JP2000183011A - Substrate-rinsing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate-rinsing method, wherein a substrate is washed with less amount of pure water which is used in a short time. SOLUTION: A plurality of substrates W processed in a chemical liquid at a chemical liquid process part are transferred to a rinsing process part 10D, the substrates W are rinsed in a shower, while being swung in the vertical direction so that most of the chemical liquid and particles sticking to the substrate W is rinsed and removed, then the substrate W is submerged into water for rinsing. Thus, while less amount of pure water is used, a substrate is rinsed in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a chemical solution such as a mixed solution of ammonia water and hydrogen peroxide, a mixed solution of hydrochloric acid and hydrogen peroxide, and a mixed solution of sulfuric acid and hydrogen peroxide. The present invention relates to a substrate water washing method for simultaneously performing a water washing process on a plurality of processed substrates.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of a precision electronic substrate (hereinafter, simply referred to as a “substrate”) using a semiconductor wafer for a semiconductor device, a glass substrate for a liquid crystal display, and the like,
After subjecting the substrate to a predetermined chemical treatment with a chemical such as a mixed solution of ammonia water and hydrogen peroxide, a mixed solution of hydrochloric acid and hydrogen peroxide, and a mixed solution of sulfuric acid and hydrogen peroxide And a water washing treatment with pure water. As a method of rinsing the substrate, a method of immersing the substrate in a treatment tank in which pure water is overflowing to wash the substrate, that is, a so-called overflow type substrate rinsing method is conventionally known.

FIG. 7 is a view showing an overflow type substrate washing apparatus. In the substrate washing apparatus 101, pure water 1
A water washing tank 103 for storing 02 is provided.
At the bottom of the washing tank 103, pure water 1 is placed in the washing tank 103.
A pair of left and right nozzles 109 for supplying 02 are provided, and a pure water supply unit (not shown) is connected to these nozzles 109. For this reason, at the time of the water washing treatment of the substrate 104, the pure water is supplied from the pure water supply unit under pressure, and the pure water 102 is supplied from the inner pipe 113 of the nozzle 109 to the water washing tank 103 through the outer pipe 111, and the pure water 102 is supplied to the water. By the continuous supply of water 102,
The pure water 102 overflows through the overflow surface of the upper opening of the washing tank 103.

In this apparatus 101, a plurality of substrates 1
04 while being held by three arm members 107.
There is provided a handling mechanism 105 which moves up and down with respect to the third member 03. Therefore, when the substrate 104, which has been subjected to the chemical treatment by the handling mechanism 105, is immersed in the water washing tank 103 in the overflow state as described above, the substance adhering to the substrate 104 (contaminants generated by the chemical treatment or the chemical treatment ( Particles) drop into the pure water from the surface of the substrate 104, overflow over the overflow surface, are discharged out of the washing tank 103, and the plurality of substrates 104 are collectively washed with water. When the rinsing process is completed as described above, the handling mechanism 105 is raised, and the substrate 104 subjected to the rinsing process is pulled up from the rinsing tank 103.

As a method of collectively rinsing a plurality of substrates, in addition to the above-described overflow type substrate rinsing method, a functional rinsing type substrate rinsing method in which overflow and rapid drainage are sequentially combined has been conventionally used. Are known.

FIG. 8 is a diagram showing a functional water washing type substrate washing apparatus. In the substrate washing apparatus 201, a washing tank 203 for storing pure water 202 is provided. At the bottom of the washing tank 203, a supply port 208 for supplying the pure water 202 is provided at a substantially central portion thereof, and a drain port 209 for discharging the pure water 202 is provided at a side end. The supply port 208 and the drain port 209
Is connected to a supply / drainage unit, not shown.
When the pure water 202 is continuously supplied into the washing tank 203 through the supply port 208 by the supply / drainage unit, the pure water 202 overflows through the overflow surface of the upper opening of the washing tank 203. I have. Also,
Rinse tank 2 through drain port 209 by supply / drain unit
When the drainage of the pure water 202 in 03 starts, the pure water 202 is rapidly drained out of the washing tank 203.

Further, in this apparatus 201, similarly to the overflow type substrate washing apparatus described above, a handling mechanism 205 which moves up and down with respect to the washing tank 203 while holding a plurality of substrates 204 with three arm members 207. By immersing the substrate 204, which has been subjected to the chemical treatment by the handling mechanism 205, into the water washing tank 203 in the overflow state as described above,
Deposits (such as a chemical solution or contaminants (particles) generated by the chemical solution treatment) on the substrate 204 are dropped from the surface of the substrate 104 into the pure water 202. And after immersing the substrate,
The pure water 202 is quickly drained, and the pure water 202 containing the deposit is discharged out of the washing tank 203. Subsequently, the substrate 204
After the pure water 202 is continuously supplied into the washing tank 203 by the supply / drainage unit and overflows while the liquid is kept in the washing tank 203 to remove the deposits from the surface of the substrate 204 into the pure water 202, Once again, the attached matter that has been rapidly drained and dropped is discharged from the washing tank 203 together with the pure water 202. Such a series of operations (overflow and rapid drainage) are repeated several times to quickly wash and remove deposits on the substrate 204.

