JP2002075944A - Device for soaking substrate in liquid and method of soaking and treating substrate in liquid - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a means which enhances the treatment capacity to a substrate without increasing the time required for substrate treatment. SOLUTION: A substrate washer for washing a substrate after CMP treatment is equipped with a submerged loader 10. The submerged loader 10 has a tank 12, and a cassette C which has stored a substrate W before washing by brush is soaked in pure water reserved in a tank 12. An ultrasonic diaphragm 30 is arranged at the outside surface of the sidewall 12A of the tank 12. The ultrasonic vibration generated from this ultrasonic diaphragm 30 is transmitted to the sidewall 12A and the surface of the substrate W by the pure water within the tank 12. A pure water supply nozzle 31 is arranged on the inner surface of the sidewall 12A, and it forms a water stream going from the sidewall 12A to the substrate W within the tank 12. Hereby, the transmission efficiency of the ultrasonic vibration is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a submerged substrate immersion apparatus and a submerged substrate immersion processing method for performing a process on a substrate after a CMP (Chemical Mechanical Polishing) process.
The substrates to be processed include various substrates such as semiconductor wafers, glass substrates for liquid crystal display devices and plasma displays, and substrates for optical and magneto-optical disks.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device, a CMP process for flattening a surface of a semiconductor wafer (hereinafter simply referred to as "wafer") (a surface of the wafer itself or a surface of a thin film formed on the surface of the wafer). May be performed. Since a slurry (abrasive) is used in the CMP process, a substrate cleaning process for removing the slurry on the wafer is required before the next step.

[0003] A substrate cleaning apparatus for this purpose includes, for example, an underwater loader for immersing unprocessed wafers in water and discharging the wafers one by one, and a wafer discharged from the underwater loader. A double-sided cleaning unit that scrubs both sides of the wafer, a surface cleaning unit that precisely cleans the surface of the wafer after the scrub cleaning with a revolving brush, and a water-washing / drying method that rinses the wafer after the surface-cleaning processing, and further drains and dries. Unit.

[0004]

In the substrate cleaning apparatus, if further improvement in cleaning performance is desired, it is necessary to add a cleaning unit in addition to the double-sided cleaning unit and the surface cleaning unit. However, when the cleaning unit is added, the time required for the cleaning process for one wafer is lengthened, so that there is a problem that productivity is deteriorated. Therefore, an object of the present invention is to provide a submerged substrate immersion apparatus and a submerged substrate immersion processing method which provide means for improving the processing capability (particularly, cleaning capability) of a substrate without increasing the time required for substrate processing. It is.

[0005]

Means for Solving the Problems and Effects of the Invention According to the first aspect of the present invention, there is provided an apparatus for immersing a substrate (W) in a liquid, wherein the substrate (W) after the CMP treatment is immersed in a liquid. , 80), wherein a liquid tank (12) for storing a liquid and immersing the substrate in the liquid, and the substrate immersed in the liquid stored in the liquid tank, An apparatus for immersing a substrate in a liquid, comprising: an ultrasonic vibration plate (30) for applying ultrasonic vibration via a liquid stored in a tank. It should be noted that the alphanumeric characters in parentheses represent corresponding components in the embodiments described later. Hereinafter, the same applies in this section.

[0006] According to this configuration, the ultrasonic vibration is applied to the substrate immersed in the liquid tank via the liquid stored in the liquid tank. Thus, foreign substances such as slurry adhering to the surface of the substrate after the CMP processing are removed from the substrate surface by ultrasonic vibration. In this way, processing on the substrate can be performed with a simple configuration. The configuration of the present invention can be applied to, for example, a substrate cleaning apparatus for cleaning a substrate after a CMP process. More specifically, the substrate cleaning apparatus includes a submerged loader (for example, a submerged loader) (10) for holding a substrate before processing, and a substrate cleaning unit for cleaning the substrate discharged from the submerged loader. (5
0, 60, 70), the configuration of the present invention can be applied to a submerged loader. That is, by applying ultrasonic vibration to the substrate in the liquid tank (12) of the submerged loader, the ultrasonic cleaning process can be performed on the substrate in standby.

Thus, the cleaning effect on the substrate after the CMP processing can be enhanced without increasing the number of cleaning units. In addition, since the time required for the cleaning process of the substrate does not become long, the productivity does not decrease.
The invention according to claim 2 is the apparatus for immersing a substrate in liquid according to claim 1, wherein the liquid tank stores the aqueous ammonia as the liquid. According to this configuration, since the ultrasonic vibration can be applied to the substrate immersed in the ammonia water, the cleaning effect on the surface of the substrate after the CMP processing can be further enhanced.

