JPH05109684A - Semiconductor substrate immersion treatment system - Google Patents

Abstract

PURPOSE:To form the size of a device into a compact structure by a method wherein the device is provided with an intermediate tank with a chemical treating tank housed therein, a cap for opening and shutting the upper surface of the intermediate tank and rinsing and drying parts, which are provided over the intermediate tank. CONSTITUTION:An intermediate tank 2 is installed in an outermost tank 4 and a chemical treating tank 1 installed in the tank 2, A cap 3 for opening and shutting the upper opening of the tank 2 is mounted to the tank 2. A plurality of rinsing nozzles 5 for rinsing semiconductor wafers 6 in a carrier 7 carried in the tank 4 over the 2 are provided on the inner sidewall of the tank 4. The cap 3 first opened and the carrier 7 with a plurality of the wafers 6 housed therein is held by a chuck 8 and is moved in the tank 1. A immersion treatment is performed for a prescribed time and the carrier 7 is pulled over. Then, the cap 3 is shut, purse water is discharged on the carrier 7 through the nozzles 5 and a rinsing is performed. After that, the carrier 7 is transferred to a drying part. Thereby, the size of a device can be formed into a compact structure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus used in a chemical immersion treatment process in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, a semiconductor substrate dipping treatment apparatus of this type has a plurality of chemical baths 11 and a washing bath 1.
2 and one drying unit 13 are horizontally arranged on a straight line.

A carrier 7 accommodating a plurality of semiconductor substrates (hereinafter referred to as wafers) is set in a loader section, the carrier 7 is chucked by a transfer robot 10, and a dipping process is sequentially performed according to each mode. The carrier 7 was transported to the unloader section to process the wafer.

[0004]

In the conventional apparatus, the chemical solution tank, the washing tank, and the drying section are arranged horizontally in a straight line, so that the apparatus for a process requiring a plurality of chemical solutions has a large apparatus size. It was a problem in layout.

An object of the present invention is to provide a semiconductor substrate dipping device having a compact device size.

[0006]

In order to achieve the above object, a semiconductor substrate dipping apparatus according to the present invention has an outermost tank, an intermediate tank, a chemical treatment tank, and a water washing section. Is an apparatus for dipping treatment, in which the outermost tank integrally houses an intermediate tank, a chemical solution processing tank, and a water washing section,
The intermediate tank has a lid for accommodating the chemical treatment tank therein and for opening and closing the opening of the tank. The chemical treatment tank receives the semiconductor substrate with the lid of the intermediate tank opened and treats the substrate. The water washing section is for washing the semiconductor substrate pulled up from the chemical treatment tank with water.

Further, the outermost tank has a drying section for drying the semiconductor substrate washed in the water washing section.

Further, the semiconductor substrate dipping device is set as one unit, and a plurality of the units are connected so that a plurality of chemical liquid treatments can be performed by a single facility.

[0009]

The function of the immersion treatment and the mechanism of washing with water are integrated into one structure.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

In FIG. 1, the intermediate layer 2 is installed in the outermost tank 4, and the chemical treatment tank 1 is installed in the intermediate layer 2.

A lid 3 for opening and closing the upper opening of the intermediate layer 2 is attached to the intermediate layer 2.

Further, on the inner side wall of the outermost tank 4, a semiconductor substrate (wafer) in the carrier 7 carried in the information of the intermediate layer 2 is loaded.
A plurality of water washing nozzles 5 for performing water washing 6 are provided.

Next, the operation will be described.

First, the lid 3 is opened, the carrier 7 accommodating a plurality of wafers 6 is held by the chuck 8 and moved into the chemical liquid processing tank 1. Immersion treatment is performed for a predetermined time, and the carrier 7 is pulled up.

Next, the lid 3 is closed, and pure water is discharged from the water washing nozzle 5 onto the carrier 7 to wash it with water. After that, the carrier 7 is conveyed to a drying unit (not shown).

(Embodiment 2) FIG. 2 is a sectional view showing Embodiment 2 of the present invention.

In this embodiment, a plurality of N ₂ nozzles are added to the inner wall of the outermost tank 4, and the heated N ₂ is sprayed onto the wafer 6 after washing with water to dry it.

In this embodiment, since the drying function is provided, the size of the apparatus can be further reduced.

In FIG. 3, the structure shown in the second embodiment is regarded as one unit U, and a plurality of the units U are connected and arranged.

According to the present embodiment, it is possible to process a plurality of chemicals, and the size of the apparatus becomes compact.

[0023]

As described above, according to the present invention, an intermediate tank containing a chemical treatment tank, a lid for opening and closing the upper surface of the intermediate tank,
By providing the upper part of the intermediate tank with the water washing and drying part, there is an effect that the device size can be made compact.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a plan view showing an apparatus in which a plurality of units according to the second embodiment of the present invention are connected.

FIG. 4 is a plan view showing a conventional device.

[Explanation of symbols]

1 chemical treatment tank 2 intermediate tank 3 lid 4 outermost tank 5 water washing nozzle 6 semiconductor substrate (wafer) 7 carrier 8 chuck 9 N ₂ nozzle 10 transfer robot 11 chemical liquid tank 12 water washing tank 13 drying section

Claims (3)

[Claims] 1. An apparatus for dipping a semiconductor substrate, comprising an outermost tank, an intermediate tank, a chemical treatment tank, and a water washing section, wherein the outermost tank is an intermediate tank, a chemical treatment tank, and a water washing tank. The intermediate tank contains the chemical solution processing tank inside and has a lid that opens and closes the opening of the tank. The chemical solution processing tank is in a state in which the lid of the intermediate tank is open. The semiconductor substrate dipping treatment apparatus is characterized in that the semiconductor substrate is received by and treated with the semiconductor substrate, and the water washing section is for washing the semiconductor substrate withdrawn from the chemical treatment tank with water. 2. The semiconductor substrate dipping apparatus according to claim 1, wherein the outermost tank has a drying unit for drying the semiconductor substrate washed with the water washing unit. apparatus. 3. The semiconductor substrate dipping device according to claim 1 or 2 is defined as one unit, a plurality of the units are connected, and a plurality of chemical liquid treatments are performed by a single facility. Semiconductor substrate immersion treatment equipment.