Further, when the liquid is rapidly drained as described above,
Since the substrate 204 is temporarily exposed to the air and may be partially dried, the shower nozzles 210 are arranged on the left and right sides above the washing tank 203, and only when the liquid is rapidly drained, the shower nozzles 210 are purely removed. By discharging water in a shower shape toward the substrate 204, drying of the substrate 204 is prevented. The amount of pure water discharged from the shower nozzle 210 is limited to a level necessary to prevent the substrate from drying, and the substrate 204 is not substantially washed with the pure water.

When the rinsing process is completed as described above, the handling mechanism 205 is raised, and the substrate 204 subjected to the rinsing process is lifted from the rinsing tank 203.

[0010]

As described above, conventionally, in order to collectively wash a plurality of substrates that have been treated with a chemical solution, a plurality of substrates are filled in the processing tank while overflowing pure water in the processing tank. The substrate is immersed to remove deposits on the substrate. For this reason, a large amount of pure water is required for the water washing treatment, and the treatment time is long. In particular, in the functional water washing method shown in FIG. 8, the overflow is combined with rapid drainage, and although the processing time is somewhat shortened as compared with the overflow water washing method shown in FIG. 7, it is greatly improved. However, there has been a demand for a method of washing a substrate which can be cleaned in a shorter time.

In the functional water washing method shown in FIG. 8, a dedicated shower nozzle 210 is provided to prevent drying of the substrate at the time of rapid drainage. Pure water is required, and the amount of pure water used is increased, which causes a rise in the washing cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a method of washing a substrate with a smaller amount of pure water and in a shorter time. I do.

[0013]

SUMMARY OF THE INVENTION The present invention relates to a method of washing a plurality of substrates which have been subjected to a chemical treatment with a chemical solution with pure water. An oscillating shower rinsing step of supplying pure water in the form of a shower, and an immersion rinsing step of immersing a plurality of substrates in a rinsing tank in which pure water is stored for rinsing.

After performing the immersion washing step,
The oscillating shower water washing step may be performed (claim 2). Further, the storage of the pure water in the washing tank is completed at least until the chemical solution treatment is completed (claim 3).
By doing so, the substrate can be immersed in the washing tank immediately after the chemical treatment, and the time required for the washing treatment can be reduced. Furthermore, by performing the oscillating shower rinsing step in the rinsing tank (claim 4), the rinsing process can be performed efficiently.

[0015]

FIG. 1 is a plan view showing a substrate processing apparatus to which an embodiment of a substrate washing method according to the present invention can be applied. The substrate processing apparatus shown in this figure is an apparatus for immersing a substrate such as a semiconductor wafer or the like in a plurality of types of processing liquids (chemical solution and pure water) at one time, or for supplying pure water in a shower shape to wash the substrate. And a processing unit 1 for performing a series of various processes such as a chemical solution process and a water washing process on the plurality of substrates loaded by the loading unit 2, and a substrate for taking out the substrates after the various processes by the processing unit 1. And a take-out section 3.

A receiving portion 4 for receiving and placing a carrier case containing a substrate is provided in the substrate input section 2, and a carrier case containing the substrate in the receiving portion 4 by a transport device (not shown). It is to be brought in. In the present embodiment, two carrier cases are used.
Five substrates are housed, and each substrate is housed in a carrier case in a line with the surfaces thereof facing each other.

The rear side of the receiving part 4 (upper side in the figure)
Are provided side by side with a standby portion 5 for holding the carrier case until the substrate is carried into the processing unit 1, and the receiving portion 4 and the standby portion 5 beside (left side in FIG. 1).
Is provided with a transfer robot 6.

The transfer robot 6 includes a position Pa facing the receiving portion 4 and a standby portion 5 as shown by a broken line in FIG.
, And is configured to be able to move the carrier case carried into the receiving portion 4 to the standby portion 5.

A substrate unloading mechanism 12 is disposed between the loading section 2 and the processing unit 1 so as to face the standby section 5, and a transfer robot 14 is provided between the standby section 5 and the substrate unloading mechanism 12. Are movably arranged. Transfer robot 1
4 is movable between a position Pd interposed between the standby portion 5 and the substrate unloading mechanism 12 and a position Pc corresponding to the moving end of the shuttle robot 17 on the loading unit 2 side. Substrate unloading mechanism 12
And the shuttle robot 1 from the substrate unloading mechanism 12
7 is configured to deliver the carrier case.

The substrate unloading mechanism 12 has two mounting portions on which the carrier case is mounted, and these mounting portions are provided with arm members having a substrate support at the upper end so as to be able to move up and down. . Then, when the carrier case in which the substrate before processing is stored is set on each mounting portion, the arm member is displaced to the rising end position through the opening formed in the bottom of the carrier case. It is designed to be supported and lifted above the case.