The invention according to claim 3 further includes a substrate holding mechanism (11, C) for aligning and holding a plurality of substrates in the liquid tank in a substantially parallel manner. 3. The submerged substrate immersion apparatus according to claim 1, wherein the substrate is immersed in the substrate so as to generate ultrasonic vibrations from a direction along a surface of the substrate held by the holding mechanism. . According to this configuration, in the liquid tank, the plurality of substrates are held in a state of being substantially aligned in parallel. Since the ultrasonic vibration is applied in a direction parallel to the substrate, the ultrasonic vibration from the ultrasonic vibration plate is not blocked by another substrate. Thereby, ultrasonic vibration can be satisfactorily applied to a plurality of substrates.

The invention according to claim 4 further comprises a liquid flow forming means (31) for forming a liquid flow in a direction from the ultrasonic vibration plate toward the substrate in the liquid tank. Item 4. An apparatus for immersing a substrate in a liquid according to any one of Items 1 to 3. With this configuration, the ultrasonic vibration can more reliably reach the substrate by the action of the liquid flowing from the ultrasonic vibration plate to the substrate. The invention according to claim 5 is a step of immersing the substrate (W) after the CMP processing in a liquid and a step of applying ultrasonic vibration from the ultrasonic vibration plate (30) to the substrate through the liquid. And a substrate immersion treatment in a liquid.

According to this method, the effects described in relation to the first aspect can be achieved. This method can also be modified in the same manner as described in connection with the submerged substrate immersion apparatus.

[0011]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a simplified plan view showing an internal configuration of a substrate cleaning apparatus to which a submerged substrate immersion apparatus according to an embodiment of the present invention is applied. This substrate cleaning device uses CMP (chemical mechanical polishing).
This is an apparatus for cleaning a processed substrate (for example, a semiconductor wafer) W. The surface of the substrate W after the CMP process has C
Particles such as a slurry (abrasive) used in the MP treatment are attached. The slurry must be removed from the surface of the substrate W before the next process in a manufacturing process of a semiconductor device, a crystal display device, or the like. FIG. 1 shows a substrate cleaning apparatus for removing the slurry.

In this substrate cleaning apparatus, an underwater loader 10 and an unloader 23 are arranged behind a front panel 21. The underwater loader 10 is for holding a plurality of substrates W after the CMP processing and paying out the substrates W one by one. The cassette C containing a plurality of the substrates W before the CMP processing is placed in a water tank. 12 can be immersed in the water stored. In addition, the unloader 23
A cassette 27 in which the substrates W cleaned by the substrate cleaning device are stored can be placed.

The substrate cleaning apparatus is transported through a substantially U-shaped path 40 from the underwater loader 10 to the unloader 23 in plan view, and in the process, a cleaning process and a drying process are performed. I have. That is, along the path 40, the double-sided brush cleaning unit 50, the surface brush cleaning unit 60, and the water cleaning / drying processing unit 70 are sequentially arranged from the underwater loader 10 which is the submerged substrate immersion apparatus according to the embodiment of the present invention. Are located.

Further, on the path 40, the underwater loader 10
Transfer robot 4 between the printer and the double-sided brush cleaning unit 50
1, a first intermediate transfer robot 81 is disposed between the double-sided brush cleaning unit 50 and the surface brush cleaning unit 60, and a second intermediate transfer robot 81 is disposed between the surface brush cleaning unit 60 and the water washing / drying processing unit 70. The transfer robot 82 is disposed, and the unloader transfer robot 42 is disposed between the washing / drying processing unit 70 and the unloader 23. That is, the transfer of the substrate W between the processing units from the underwater loader 10 to the unloader 23 is performed by the transfer robots 41, 81, 82, and 40, so that the substrate W moves in the U-shaped path 4.
While being conveyed, it is subjected to processing such as double-sided brush cleaning, surface cleaning, and water washing / drying processing, and is accommodated in a cassette 27 arranged in the unloader 23.

