the chuck table 140 can suck and hold a workpiece W having a diameter of 450 mm.

  The two processing means 150 and 160 include a cutting blade 151, a spindle 152, and a nozzle 153. The two processing means 150 and 160 are arranged in the Y-axis direction with respect to the apparatus main body 101 by Y-axis moving means 154 and 164 (corresponding to index feeding means) and Z-axis moving means 155 and 165 (corresponding to cutting feed means). Relative movement is possible in each of the Z-axis directions. The two processing means 150 and 160 supply cutting water from the nozzle 153 to the workpiece W held on the chuck table 140 based on the image data of the workpiece W imaged by the imaging means 170. Cutting is performed on the region to be machined. The cutting blade 151 is an extremely thin ring-shaped cutting grindstone that cuts the workpiece W held on the chuck table 140 by rotating at a high speed, and is exchangeably fixed to the spindle 152 by a fixing nut (not shown). .

  The imaging unit 170 is, for example, a camera using a CCD (Charge Coupled Device) image sensor, and generates image data for adjusting the alignment of the two processing units 150 and 160 with respect to the workpiece W. The conveying means 180 is a so-called frame conveying means having a chuck means for chucking the frame F, and conveys the workpiece W processed by the two processing means 150 and 160 from the chuck table 140 to the cleaning device 1.

  The cleaning device 1 is the cleaning device according to the first embodiment, and holds the workpiece W on the holding surface 11a, and the rotary shafts 14 and 15 extending parallel to the holding surface 11a and extending in the diameter direction of the holding surface 11a. The cleaning table 10 is configured to be turned upside down by the cleaning table 10, and the workpiece W is disposed below the cleaning table 10 and held on the holding surface 11 a facing downward. Cleaning means 20 for cleaning the workpiece W.

  As described above, according to the processing apparatus 100 according to the second embodiment, the chuck table 140 that holds the workpiece W on the holding surface 141 and the workpiece W that is held on the holding surface 141 of the chuck table 140 are processed. Processing means 150, 160 to be performed, the cleaning apparatus 1 according to the first embodiment, and a transport means 180 for transporting the workpiece W processed by the processing means 150, 160 from the chuck table 140 to the cleaning apparatus 1. The workpiece W can be cleaned in a state where the workpiece W is held on the holding surface 11a of the cleaning table 10 directed downward. In other words, the processing apparatus 100 can clean the workpiece W without rotating the workpiece W around the Z axis, and thus it is not necessary to rotate the workpiece W around the Z axis. Therefore, the processing apparatus 100 does not require a high-power and expensive motor for rotating the large-diameter and very heavy cleaning table 10 capable of sucking and holding the 450 mm workpiece W around the Z axis at high speed.

  In the first and second embodiments, while the workpiece W is being cleaned, the cleaning chamber 4 is covered with the cleaning table 10, but the opening 3a of the cleaning device 1 may be covered with a cover means. Thereby, scattering of the cleaning liquid L can be further suppressed.

  Further, while the workpiece W is being cleaned, the holding surface 11a of the cleaning table 10 is parallel to the XY plane, but the holding surface 11a may be oblique to the XY plane. That is, since the cleaning liquid L is ejected from the ejection port 22 in a range exceeding the diameter of the workpiece W, the cleaning can be sufficiently performed even when the holding surface 11a is oblique to the XY plane. Thereby, it is not necessary to strictly control the rotation angle when the cleaning table 10 is turned upside down, and the configuration of the turning means 40 can be simplified.

  In addition, the rotation direction of the motor 41 when the cleaning table 10 is turned upside down (before cleaning) and the rotation direction of the motor 41 when the table is turned upside down again (after cleaning) are the same direction even if they are opposite. Also good. Thereby, rotation control of the motor 41 can be simplified.

  Further, the cleaning liquid L in the cleaning chamber 4 may be sucked and discharged from the drain 5. As a result, the cleaning liquid L does not accumulate in the cleaning chamber 4 and the splashing of the cleaning liquid L can be suppressed.

  Further, any cleaning liquid L may be used as long as the cleaning liquid L can be ejected in a range exceeding the diameter of the workpiece W. As the water curtain nozzle 21, a flow velocity is obtained from a nozzle that ejects the cleaning liquid L in a number of spots or a thin slit. It is also possible to use a so-called water knife nozzle capable of ejecting a fast liquid. Thereby, various forms of nozzles can be used.

  Moreover, the cleaning liquid L can be applied to the workpiece W from the water curtain nozzle 21 at a high speed by mixing the cleaning liquid and the gas like a so-called two-fluid nozzle. Thereby, the cleaning effect can be further enhanced.

  In the second embodiment, the facing dual type processing apparatus 100 in which the two processing means 150 and 160 are arranged to face each other has been described. However, the parallel dual type in which the two processing means 150 and 160 are arranged in parallel is described. It may be a processing device or a processing device having one processing means. Of course, it may be a grinding device for grinding the workpiece held on the chuck table.

DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 10 Cleaning table 11a Holding surface 14 1st rotating shaft (rotating shaft)
15 Second rotation axis (rotation axis)
DESCRIPTION OF SYMBOLS 20 Cleaning means 21 Water curtain nozzle 22 Jet nozzle 30 Moving means 100 Processing apparatus 140 Chuck table 141 Holding surface 150 One processing means (processing means)
160 Other processing means (processing means)
180 Conveying means L Cleaning liquid W Workpiece

Claims (3)

A cleaning device for cleaning a workpiece,
A cleaning table configured to hold the workpiece on a holding surface and to be vertically inverted by a rotation shaft extending in parallel to the holding surface and extending in the diameter direction of the holding surface;
A cleaning apparatus comprising: a cleaning unit that is disposed below the cleaning table and faces the workpiece held on the holding surface facing downward, and jets a cleaning liquid to clean the workpiece. The cleaning means includes
A water curtain nozzle having a jet outlet for jetting the cleaning liquid in a range exceeding the diameter of the workpiece;
Moving means for moving the water curtain nozzle in parallel with the jet port facing the surface of the workpiece held on the holding surface of the cleaning table directed downward. The cleaning apparatus according to claim 1.   A chuck table for holding a workpiece on a holding surface, a processing means for processing the workpiece held on the holding surface of the chuck table, a cleaning device according to claim 1 or 2, and the processing means. A processing apparatus comprising at least transporting means for transporting the processed workpiece from the chuck table to the cleaning device.

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