The processing unit 1 has a chuck washing section 10A for washing the chuck of the transfer robot 16a for transferring a plurality of substrates with pure water and then drying the chuck.
Processing units 10B to 10G for performing a series of processes of a chemical solution and a water washing process on the substrate, and a drying unit 10H for drying the substrate are provided in order from the end on the input unit 2 side. The substrate unloading mechanism 12 and the processing units 10A to 10A
Transfer robot 16a that can access the F
A transfer robot 16b that can access F to 10H and a transfer robot 16c that can access the processing unit 10H and the substrate storage mechanism unit 13 are arranged. In this embodiment, the processing units 10B to 10G are configured as follows.

Processing unit 10B: First chemical liquid processing unit (CAR
O processing unit) The processing unit 10B is provided with a processing tank (not shown) for storing a mixed solution of sulfuric acid and a hydrogen peroxide solution (hereinafter, referred to as “CARO”) as a chemical solution.
6a collectively holds the plurality of substrates lifted above the carrier case in the substrate unloading mechanism 12, and then carries the substrates into this processing tank, where the chemical solution processing for the plurality of substrates is performed collectively by CARO.

Processing section 10C: second chemical processing section (CAR
O processing section) The processing section 10C has the same configuration as the processing section 10B, and the substrate unloading mechanism section 1 is moved by the transfer robot 16a.
When the plurality of substrates lifted above the carrier case in 2 are carried into the processing tank provided in the processing unit 10C,
The chemical solution treatment by CARO is performed. Thus, the first and second chemical processing units 10B, which perform the same chemical processing,
10C was provided because of chemical treatment by CARO (CAR
O processing) takes longer time than the other processing units 10D to 10G, so that the CARO processing is performed in parallel to shorten the processing time.

Processing section 10D: Rinse processing section This processing section 10D is a rinsing processing section using the substrate rinsing method according to the present invention, and supplies pure water in a shower shape while oscillating a plurality of substrates W. The oscillating shower rinsing step and the immersion rinsing step of immersing a plurality of substrates in a rinsing tank in which pure water is stored and rinsing with water are combined to perform the chemical treatment in the first or second chemical treatment units 10B and 10C. Substrate W
Cleaning process. In addition, this washing processing part 10D
Is a feature of the present invention, the configuration and operation of the processing unit 10D will be described later in detail.

Processing section 10E: Third chemical processing section (HF-
1 Processing) The processing unit 10E is provided with a processing tank (not shown) for storing hydrofluoric acid (HF) as a chemical solution, and the transfer robot 16a removes a plurality of substrates that have been subjected to the rinsing processing from the rinsing processing unit 10D. After being carried out, when the substrate is carried into a handling mechanism (not shown) of the processing tank, a chemical solution process (HF-1 process) for a plurality of substrates is performed by hydrofluoric acid.

Processing section 10F: Overflow type water washing processing section In this processing section 10F, a water washing tank for storing pure water is provided, as shown in FIG. Pure water is supplied and overflows through the overflow surface of the upper opening of the washing tank. Then, the transfer robot 16a
Transports a plurality of substrates that have been subjected to chemical treatment with hydrofluoric acid from the third chemical treatment unit 10E, and transports the substrates to a handling mechanism (not shown) of the washing tank. Substances (particles, etc.) generated by the chemical treatment with hydrofluoric acid are washed away with water.

Processing section 10G: Overflow type final rinsing section The processing section 10G is an overflow type rinsing section, like the rinsing section 10F.
The transfer robot 16b transfers the substrate having been subjected to the rinsing process at F
Is transported to the handling mechanism (not shown) of the washing tank after being carried out of the washing section 10F.
The remaining deposits which could not be removed by the water washing process are washed away with water and the substrate is subjected to precision water washing process.

When a series of chemicals and water washing processes are completed as described above, the plurality of substrates are transferred to the transfer robot 1.
After being carried out of the final rinsing section 10G by 6b, carried into the drying section 10H and dried, it is further taken out of the drying section 10H by another transport robot 16c and transported above the substrate storage mechanism section 13.

In the substrate storage mechanism 13 to which the substrate has been transported in this manner, like the substrate unloading mechanism 12, two mounting sections for mounting the carrier case, and the lifting and lowering sections provided on these mounting sections. A possible arm member is provided, and is configured to store the processed substrate in a carrier case. Specifically, when the processed substrate is set above the substrate storage mechanism 13 by the transfer robot 16c with an empty carrier case set in each mounting portion, the arm member is displaced to the rising end position. The substrates are collectively supported, and then the arm members are displaced to the lower end position to accommodate the substrates in the respective carrier cases.

The transfer robot 15 includes a substrate storage mechanism 13
And a position Pe corresponding to the moving end of the shuttle robot 17 on the side of the take-out unit 3, and can move from the substrate storage mechanism unit 13 to the take-out unit 3 and from the shuttle robot 17 to the substrate storage unit. It is configured to deliver the carrier case to the mechanism unit 13.