The loader transport robot 41 disposed adjacent to the underwater loader 10 receives one substrate W from the underwater loader 10 and transfers it to the double-sided brush cleaning unit 50. The loader transport robot 41 includes a lower arm LA rotatable along a horizontal plane, and an upper arm UA provided at a tip of the arm LA so as to be rotatable along a horizontal plane.
And a bending-stretching robot having the following. That is, when the lower arm LA rotates, the upper arm UA
In a direction opposite to the rotation direction of the lower arm LA, the lower arm LA
The rotation angle is twice as large as the rotation angle. Thereby, the lower arm LA and the upper arm UA are
A contracted state in which both arms overlap one another vertically, and an extended state in which both arms are deployed toward the underwater loader 10 or the double-sided brush cleaning unit 50 along the path 40 can be taken.

Since the first intermediate transfer robot 81 and the second intermediate transfer robot 82 are configured in the same manner as the loader transfer robot 41, each part of these robots 81 and 82 has the corresponding part of the loader transfer robot 41. It will be denoted by reference numerals, and description thereof will be omitted. The unloader transfer robot 42 includes a bending / stretching robot constituted by a pair of upper and lower arms 43 and 44, and a path 4 extending through the bending / stretching robot.
It is configured by combining a linear transport mechanism (not shown) for reciprocating linear movement along 0 and an elevating mechanism (not shown) for elevating the bending / stretching robot. That is, the lower arm 44 of the bending and stretching robot is rotatable along a horizontal plane, and the upper arm 43 is mounted at the tip of the lower arm 44 so as to be rotatable along the horizontal plane. . And the lower arm 44
Is rotated, the upper arm 43 is configured to rotate by twice the rotation angle of the lower arm 44 in a direction opposite to the rotation direction of the lower arm 44. The entire bending and stretching robot is held by the elevating mechanism, and the elevating mechanism is supported by a carriage (not shown) of the linear transport mechanism. The linear transport mechanism may be, for example, a ball screw mechanism.

FIG. 2 is a simplified perspective view showing a configuration related to the underwater loader 10. As shown in FIG. The underwater loader 10 includes an elevating stage 11 on which the cassette C can be placed while being positioned by the positioning member 15, a water tank 12 capable of submerging the cassette C mounted on the elevating stage 11, An elevating drive mechanism 13 for elevating the stage 11 and a pure water shower nozzle 14 for supplying pure water to the substrate W held in the cassette C from above the elevating stage 11 are provided. In this case, the elevating stage 11 and the elevating drive mechanism 13 constitute a cassette elevating mechanism.

The water tank 12 is filled with pure water, and the substrate W in the cassette C can be immersed in pure water by lowering the elevating stage 11 by the elevating drive mechanism 13. In addition, by lifting the lifting stage 11 by the lifting drive mechanism 13, the lifting stage 11 can be guided to a raised position above the water surface in the water tank 12. The lifting drive mechanism 13 includes, for example, a ball screw mechanism 13a and a motor 13b for applying a driving force to the ball screw mechanism 13a.

When the substrate W is taken out by the loader transport robot 41, the elevation drive mechanism 13 raises the elevation stage 11 to raise the substrate W to be processed to a predetermined height. Thereafter, the substrate W is taken out by the upper arm UA of the loader transfer robot 41. Thereafter, the elevating drive mechanism 13 lowers the elevating stage 11, and immerses the substrate W in the cassette C in pure water in the water tank 12 and waits until the next substrate W is taken out.

When the cassette C is loaded into the substrate cleaning apparatus, the elevating stage 11 is at a position above the water tank 12. The pure water shower nozzle 14 starts supplying pure water promptly after the cassette C is inserted, so that the substrate W in the cassette C placed on the elevating stage 11 is dried. Can be prevented. Cassette C
Has a plurality of shelves (substrate accommodating portions) formed at regular intervals on its inner wall surface, whereby a plurality of substrates W are arranged substantially in parallel at regular intervals along the vertical direction. It can be held by.

In the water tank 12, the substrate W is removed from the cassette C.
An ultrasonic vibration plate 30 is arranged on the outer surface of the side wall 12A on the substrate removal direction side (ie, the loader transfer robot 41 side) when removing the substrate. This ultrasonic vibration plate 30
Auxiliary water tank 17 is formed along side wall 12A so as to surround. FIG. 3 is an illustrative view for explaining a configuration related to the ultrasonic vibration plate 30. Ultrasonic vibration plate 30
Is attached in close contact with the outer surface of the side wall 12A.
Thereby, the ultrasonic vibration generated from the ultrasonic vibration plate 30 is transmitted to the side wall 12A of the water tank 12, and
Via the pure water stored in 2, it is transmitted to the substrate W immersed in this pure water. The ultrasonic vibration plate 30 has the side wall 12
By being attached to the outer surface of A, ultrasonic vibrations are transmitted from the direction parallel to the surface to the substrate W held in parallel and arranged in a substantially horizontal posture. Therefore, the ultrasonic vibration applied to each substrate W reaches each surface without being interrupted by the other substrates W. As a result, ultrasonic vibration with little attenuation is applied to each substrate W. as a result,
Foreign matter such as slurry adhering to the surface of the substrate W is efficiently removed from the surface of the substrate W by the vibration of the substrate W and pure water in the vicinity thereof.