The substrate take-out section 3 is provided with a sending portion 7 on which a carrier case containing the processed substrate is placed, and the sending portion 7 is provided so as to face the substrate storage mechanism 13. ing.

<First Embodiment> Next, the configuration and operation of a water washing section 10D using the first embodiment of the substrate water washing method according to the present invention will be described.

FIG. 2 is a schematic diagram showing a schematic configuration of the water washing section 10D of FIG. In FIG.
0D is a washing tank 21 as a processing tank whose upper side is opened so that a plurality of substrates W can be immersed in pure water stored therein.
A pure water supply unit 22 for supplying pure water for overflow into the washing tank 21; and a lifter 24 as a lifting / lowering means for transporting the plurality of substrates W into the pure water in the washing tank 21 while holding the plurality of substrates W. And a treated solution obtained by performing a rinsing process on a plurality of substrates W in the washing tank 21 (a solution in which pure water is mixed with a chemical solution used in the processing units 10B and 10C in the present embodiment).
A drain unit 25 for rapidly draining water to the outside of the tank, a shower unit 26 for showering pure water toward the substrate W,
Before draining the treated liquid in the washing tank 21 by controlling the drain unit 25, the lifter 24 is controlled so that the upper part of the substrate W is positioned outside the pure water surface in the washing tank 21. And a control unit 27 for raising.

The pure water supply unit 22 includes a washing tank 21.
A pair of cylindrical members 28 disposed facing each other at the bottom of the inside and facing the direction of the substrate W in which a plurality of nozzle openings (not shown) for discharging pure water are immersed; A pipe member 29 connected to the tubular member 28 for passing pure water, and a valve member 30 for adjusting the flow rate provided in the middle of the pipe member 29. By opening the member 30, the pure water is continuously supplied into the washing tank 21 through the pipe member 29 and a plurality of nozzle ports (not shown) of the pair of cylindrical members 28, and the upper part of the washing tank 21 is maintained. Pure water overflows from the opening end 21a, and the chemical solution and particles attached to the surface of the substrate W during the chemical solution treatment are caused to flow out of the tank together with the pure water.

Further, the lifter 24 holds the plurality of substrates W in the groove portions of the three wafer guides 23 from below at predetermined intervals (for example, half pitch P / 2) and holds the plurality of substrates W. The wafer W can be vertically transferred between a rinsing processing position where the substrate W is immersed in pure water as a rinsing liquid and a transfer position where the substrate W is transferred between the rinsing tank 21 and the transfer robot 16a above the rinsing tank 21. ing.

The drain unit 25 is connected to the drain port 31 provided at the lowermost part of the side wall of the washing tank 21 facing the surfaces of the plurality of substrates W to be immersed. A pipe member 32 through which the processed liquid is discharged, and a valve member 33 for adjusting the flow rate disposed in the middle of the pipe member 32.
By opening the opening, the treated liquid in the washing tank 21 can be rapidly drained in a short time, and the valve member 33 is closed at the time of immersion and overflow of the substrate W so that the treated liquid in the washing tank 21 can be removed. It overflows and flows out of the tank.

The shower unit 26 is provided with the washing tank 2.
A plurality of nozzle openings (not shown) for discharging pure water, which are disposed opposite to each other at a position above the upper opening end 21a of the first storage device 1
Are disposed diagonally downward (in the direction of the substrate W), a pair of cylindrical members 34, a piping member 35 connected to the pair of cylindrical members 34, and through which pure water passes, and in the middle of the piping member 35. And a valve member 36 for adjusting the flow rate, and pure water is showered from each nozzle port (not shown) of the tubular member 34 toward the surface of the substrate W, so that the shower water is washed. At the time of rapid drainage, the surface of the substrate W is partially prevented from being exposed to the air, and the growth of a natural oxide film on the surface of the substrate W is suppressed.

Further, the control unit 27 is constituted by a sequencer, a microcomputer, or the like, and includes a lift driving unit (not shown) of the lifter 24 and the valve members 30, 3
3, 36 are connected to the electromagnetic valve control terminals. The valve members 30, 33, and 36 are each controlled to open and close by a control signal from a sequencer or a microcomputer, and are moved up and down with respect to a lift drive unit (not shown) of the lifter 24, so that a series of water washing described later is performed. Processing is performed.

Next, the rinsing operation by the rinsing section 10D constructed as described above will be described with reference to FIGS.
This will be described with reference to FIG. First, the substrate W that has been subjected to the chemical treatment in the processing units 10B and 10C is transferred to the transfer robot 16a (FIG. 1).
Is transferred to the water washing section 10D and is delivered to the lifter 24 (FIG. 3A: substrate loaded state). At this time, the plurality of substrates W are received and held at predetermined intervals by the groove portions of the three wafer guides 23 from below. Before the chemical processing in the chemical processing sections 10B and 10C, which is the preceding step, is completed, the valve member 30 is controlled in accordance with a control signal from the control section 27.
Is controlled to be in an open state, and the valve member 33 is controlled to be in a closed state. ) Is stored in the washing tank 21 and is prepared so that the immersion washing processing can be immediately performed by immersing the substrate W in the washing tank 21.

Subsequent to the loading of the substrate, the lifter 24 is lowered while the plurality of substrates W are supported by the wafer guide 23 as described above, and the 3 is immersed in pure water in the washing tank 21 in the overflow state (see FIG. 3).
(B): immersion water washing treatment). As a result, the pure water overflows from the upper opening end 21a of the washing tank 21, and the chemical liquid attached to the surface of the substrate W during the chemical liquid processing and substances (particles) generated by the chemical liquid processing are washed with pure water and flown out of the tank. put out.

The controller 27 immediately after the immersion of the substrate W,
Alternatively, after controlling so as to overflow for a predetermined time (for example, only for a few seconds), the valve member 30 is controlled to be closed, and the valve member 33 is controlled to be opened to quickly drain the treated liquid from the drain port 31. At the same time, the valve member 36 is controlled to be open, and pure water is showered from each nozzle opening (not shown) of the tubular member 34 of the shower unit 26 toward the surface of the substrate W (FIG. 4).
(A)). With this, the liquid surface 21a of the processed liquid gradually decreases with the rapid drainage of the processed liquid, while the surface of the substrate W is gradually exposed, and pure water from the shower unit 26 is supplied in a shower shape. Then, the shower water washing process is performed. As shown in FIG. 4 (b), this shower rinsing process is continued for a predetermined time, for example, several minutes, even after all of the treated liquid in the rinsing tank 21 is rapidly drained. In parallel with the shower water washing process, the control unit 27 gives a lift up / down swing command to swing the lifter 24 up and down, thereby swinging the substrate W up and down (oscillating shower water washing process). In this embodiment, the substrate W is stationary during the quick drainage, but the substrate W may be swung up and down during the quick drainage.

After these two types of water washing treatments (immersion water washing treatment and swing shower water washing treatment) are successively performed,
The control unit 27 controls the valve member 36 to be in the closed state to stop the supply of pure water to the substrate W by the shower unit 26, and then gives a lift-up command to raise the lifter 24 to the substrate transfer position with the transfer robot 16a. Thus, the substrate W that has been subjected to a series of rinsing processes can be transported to the next processing unit 10E.

After unloading the substrate W from the washing tank 21, the control unit 27 controls the valve member 33 to be closed and opens the valve member 30 to start storing pure water in the washing tank 21. In this manner, pure water is stored in the washing tank 21 before the chemical processing of the substrate W in the chemical processing units 10B and 10C, which is the previous process, is completed, and preparation for the immersion water cleaning processing for the next substrate W is performed.

In the substrate processing apparatus configured as described above, the first or second chemical processing sections 10B and 10C use the CA.
A plurality of substrates W which have been subjected to chemical treatment by RO are washed with a water treatment unit 1
Then, the substrate W is first subjected to a immersion water washing process to wash and remove most of the chemical solution and particles attached to the substrate W, and then the substrate W is further swung up and down. Since the shower water washing is performed, the substrate can be washed with a smaller amount of pure water and in a shorter time. The remarkability of the effect will be described in detail in a later example while showing a specific example and comparing with a comparative example of an overflow method (FIG. 7) and a functional water washing method (FIG. 8).

In the above embodiment, the oscillating shower rinsing is performed after the immersion rinsing, but the order may be changed. That is, the same effect as in the above embodiment can be obtained even when the water washing process is performed by the water washing processing unit 10D in the processing steps shown in FIGS. Hereinafter, another embodiment will be described with reference to these drawings.

<Second Embodiment> In the second embodiment,
First, the substrate W subjected to the chemical treatment in the processing units 10B and 10C
Is transported by the transport robot 16a (FIG. 1) to the rinsing section 10D and delivered to the lifter 24 (FIG. 5 (a): substrate loaded state). At this time, the plurality of substrates W are received and held at predetermined intervals by the groove portions of the three wafer guides 23 from below. It should be noted that the chemical processing section 10B, which is the previous step,
Before the chemical treatment at 10C is completed, the valve member 33 is controlled to be opened according to the control signal from the control unit 27, and the valve member 30 is controlled to be closed to empty the washing tank 21. Keep it.

Following the loading of the substrate, the control unit 27 controls the valve member 36 to be in the open state, and
Pure water is showered from the respective nozzle openings (not shown) of the cylindrical member 34 toward the inside of the washing tank 21 and a lift down command is given to support the plurality of substrates W with the wafer guide 23 as described above. In this state, the lifter 24 is lowered to lower the substrate W together with the wafer guide 23 into the washing tank 21. Then, when the wafer guide 23 reaches the lowermost position, the control unit 27 gives a lift up / down swing command to swing the lifter 24 up and down as shown by a white arrow in FIG. 5B. Then, the substrate W is swung up and down while supplying pure water to the substrate W in the form of a shower (oscillating shower water washing process). As a result, the pure water shower-supplied to the substrate W contains the chemical liquid attached to the surface of the substrate W during the chemical liquid processing and the substances (particles) generated by the chemical liquid processing.
And a drain port 31 provided at the bottom of the washing tank 21
Pour out of the tank through.