A pure water supply nozzle 31 for discharging pure water toward the substrate W immersed in pure water in the water tank 12 is provided on the inner surface of the side wall 12A. In this embodiment, a plurality of pure water supply nozzles 31 are provided at intervals in the depth direction of the water tank 12. The plurality of pure water supply nozzles 31 are supplied with pure water from a pure water supply source 32 via a pure water supply valve 33. The auxiliary water tank 17 is provided with a pure water supply valve 3 from a pure water supply source 32.
4 and pure water supply piping 35, pure water can be supplied.

On the bottom of the water tank 12 and the auxiliary water tank 17,
Drainage pipes 36 and 37 are connected respectively. Drain valves 38 and 39 are interposed in the middle of these drain pipes 36 and 37, respectively. The ultrasonic vibration plate 30 is supplied with electric power from the driver circuit 18. Further, a liquid level sensor 19 for detecting the liquid level in the auxiliary water tank 17 is disposed at a position higher than the upper end of the ultrasonic vibration plate 30 in the auxiliary water tank 17. This liquid level sensor 1
The output of 9 is provided to the controller 25. The controller 25 is configured such that the liquid level sensor 19
It is detected that the liquid level in the auxiliary water tank 17 is equal to or higher than the installation position of the liquid level sensor 19 (that is, the liquid level sensor 19
During the period in which the liquid (pure water) is detected, the power supply from the driver circuit 18 to the ultrasonic vibration plate 30 is performed. This prevents the ultrasonic diaphragm 30 from being operated in a state where no load exists. Controller 25
Further includes pure water supply valves 33 and 34 and a drain valve 3
8, 39 and the operation of the lifting drive mechanism 13 (see FIG. 2) are controlled.

As described above, according to the configuration of this embodiment, in the underwater loader 10 for holding the substrate W before the substrate cleaning processing by the double-sided brush cleaning unit 50 or the like, the substrate W is immersed in pure water in the water tank 12. Ultrasonic waves from the ultrasonic vibration plate 30 can be applied to the plurality of substrates W thus processed. Thereby, while the substrate W is kept on standby in the underwater loader 10, an ultrasonic cleaning process for removing foreign substances on the surface of the substrate W can be performed. Thus, the cleaning capability of the substrate cleaning apparatus can be improved without increasing the number of cleaning units.

Moreover, since the ultrasonic cleaning is performed during the period in which the substrate W is kept on standby, the processing time (processing tact) per substrate does not increase. Therefore, there is no possibility that the productivity is reduced. Further, since the ultrasonic vibration reaches all over the upper and lower surfaces and the end surface of the substrate W, it also removes the dents of the thin film pattern formed on the substrate surface and foreign substances adhering to the end surface of the substrate W. be able to.

In this embodiment, ultrasonic vibrations are transmitted to the substrates W arranged in parallel and held in a direction along the surface of the substrate W. Moreover, in the water tank 12, a water flow in a direction from the ultrasonic vibration plate 30 to the substrate W is formed by the pure water discharged from the pure water supply nozzle 31. With such a configuration, the ultrasonic vibration can be transmitted to the substrate W very effectively. The pure water supply nozzle 31 is always open during the operation of the substrate cleaning apparatus. As a result, pure water is constantly discharged from the pure water supply nozzle 31, so that the substrate W
The water stream heading toward is stably formed. And the water tank 12
Pure water overflows from the four sides at the upper end of the. As a result, the foreign matter removed from the surface of the substrate W is carried out of the water tank 12 by the overflowing pure water. Moreover, the contaminated pure water in the water tank 12 is replaced with fresh pure water supplied from the pure water supply nozzle 31, so that the foreign matter removed from the substrate W does not adhere to the substrate W again.