In this embodiment, the lowering of the substrate W into the washing tank 21 is started simultaneously with the start of the shower supply of pure water from the cylindrical member 34. The timing is not limited to this, and the substrate W is lowered after a while after the shower supply is started, or conversely, the substrate W is started after the lowering of the substrate W is started.
May be supplied while the wafer W is descending to the lowermost position, or may be supplied when the substrate W is completely located at the lowermost position.

After the swing shower water washing process is continued for a predetermined time, for example, several minutes, the control unit 27 stops the vertical swing operation of the lifter 24 while continuing the shower supply. At the same time, the control unit 27 controls the control valve member 30 to the open state,
By controlling the nozzle 3 to a closed state, pure water is supplied from each nozzle part (not shown) of the pair of cylindrical members 28 of the pure water supply part disposed on both sides of the bottom in the washing tank 21. The liquid level 21a of the washing tank 21 is gradually raised (FIG. 6A). Then, at the time when the liquid level 21a becomes higher than the substrate W, or at any time after that, the control unit 27
6 is controlled to a closed state to stop shower supply. Further, immediately after the liquid level 21a rises and becomes an overflow state, it is possible to overflow immediately or for a predetermined time (for example, only for a few seconds) and to adhere to the liquid (such as a chemical solution or particles) which cannot be washed away by the oscillating shower water washing process. (FIG. 6 (b): immersion water washing treatment).

After performing these two types of water washing treatments (oscillating shower water washing treatment and immersion water washing treatment) continuously,
The control unit 27 gives a lift-up command to raise the lifter 24 to the substrate transfer position with the transfer robot 16a, so that the substrate W that has been subjected to a series of rinsing processes can be transferred to the next processing unit 10E. After unloading the substrate W from the washing tank 21, the control unit 27 controls the valve member 30 to a closed state and opens the valve member 33 to start rapid drainage of the treated liquid from the washing tank 21. . In this way, all the processed liquids are discharged from the washing tank 21 until the chemical processing of the substrate W in the chemical processing sections 10B and 10C, which is the previous process, is completed, and the washing tank 21 is emptied, and the next substrate W is shaken. We are preparing for a dynamic shower rinsing process.

In the substrate processing apparatus configured as described above, the first or second chemical processing sections 10B and 10C use the CA.
A plurality of substrates W which have been subjected to chemical treatment by RO are washed with a water treatment unit 1
0D, and the substrate W is first washed with shower water while swinging the substrate W in the vertical direction.
After washing and removing most of the chemicals and particles adhering to the substrate, the substrate W is further subjected to immersion water washing, so that the substrate can be washed with less pure water and in a short time. Can be. As in the previous embodiment, the remarkability of the effect will be described in detail in a later example, while showing a specific example and comparing with a comparative example of an overflow method (FIG. 7) and a functional water washing method (FIG. 8). Will be described.

By the way, when comparing the two embodiments described above, the "particle level" in the embodiment described later will be described.
As can be seen from reference to the column, the substrate washing method according to the first embodiment (that is, a form in which the immersion washing process is performed, and then the oscillating shower washing process) is performed in the second embodiment. The method is superior to the substrate water washing method according to the embodiment (a mode in which the oscillating shower water washing process is performed and then the immersion water washing process is performed).

The first embodiment can be said to be superior from the viewpoint of not only the washing ability but also the processing efficiency and the prevention of drying of the washing tank 21. In the first embodiment, after the immersion rinsing process is completed, the (washing) shower rinsing process can be immediately performed, whereas in the second embodiment, the oscillating shower rinsing process is performed. 6A, it takes a certain time, for example, about several tens of seconds, to store pure water in the entire washing tank 21 as shown in FIG. 6A. (See “Washing treatment time” and “Pure water usage” in later examples). In the first embodiment, the washing tank 21 is always kept wet with pure water, whereas in the second embodiment, pure water is temporarily supplied to the washing tank 21 when a substrate is carried in. However, there is a possibility that particles may be generated due to the inside of the washing tank 21 being dried, which is not preferable. In order to prevent drying in the second embodiment, for example, storing pure water after completion of the immersion water washing process and before carrying in the next substrate W is an effective means. In the second embodiment in which the dynamic shower rinsing process is performed first, it is necessary to drain the pure water stored in the rinsing tank 21 prior to performing the swing shower rinsing process.
For example, another problem occurs that it takes time for several tens of seconds and the entire processing time becomes longer by that much. In this regard, in the first embodiment, such a problem does not occur at all, and it can be said that this is a more preferable embodiment.

<Modified Embodiment> In the above-described embodiment, CARO adhered to the substrate surface by performing immersion water washing and oscillating shower water washing successively after carrying out chemical treatment using CARO as a chemical, and The substance (particles) generated by the chemical treatment (CARO treatment) is washed away with water, but the chemical is not limited to CARO, and a mixed solution of ammonia water and hydrogen peroxide (SC-1) or In a substrate processing method, a series of rinsing treatments (immersion rinsing treatment + oscillating shower rinsing treatment) is performed after a substrate is treated with a chemical solution using a mixed solution of hydrochloric acid and aqueous hydrogen peroxide (SC-2) or the like. Has the same effect.

In the above embodiment, the substrate W is swung up and down during the swing shower water washing process. However, the swinging direction is not limited to the up and down direction, and the swinging direction is not limited. Just move it.

In the above embodiment, the oscillating shower rinsing process is also performed in the rinsing bath 21 for performing the immersion rinsing process, whereby the substrate rinsing method according to the present invention is applicable. The structure of the portion 10D can be simplified, and the present invention can be applied as it is to a conventional functional washing apparatus as shown in FIG. However, it does not mean that the oscillating shower rinsing process and the immersion rinsing process have to be performed in the same rinsing bath, but different rinsing baths may be prepared and the corresponding rinsing processes may be performed in each rinsing bath. It goes without saying that it is good.

In the above embodiment, hydrofluoric acid (HF)
After the chemical treatment, the overflow type water washing unit 10F performs only the overflow type water washing process, but this water washing unit 10F is subjected to a series of water washing processes (immersion water washing process + swing shower water washing process) in the same manner as the processing unit 10D. ) May be executed, and by adding the oscillating shower water washing process, the amount of pure water used in the processing unit 10F can be reduced, and the processing time can be shortened.

In the above embodiment, the present invention is applied to a so-called carrierless type substrate processing apparatus in which a substrate is taken out from a carrier case and a plurality of substrates are transported by the transport robots 16a to 16c. The object of application is not limited to the carrierless method, but is also applicable to a so-called carrier type substrate processing apparatus that takes out a substrate from a carrier case, transfers the substrate to a dedicated carrier, and transports the substrate with the carrier to each processing unit. The present invention can be applied. Further, the type and number of the processing units constituting the processing unit 1 are not limited to the above embodiment,
After the chemical processing in the chemical processing section is performed, the present invention can be applied to all substrate processing apparatuses having a configuration in which the substrate is transported to the rinsing processing section and washed with water. The same effect as in the above embodiment can be obtained by continuously performing the dynamic shower water washing process.

Further, in the above-described embodiment, the present invention is applied to the apparatus in which a plurality of processing units are provided and the substrate is processed while the substrates are sequentially transferred to the processing units by the transfer robot.
The present invention can also be applied to a so-called one-bath type substrate processing apparatus in which a chemical processing and a water cleaning processing are performed in the same processing unit.

[0060]

EXAMPLES Next, examples of the present invention will be described. However, the present invention is not limited by the following examples, and the present invention can be practiced with appropriate modifications within a range that can conform to the spirit of the preceding and following examples. Of course, it is possible, and all of them are included in the technical scope of the present invention.

Example 1 (Method of Rinsing Substrate According to First Embodiment) The first chemical processing section (CARO) of the substrate processing apparatus shown in FIG.
Processing unit) After performing a chemical treatment by CARO on a 12-inch semiconductor wafer (substrate) in 10B, a water washing processing unit 10D
After being immersed in the overflowing washing tank 21, the treated liquid in the washing tank 21 is immediately drained and quickly swung up and down at a rate of 30 (liter / minute) for 3 minutes. After supplying pure water to the substrate W to be showered, the pure water is pulled up from the processing unit 10D, dried in the drying unit 10H, and the number of particles having a particle size of 0.12 μm or more is checked. Was "20".

Example 2 (Method of Rinsing Substrate According to Second Embodiment) The first chemical processing section (CARO) of the substrate processing apparatus shown in FIG.
Processing unit) After performing a chemical treatment by CARO on a 12-inch semiconductor wafer (substrate) in 10B, a water washing processing unit 10D
First, while oscillating the substrate W, an oscillating shower rinsing process of supplying pure water in a shower at a rate of 30 (liter / minute) for 5 minutes is performed, and then until the substrate W is immersed. Pure water was supplied to the washing tank 21, and immediately after the entire substrate was immersed, the liquid was quickly drained immediately, pulled up from the processing unit 10D, and dried in the drying unit 10H.
When the number of particles was examined, the particle level was "25".

COMPARATIVE EXAMPLE 1 The overflow type substrate washing apparatus of FIG. 7 is arranged at the position of the processing section 10D, and the first chemical processing section (CARO processing section) 10B performs the chemical processing by CARO on a 12-inch semiconductor wafer (substrate). ), The substrate was conveyed to this substrate washing apparatus, and washed with water in the following procedure.