The pure water supply valve 34 for supplying pure water to the auxiliary water tank 17 is closed when the wall surface of the pure water in the auxiliary water tank 17 reaches the liquid level sensor 19.
It may be opened each time the water level in the chamber 7 becomes lower than the liquid level sensor 19. However, since pure water can be supplied to the auxiliary water tank 17 by overflow of the pure water from the water tank 12, a pure water supply valve 34 and a pure water supply pipe 35 for supplying pure water to the auxiliary water tank 17 are necessarily required. is not.

Next, other components of the substrate cleaning apparatus shown in FIG. 1 will be outlined. The double-sided brush cleaning unit 50 includes:
A plurality of (six in this embodiment) holding rollers 51A,
The end surface of the substrate W (especially a circular substrate) is held by 52A, and the substrate W is rotated in a horizontal plane. At the same time, the upper and lower surfaces of the substrate W are scrubbed by the disk brushes 53 arranged above and below the substrate W. For example, three of the six holding rollers 51A, 52A are held by the holding mechanism 51, and the remaining three holding rollers 52A are held by the holding mechanism 52. The holding mechanisms 51 and 52 can move close to and away from each other. Thus, a state where the substrate W is held and a state where the holding of the substrate W is released can be taken.

The surface brush cleaning section 60 includes a spin chuck 62 that supports the peripheral edge of the back surface of the substrate W with a plurality of (for example, six) holding pins 61. The spin chuck 62 holds the substrate W held horizontally by the holding pins 61.
Is rotated about a vertical axis. Spin chuck 62
A scan brush 63 as a surface scrub cleaning mechanism is provided above the substrate W held on the substrate W. The scan brush 63 includes an oscillating arm 63 </ b> A having a disk type brush that is driven to rotate about a rotation axis along a direction substantially perpendicular to the surface of the substrate W at its tip. As the swing arm 63A swings, the disk-type brush repeatedly reciprocates in a range between the rotation center position of the substrate W and the peripheral edge thereof, thereby cleaning the surface of the substrate W.

The washing / drying processing unit 70 includes a spin chuck 71 for horizontally holding and rotating the substrate W, and a pure water supply nozzle (FIG. 1) for supplying pure water to the substrate W held on the spin chuck 71. (Not shown). With this configuration, water washing is performed while rotating the substrate W at a high speed, and further, the supply of pure water is stopped, and draining / drying is performed to shake off moisture adhering to the front and back surfaces of the substrate W. Above the spin chuck 71, a shielding plate 75 for limiting a space above the substrate W is arranged. This shielding plate 75
An inert gas (for example, nitrogen gas) is supplied to the space between the substrate and the upper surface of the substrate W during drying, thereby improving the efficiency of the drying process.

FIG. 4 is an illustrative sectional view for illustrating the configuration of an underwater loader 80 according to a second embodiment of the present invention. This underwater loader 80 has the structure of FIG.
It should be used in place of the underwater loader 10 described above. In FIG. 4, portions corresponding to the respective portions shown in FIG. 3 described above are denoted by the same reference numerals as in FIG. 3. In this embodiment, the ultrasonic vibration plate 30 is
Is arranged in close contact with the outer surface (that is, the lower surface) of the bottom plate 12B. In order to immerse the ultrasonic vibration plate 30 in pure water, an auxiliary water tank 90 surrounding the ultrasonic vibration plate 30 is formed below the bottom plate 12B. Pure water from a pure water supply source is supplied to the auxiliary water tank 90 via a pure water supply valve 34. The drainage of the auxiliary water tank 90 is performed by the drainage pipe 37 and the drainage valve 39.
It can be done via.

With such a configuration, the ultrasonic vibration plate 3
The ultrasonic vibration generated from the water tank 1 is transmitted to the pure water stored in the water tank 12 through the bottom plate 12B.
2 reaches the substrate W immersed in the pure water. Thus, as in the case of the above-described first embodiment, the ultrasonic cleaning process for removing foreign matter from the surface of the substrate W can be performed while the substrate W is kept on standby by the underwater loader 80. In order to supply pure water to the auxiliary water tank 90, instead of connecting the pure water supply valve 34 and the pure water supply pipe 35 to the auxiliary water tank 90, the water tank 12
An opening may be formed to allow the communication between the and the auxiliary water tank 90. Thereby, since the pure water in the water tank 12 can be guided to the auxiliary water tank 90, the ultrasonic vibration plate 30 can be prevented from being driven in a no-load state as long as the pure water exists in the water tank 12.