Washing tank 1 at a rate of 30 (liter / min)
03 is supplied continuously. Note that the slow leak is set to 5 (liter / min). After the pure water is stored in the washing tank 103 and overflows, the CARO treatment is performed. The semiconductor wafer is put into the washing tank 103, and is immersed in the overflowing washing tank 103 at a rate of 30 (liter / min) for 15 minutes.

After the completion of the series of washing processes, the semiconductor wafer is lifted from the washing tank 103, and the drying unit 10H
After drying, the number of particles having a particle size of 0.12 μm or more was examined.
0 ".

COMPARATIVE EXAMPLE 2 The substrate washing apparatus of the functional water washing system shown in FIG. 10 is arranged at the position of the processing section 10D, and the first chemical liquid processing section (CARO processing section) 1
After subjecting the 12 inch semiconductor wafer (substrate) to a chemical solution treatment by CARO at 0B, the wafer is transferred to the substrate washing apparatus,
Water washing was performed in the following procedure.

Pure water is supplied to the washing tank 203 and the washing tank 2 is supplied.
After the pure water is stored in the semiconductor wafer 03, the semiconductor wafer which has been subjected to the CARO treatment is further washed with the pure water supply to make the overflow state.
, At a rate of 30 (liter / min), and continue the overflow state for 1 minute.
When pure water is drained from the washing tank 203, the rapid drainage is stopped again, the pure water is stored in the washing tank 203, and then pure water is supplied. The supply is continued to make an overflow state. The above-mentioned processes (1) to (5) are repeated five times.

After such a series of washing processes are completed, the semiconductor wafer is lifted from the washing tank 203 and the drying unit 10H
After drying, the number of particles having a particle size of 0.12 μm or more was examined.
0 ".

In the above Examples 1, 2 and Comparative Examples 1 and 2, the processing time required from the loading of the substrate to the completion of the rinsing processing, the amount of pure water used, and the particle level after the processing are summarized in the following table. It is as follows.

[0070]

[Table 1]

As is clear from the table, according to Examples 1 and 2, the semiconductor wafer (substrate) can be cleaned with a smaller amount of pure water and in a shorter time.
Excellent effects can be obtained with respect to Comparative Example 2. Also,
Even when comparing the particle levels after the treatment, the amount of pure water used and the treatment time are smaller than those of the comparative example,
According to Examples 1 and 2, it is clear that the particle level can be reduced, and a more precise washing effect can be obtained.

Further, by comparing Examples 1 and 2 in the same table, as described above, the substrate processing method according to the first embodiment is more preferable than the substrate processing method according to the second embodiment. You can see that.

[0073]

As described above, according to the substrate washing method of the present invention, a swing shower washing step of supplying pure water in the form of a shower while swinging a plurality of substrates, and storing the pure water. Since the substrate is cleaned by immersing a plurality of substrates in a rinsing bath and immersing the substrate in a rinsing step, the substrate can be cleaned with a smaller amount of pure water and in a shorter time. In particular, if the oscillating shower rinsing step is performed after the immersion rinsing step, the amount of pure water used and the processing time can be minimized, which is more preferable.

[Brief description of the drawings]

FIG. 1 is a plan view showing a substrate processing apparatus to which an embodiment of a substrate washing method according to the present invention can be applied.

FIG. 2 is a schematic diagram illustrating a schematic configuration of a water washing section in FIG. 1;

FIG. 3 is a view schematically showing a substrate rinsing operation in the rinsing processing section of FIG. 2;

FIG. 4 is a view schematically showing a substrate rinsing operation in the rinsing processing section of FIG. 2;

FIG. 5 is a view schematically showing a method for washing a substrate with water according to a second embodiment.

FIG. 6 is a view schematically showing a method for washing a substrate with water according to a second embodiment.

FIG. 7 is a diagram showing an overflow type substrate washing apparatus.

FIG. 8 is a diagram showing a functional water washing type substrate washing apparatus.

[Explanation of symbols]

 10B, C: Chemical treatment unit 10D: Rinse treatment unit 21: Rinse tank 22 ... Pure water supply unit 23 ... Wafer guide 24 ... Lifter 25 ... Drain unit 26 ... Shower unit 27 ... Control unit 28 ... Cylindrical member 29 ... Piping Member 30, 33, 36 ... Valve member 31 ... Drainage port 32 ... Piping member 33 ... Valve member 34 ... Cylindrical member 35 ... Piping member 36 ... Valve member W ... Substrate

Claims (4)

[Claims] 1. A substrate washing method for washing a plurality of substrates treated with a chemical solution with a chemical solution with pure water, comprising: a swing shower water washing step of supplying pure water in a shower shape while swinging the plurality of substrates; A immersion rinsing step of immersing a plurality of substrates in a rinsing tank in which water is stored and rinsing with water. 2. The method according to claim 1, wherein the oscillating shower rinsing step is performed after the immersion rinsing step is performed. 3. The substrate washing method according to claim 2, wherein the storage of the pure water in the washing tank is completed at least until the chemical treatment is completed. 4. The method according to claim 1, wherein the oscillating shower rinsing step is performed in the rinsing tank.