Although the two embodiments of the present invention have been described above, the present invention can be embodied in other forms. For example, in the above two embodiments, the ultrasonic vibration plate 30 is disposed on the outer surface of the water tank 12, but the ultrasonic vibration plate 30 is disposed on the inner surface of the water tank 12, and the ultrasonic vibration plate 30 is disposed. May be brought into contact with the pure water in the water tank 12. With this configuration, the ultrasonic vibration generated by the ultrasonic vibration plate 30 can be transmitted to the substrate W more effectively. Thereby, the cleaning efficiency by the ultrasonic vibration can be improved. However, when the elevating stage 11 raises and lowers the cassette C, the liquid surface in the water tank 12 moves up and down. Therefore, when at least a part of the ultrasonic vibration plate 30 appears on the water surface in the water tank 12,
It is preferable to stop driving the ultrasonic vibration plate 30. For example, a liquid level sensor for detecting the liquid level in the water tank 12 is provided at a position corresponding to the height of the upper end of the ultrasonic vibration plate 30, and responds to the fact that the liquid level sensor stops detecting liquid. Then, the driving of the ultrasonic vibration plate 30 may be stopped. Further, when the elevating stage 11 is in the lowered position and the cassette C
Is immersed in pure water in the water tank 12, the water surface in the water tank 12 is at a high position. Therefore, instead of using the liquid level sensor or using the liquid level sensor and only when the cassette C is in the lowered position, the ultrasonic vibration plate 3
0 may be driven.

In the above-described embodiment, pure water is stored in the water tank 12. However, in order to more effectively remove foreign matter on the surface of the substrate W after the CMP processing, for example, ammonia water or the like is used. The chemical may be supplied into the water tank 12. Furthermore, in the above-described embodiment, an example in which the present invention is applied to an underwater loader has been described. However, the present invention can be applied to any apparatus that immerses a substrate after CMP processing in a liquid. Besides, for example, the present invention can be applied to a storage water tank for temporarily storing a substrate after the CMP processing.

In addition, various design changes can be made within the scope of the matters described in the claims.

[Brief description of the drawings]

FIG. 1 is a simplified plan view showing an internal configuration of a substrate cleaning apparatus to which a submerged substrate immersion apparatus according to an embodiment of the present invention is applied.

FIG. 2 is a simplified perspective view showing a configuration related to an underwater loader.

FIG. 3 is an illustrative view for explaining a configuration related to the ultrasonic vibration plate;

FIG. 4 is an illustrative sectional view for explaining a configuration of an underwater loader according to a second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 10 underwater loader 11 elevating stage 12 water tank 12A side wall 12B bottom plate 13 elevating drive mechanism 17 auxiliary water tank 18 driver circuit 19 liquid level sensor 25 controller 30 ultrasonic vibration plate 31 pure water supply nozzle 32 pure water supply source 33 pure water supply valve 34 pure Water supply valve 35 Pure water supply pipe 50 Double-sided brush cleaning unit 60 Surface brush cleaning unit 70 Rinse / dry processing unit 80 Underwater loader 90 Auxiliary water tank C Cassette W Substrate

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 3B201 AA03 AB08 AB23 BA02 BB22 BB42 BB52 BB83 BB87 BB93 CB15 CB22 CC11 4G075 AA30 BB10 BD16 CA23 CA57 DA02 EB01 ED15

Claims (5)

[Claims] 1. A submerged substrate immersion apparatus for immersing a substrate after a CMP process in a liquid, wherein the liquid is stored, and a liquid tank for immersing the substrate in the liquid is stored in the liquid tank. An ultrasonic vibration plate for applying ultrasonic vibration to a substrate immersed in a liquid to be performed via the liquid stored in the liquid tank. 2. The apparatus according to claim 1, wherein the liquid tank stores the aqueous ammonia as the liquid. 3. The apparatus according to claim 1, further comprising a substrate holding mechanism for holding a plurality of substrates in the liquid tank in a substantially parallel arrangement, wherein the ultrasonic vibration plate extends along a surface of the substrate held by the substrate holding mechanism. 3. The submerged substrate immersion apparatus according to claim 1, wherein the substrate is disposed so as to generate ultrasonic vibrations from the direction toward the substrate. 4. A liquid flow forming device according to claim 1, further comprising a liquid flow forming means for forming a liquid flow in a direction from said ultrasonic vibration plate toward said substrate in said liquid tank. Submerged substrate immersion equipment. 5. A liquid comprising: a step of immersing a substrate after a CMP process in a liquid; and a step of applying ultrasonic vibration from an ultrasonic vibration plate to the substrate via the liquid. Medium substrate immersion treatment method.